ADLINK Technology Inc.
ADLINK Technology Inc. (TAIEX:6166) leads edge computing, the catalyst for a world powered by artificial intelligence. ADLINK manufactures edge hardware and develops edge software for embedded, distributed and intelligent computing– more than 1600 customers around the world trust ADLINK for mission-critical success. ADLINK contributes to open source, robotics, autonomous, IoT and 5G standards initiatives across 24+ consortiums, driving innovation across industries. For over 25 years, with 1800+ ADLINKers and 200+ partners, ADLINK enables the technologies of today and tomorrow, advancing technology and society around the world.
- +886-3-216-5088
- +886-3-328-5706
- service@adlinktech.com
- No. 66, Huaya 1st Rd.,
Guishan Dist.
Taoyuan City, 333411
Taiwan, Province of China
Categories
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Intelligent Data Sharing Platform for Business Crtitical Internet of Things (IoT) Applications
ADLINK DDS
ADLINK DDS is a ubiquitous data sharing software framework based on the open and proven DDS standard that supports a wide range of device technologies, operating systems and programming languages. Combining deterministic data delivery, system-wide data sharing and support for data analytics, ADLINK DDS helps system integrators, OEMs, device platform vendors and Cloud service providers (SaaS, PaaS and DaaS) deliver software solutions for many vertical markets, including: Aerospace and Defense, Energy, Robotics, Healthcare, Transportation / Automotive and Industrial Automation.
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Single/Dual Intel® Movidius™ Myriad™ X MA2485 embedded VPU Module
EDL-mPCIe-MA2485
The EDL-mPCIe-MA2485 PCIe mini-card features Intel® Movidius™ Myriad™ X VPU, providing an easy and flexible solution for computer vision and deep learning acceleration. Able to solve complex AI hardware design challenges, it enables integration of vision-based accelerators and inference engines to implement deep learning solutions at the edge.
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400 W 6U CompactPCI Hot-Swappable Redundant Power Supply
cPS-H640/48
- PICMG® 2.11 CompactPCI® Power Interface compliant- 6U CompactPCI® 8HP form factor- PICMG® 2.11 47-pin CompactPCI® in-rack power module interface- 400 W DC output, maximum 480 W peak output
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6U CompactPCI Processor Blades
A comprehensive line of 6 U CompactPCI computers to the embedded board market.
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32-CH EtherCAT I/O Terminal Base For M-Type Modules
ECAT-TB32-M-DIN
The ECAT-TB32-M-DIN is a 32-channel EtherCAT I/O Terminal Base designed specifically for ADLINK's M-Type EtherCAT IO Slave Modules. This terminal base unit serves as a foundational component for enabling communication and interaction with various peripheral devices through the EtherCAT protocol.
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COM-HPC
The PCI Industrial Computer Manufacturers Group (PICMG) is now entering the final stages in the development of the new COM-HPC computer-on-module specification that will address the needs of the very high end of the industrial edge computing market.
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M.2 2280 SATA SSD for Industrial Embedded Applications
M.2 2280 SATA SSD Series
ADLINK’s industrial M.2 2280 SATA SSD Series with SATA 6Gb/s interface and ultra-compact size makes it suitable for applications in embedded systems and industrial platforms. ADLINK’s industrial M.2 2280 SATA SSD offers a wide operating temperature range of from -40°C to 85°C. Capacities of up to 1TB are available, and read/write speeds of up to 550MB/sec and 500MB/sec respectively are supported.
