ADLINK Technology Inc.
ADLINK Technology Inc. (TAIEX:6166) leads edge computing, the catalyst for a world powered by artificial intelligence. ADLINK manufactures edge hardware and develops edge software for embedded, distributed and intelligent computing– more than 1600 customers around the world trust ADLINK for mission-critical success. ADLINK contributes to open source, robotics, autonomous, IoT and 5G standards initiatives across 24+ consortiums, driving innovation across industries. For over 25 years, with 1800+ ADLINKers and 200+ partners, ADLINK enables the technologies of today and tomorrow, advancing technology and society around the world.
- +886-3-216-5088
- +886-3-328-5706
- service@adlinktech.com
- No. 66, Huaya 1st Rd.,
Guishan Dist.
Taoyuan City, 333411
Taiwan, Province of China
Categories
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product
32-CH Isolated DIO Card
LPCIe-7230
ADLINK LPCIe-7230 is 32-CH isolated input and/or card. It provides a 2,500 C optical isolation protection. Two wide input range of the LPCIe-7230 makes it easy to sense the status of external devices. The non-polarity characteristic is suitable for a wide variety of industry applications. The LPCIe-7230 devices also feature a wide output range from 5 to 35 V, which is suitable for relay driving and industrial automations applications. The LPCIe-7230 also provides two interrupt sources on digital input channels, which are easily user configurable.
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6U CompactPCI 10 Gigabit Ethernet Switch Blade
cPCI-6S10
- ARM Cortex-A9 processor integrated in Broadcom BCM56150 switch- 24-port fully managed Gigabit Ethernet switch- Pre-installed ADLINK PacketManager accelerates packet processing- Layer 2/3 switching with advanced support for VLANs, QoS and IPv6- Two 10 Gigabit Ethernet SFP+ uplink ports- Supports IPMI based on PICMG 2.9 (System Management Specification)
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Ultimate Performance Gaming Platform Based on 7th Generation Intel® Core™ Processors Supports up to 11x Independent Displays Including 4K UHD
ADi-SA1X-KB
- Ultimate " all-in-one" gaming platform- The best-in-class graphics capabilities in games with high levels of detail- Up to 11x independent HD monitors supporting 4K UHD- Advanced security feature set and software solutions- Intelligent middleware shortens development time- Various power supply options- Low-power consumption
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6U CompactPCI 9th/8th Gen Intel® Core™ I3/i5/i7 Processor Blade
cPCI-6640 Series
The ADLINK cPCI-6640 is a 6U CompactPCI® processor blade featuring an 8th/9th Gen Intel® Core™ (formerly Coffee Lake-H) with Mobile Intel® CM246 Chipset. Dual SO-DIMM slots provide up to 64GB of DDR4-2666 dual-channel memory (2x 32GB modules). ECC memory is also available when paired with a supporting CPU.
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3.5" Single Board Computer With 13th Gen Intel® Core™ I7/i5/i3/ Celeron® Processor
SBC35-RPL
SBC35-RPL is powered by Intel's latest processors, which offer improved performance, power efficiency, and support for the latest technologies based on Intel's 13th generation of 3.5-inch Single Board Computers (SBCs) offer a range of advanced features and capabilities for a variety of embedded applications.
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Fanless Robotic Controller with Intel® Xeon®/Core™ Processor
ROScube-I
ADLINK ROScube-I is a real-time ROS 2 enabled robotic controller based on Intel® Xeon® 9th Gen Intel® Core™ i7/i3 and 8th Gen Intel® Core™ i5 processors featuring exceptional I/O connectivity supporting a wide variety of sensors and actuators for unlimited robotic applications. Also supported are Intel® VPU and NVIDIA GPU cards for computation of AI algorithms and inference. The extension box allows for convenient functional and performance expansion. ROScube-I supports the full complement of resources developed with ADLINK Neuron SDK, a perfect platform for development of industrial use service robotic applications such as autonomous mobile robots (AMR) and autonomous mobile industrial robots (AMIR).
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SMARC® 2.1 Short Size Module With NXP I.MX95
LEC-IMX95
ADLINK LEC-IMX95, based on the powerful NXP i.MX95 (6x Arm Cortex-A55 + 1x Arm Cortex-M7 + 1x Arm Cortex-M33) processor with an integrated ISP and eIQ Neutron Neural Processing Unit (NPU) operating at up to 2 TOPS., is the latest SMARC revision 2.1 compliant module. It combines power-efficient high-performance compute, immersive Arm® Mali™-powered 3D graphics, innovative NXP NPU accelerator for machine learning, and high-speed data processing with safety and security features.