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Embedded System Supporting MXM Graphics Module with 8th/9th Generation Intel® Core™ i7/i5/i3 in LGA1151 Socket
DLAP-3000-CF Series
ADLINK provides an optimized, highly-available computing platform with expandability options, including the MXM cards. The DLAP-3000-CF series platforms support performance-hungry workloads (e.g., deep learning) with active cooling for applications requiring very high levels of computing in a limited space. DLAP-3000-CF Series features: - Smallest Embedded GPU Platform (3 liters) - Reliable MXM GPU Design with Low TDP - Scalable Graphics Processing Ranging from Pascal to Turing GPUs
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Intel Atom® E3930 and Movidius™ Myriad™ X-Based Industrial AI Smart Camera Starter Kit
NEON-1000-MDX Series Kit
- Integration of intel E3930 and Movidius Myraid X, image sensor and vision software suites, ready to deploy- All-in-one design minimizes cabling, footprint and maintenance- FPGA base DI/O for accurate real-time triggering- Validated and comprehensive accessories, saves effort on surveying and debug
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LEC-Starterkit with LEC-BASE 2.0 Carrier, SD Card and ATX Power Supply (without LEC Module and Cooling Solution), Optional LVDS Display
LEC-Starterkit 2.0
The LEC-Starterkit 2.0 consists of a SMARC 2.0 compliant LEC-BASE 2.0 carrier board, data media, an AC/DC adapter, power cords and is suitable for LEC-AL, LEC-BT, LEC-BTS or LEC-BW modules.
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COM Express Type 10 Reference Carrier Board
miniBASE-10R
The COM Express approach of custom carrier combined with off the shelf system cores is an excellent solution when you need to customize but lack the time or quantity for a complete redesign. It fits most system integration projects with production volumes from 500 to 10,000 pcs per year. The COM Express concept has a great many advantages over full custom designs, it reduces engineering complexity, lowers the threshold for total project quantity and last but not least brings your product to the market in no time. The average time to design a carrier board is less than half the time of a full custom OEM board.
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COM Express Compact Size Type 6 Module with Mobile 7th Gen Intel® Core™ and Celeron® Processors (formerly codename: Kaby Lake)
cExpress-KL
The cExpress-KL is a COM ExpressR COM.0 R2.1 Type 6 Compact size module featuring the 64-bit 7th Generation Intel® Core™ i7/i5/i3 and IntelR CeleronR Ultra-Low TDP processors (formerly "Kaby Lake U") with CPU, memory controller, graphics processor and I/O hub on a single chip.
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Qseven® Standard Size Module With Intel® 6th Gen. Atom® X6000 Processors (Formerly Elkhart Lake)
Q7-EL
The ADLINK Q7-EL is a Qseven module that supports Intel Atom® x6000 (x6425RE, x6414RE, x6413E) processors (formerly Elkhart Lake) with integrated Intel® UHD graphics and high-speed interfaces. With mechanical dimensions of 70mm width, 70mm length, and 2.3mm of overall height, Qseven ranks as one of the smallest COM standards currently available. Q7-EL modules support up 16GB LPDDR4 memory, up to 256GB eMMC storage and are also available with rugged operating temperature range and low power envelope, making them a perfect match for mission critical fanless edge computing applications that require safety and reliability at all times.
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DSP-Based 4/8-Axis Advanced Motion Controllers
PCI-8254/8258
ADLINK's new PCI-8254 and PCI-8258 incorporate up-to-date floating-point DSP and FPGA technology to provide high-speed and high performance hybrid analog and pulse-train motion command. Leveraging ADLINK Softmotion technology, the PCI-8254/PCI-8258 offer more comprehensive and application-oriented motion functions to reduce the development time but maintain superior throughput and accuracy. Also delivered is excellent synchronous motion control performance.
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COM Express Compact Size Type 6 Module with 6th Gen Intel® Core™ i7/i5/i3 and Celeron® 3955U Processors (formerly codename Sky Lake)
cExpress-SL
The cExpress-SL is a COM Express® COM.0 R2.1 Type 6 Compact size module featuring the 64-bit 6th Generation Intel® Core™ i7/i5/i3 and Intel® Celeron® Ultra-Low TDP processors (formerly Sky Lake-U") with CPU, memory controller, graphics processor and I/O hub on a single chip. Leveraging the benefits provided by the 6th generation Intel® Core™ and Celeron® System-on-Chip, the cExpress-SL is specifically designed for customers who need optimum processing and graphics performance with suitable power consumption using Intel® Configurable TDP in a long product life solution.






