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1 PICMG® CPU, 1 PCI-E® x16, 1 PCI-E® x4, 10 PCI™ Slots Backplane
EBP-13E2
- Segment: 1- Slots: 1 PICMG® CPU, 1 PCI-E® x16, 1 PCI-E® x4, 10 *PCI™- Support ATX power supplies- Dimension: 330 mm x 318 mm
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COM Express® Compact Size Type 2 Module with Intel Atom® E3800 Series or Intel® Celeron® Processor SoC (formerly codename: Bay Trail)
cExpress-BT2
The cExpress-BT2 is a COM Express COM.0 R2.1 Type 2 module supporting Intel Atom® processor E3800 Series and Intel® Celeron® N2930/J1900 processor SoC (codename: Bay Trail).
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2 PICMG® CPU, 10 PCI™, 4 ISA Slots Backplane
HPCI-15S10
- Segment: 1- Slots: 2 PICMG® CPU, 10 PCI™, 4 ISA- Supports AT, ATX power supplies- Dimensions: 317 mm x 264.2 mm
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8-CH Analog Input Module
ND-6017
ADLINK's NuDAM data acquisition modules make up a total acquisition network and control system. Up to 256 NuDAM modules an be romotely controlled on any RS-485 network from a host computer, via a single serial RS-232, allowing communication from as far as 4000 feet from the host. Based on the RS-485 multi-drop network system, each module has a unique address ID, whereby simple ASCII command & response protocols through the standard RS-485 interface can control all the NuDAM modules in the RS-485 network. The NuDAM modules provide direct communications with a wide variety of sensors, perform all signal conditioning, scaling, linearization and conversion, and can acquire measurements of temperature, pressure, flow, voltage, current, and multiple digital signal types.
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2U 19” Edge Server with Intel® Xeon® Scalable Silver/Gold Processors for 5G MEC Infrastructure Deployment
MECS-7210
The MECS-7210 Edge Server focuses on the edge of 5G networks to provide an open, white box platform for 5G Open RAN, private 5G networks, and a wide range of 5G MEC applications including smart cities, retail, manufacturing, autonomous vehicles, Argument Reality(AR), virtual reality(VR) and healthcare. As one of the first NGC-Ready validated and OTII compliant edge servers, the MECS-7210 is designed to meet stringent requirements by delivering a high level of deployment flexibility, reliability, scalability, and carrier-grade processing performance further augmented by hardware expansion. With a 420mm system depth in a small footprint 2U chassis, all I/O front access, wide operating temperature support (-5°C to +55°C), and dual FHFL PCIe expansion slots reserved for access to acceleration hardware such as GPU, FGPA and QAT adapters, ADLINK’s MECS-7210 is a high performance COTS platform that meets varying application and deployment requirements, and enables customers to focus on differentiating their end solutions.
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Rugged COM-HPC Server Type Size E Reference Development Platform Based On Ampere® Altra® SoC
Ampere Altra Developer Rugged
The rugged 4U rackmount server platform provides a cloud-native environment for embedded edge development. It can host the SOAFEE (Scalable Open Architecture for Embedded Edge) providing a cloud-native environment for embedded edge development and is compatible with Autoware Foundation's Autoware Open AD Kit. It supports the open source EDKII as bootloader with UEFI, so customers can just download a stock AArch64 (arm64) ISO such as Ubuntu and install it through booting a live ISO directly on the target. The same convenience we have become used to by using x86 / amd64 target systems.
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DSP-Based 4/8-Axis Advanced Pulse-Train Motion Controllers
AMP-204C/AMP-208C
ADLINK"s new AMP-204C/AMP-208C DSP-based 4/8-axis advanced pulse-train motion controllers incorporate up-to-date floating-point DSP and FPGA technology, enabling high pulse output and encoder input frequency up to 6.5 MHz and 20 MHz respectively. Leveraging ADLINK" s Softmotion technology, the AMP-204C/AMP-208C offer impressive comprehensive and application-oriented motion functionality to reduce development time while maintaining superior throughput and accuracy. Superior synchronous motion control performance combines with point-table function integrating multi-dimensional interpolation, such as 3D linear/circular/spiral interpolation with enhanced trajectory and velocity planning, for contouring applications in semiconductor, display and conventional manufacturing industries. The AMP-204C/AMP-208C also support PWM control with three different control modes for frequency or duty cycle, benefiting laser engraving/marking/cutting applications. Moreover, hardware-based position comparison and trigger output are applicable in AOI applications.
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2-slot CompactPCI® Rackmount Chassis
cPCIS-6130R
The cPCIS-6130R Series subsystem is designed for Telecom Data Center and Enterprise applications requiring a low profile PICMG 2.0 R3.0 CompactPCI compliant chassis with PICMIG 2.1 R2.0 hot swap support. The chassis is 1U height and standard 19" rack mount width for 6U cPCI cards, has a 2-slot board space, a hot swap backplane, a 64-bit/66MHz cPCI bus, and provides rear I/O for 80mm RTMs.






















