3D SPI
checks form, height, surface area, bridges, volume, x/y offset and coplanarity of solder.
See Also: 3D Solder Paste Inspection
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3D SPI
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Omron’s advanced inspection systems help manufacturers meet the requirements of today’s SMT applications while improving throughput and sharpening their competitive edge.
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3D SPI Series
MS-11e
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- Exclusive15MP / 25MP CoaXPress Camera System- Dual Projection Shadow Free Moiré Technology- Precision Compound Telecentric Camera Lens- Automated Z-Height Calibration System- Automated PCB Under Board Support System- Precision PCB Warpage Compensation- Closed Loop Communication With Screen Printer- Absolute Repeatability and Reproducibility- INTELLISYS® Industry 4.0 Intelligent Factory Automation System
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Solder Paste Inspection System
KY8030-3
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The new KY8030-3 delivers 3x fasterinspection without compromisingperformance and accuracy.Using patented dual projection,the system eliminates the criticalShadow problem that all 3D SPI systemscan be vulnerable to.Additionally, the new KY8030-3 has solvedthe PCB Warp problem that seriouslyimpacts inspection accuracyand reliability of result.
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3D SPI Series
MS-15
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- Exclusive 15MP / 25MP CoaXPress Camera System- Dual Projection Shadow Free Moiré Technology- Precision Compound Telecentric Camera Lens- Automated Z-Height Calibration System- Automated PCB Under Board Support System- Precision PCB Warpage Compensation- Closed Loop Communication With Screen Printer- Absolute Repeatability and Reproducibility- INTELLISYS® Industry 4.0 Intelligent Factory Automation System
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Dual Projection 3D In-Line Solder Inspection System
KY8030-2
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The new KY8030-2 delivers 2x fasterinspection without compromising performanceand accuracy.Using patented dual projection, the systemeliminates the critical Shadow problem thatall 3D SPI systems can be vulnerable to.Easy UI and SPC Plus are included in the systempackage in order to help users achieve faster& easier printer process optimization
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3D Solder Paste Inspection Machine (3D-SPI)
3Si Series
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Saki's 3D SPI identifies critical defects and assists with process improvement.
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5D SPI
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On Mek Solder Paset Inspection systems, items which are better inspected in 2D, such as area offset and bridging, are viewed in full colour. Using colour inspection the ISO-Spector S2 SPI can tell the difference between paste, solder mask, silk screen and other PCB features and the SPI system can intelligently give you accurate results. Volume and height measurement in 3D are combined with the 2D inspection in Real-time, to give a True colour 3D image. Other 3D SPI systems only inspect in the 3rd dimension, (Z axis) and make extrapolated assumptions about the 2D image.
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Solder Paste Inspection
3D SPI
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Checking all the relevant points in the production process is essential, especially in terms of analyzing the causes of defects, fixing them, and – most importantly – preventing them in the future. That’s why solder paste printing is of fundamental importance for manufacturing complex assemblies: If paste printing isn’t performed correctly, the defect can impact the subsequent assembly and the soldering process, resulting in a tilted component or a poor or missing solder joint.
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Solder Paste
MVP Versa (3D SPI)
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The first part of any SMT process is Paste. MVPs Versa and 900 Series platforms provide high accuracy paste inspection. High accuracy paste measurements are made using a choice of 10um or 5um 3D measurement systems.
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Solder Paste Inspection Machine
3D SPI
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The 6500 series is the measurement equipment provided by Jiezhi Technology for the small pads of solder paste printed on the PCB board. It will cause defects such as sharpness, offset, more tin, and less tin printing during solder paste printing. Causes defects in the later stage of production, this equipment can find problems in advance
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SPI Isolators
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SPI (Serial peripheral interface) is one of the most widely used interfaces between microcontrollers and peripheral ICs such as sensors, ADCs, DACs, shift registers, SRAM, and others. Analog Devices has your isolated SPI bus covered with our dedicated SPI digital isolators which support this synchronous, full duplex master-slave-based interface. Options include devices built with ADI's proven iCoupler® technology and offering a small footprint, simple design-in, fast speeds, and high data integrity, as well as integrated µModules which require no external components. Our SPI isolator solutions increase performance and reduce board space. This simple, compact solution is ideal for isolated SPI data requiring communication across different ground potentials or through large common mode transients often found in Industrial PLCs (programmable logic controllers) and Instrumentation and data acquisition systems.
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3D Scanner
Artec Eva
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This structured light 3D scanner is the ideal choice for making a quick, textured and accurate 3D model of medium sized objects such as a human bust, an alloy wheel, or a motorcycle exhaust system. It scans quickly, capturing precise measurements in high resolution, which allows for almost unlimited applications, without the use of additional equipment.
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3D AOI
Zenith2
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Zenith 2 AOI platform, which provides the AI-driven Auto Programming for rapid job programming. The Zenith 2 also combines Koh Young’s advanced vision algorithms with innovative high-resolution optics. The latest platform expands inspection capabilities, delivering best-in-class performance, functionality, and accessibility. Koh Young’s side-view solution allows Zenith 2 to quickly detect and analyze defects on a wide range of mounted components and chips.
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3D Scanner
Lion3DX
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Lion3DX is desktop size 3D scanner with high accessibility for everyday use, equipped with automatic 2-axis platform.
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3D Solder Paste Inspection (SPI)
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Systems designed for solder paste inspection (SPI) quickly and reliably check the solder paste deposits on the circuit board.
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3D Measuring Systems
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Measurement systems for mobile, laptops, tablets and other specific electronic equipment, can be achieved using hi-tech materials, such as Rohacell (as used in Aerospace Industry). innco systems 2D and 3D positioning systems are custom designed to meet each new challenge, for mobile phones to wireless network equipment.
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3D Optical Microscopy
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Bruker is the worldwide leader in 3D surface measurement and inspection, offering fast, non-contact analyses for samples ranging in size from microscopic MEMS to entire engine blocks. Our microscopes are the culmination of ten generations of proprietary Wyko® Technology advances that provide the high sensitivity and stability necessary for precision 3D surface measurements in applications and environments that are challenging for other metrology systems.
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3D AOI
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Omron’s advanced inspection systems help manufacturers meet the requirements of today’s SMT applications while improving throughput and sharpening their competitive edge.
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3D Scanner
peel 3
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peel 3 can handle any application in: aftermarket & tuning, AR, VR & digital content, education, heritage preservation and art, product design, healthcare, and MRO and engineering.
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3D vision
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SICK's 3D vision series offers a wide range of powerful and flexible products designed for reliable operation in harsh industrial environments. They range from versatile high-speed cameras that deliver high quality 3D and contrast images to smart and configurable stand-alone sensors that facilitate rapid development and easy integration. Their scalability ensures a perfect fit with your 3D vision application.
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Automated 3D Scanner
HDI Compact
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The HDI Compact 3D scanning system eliminates the tedious work involved with manually scanning an object. Save time and get stunning results everytime. The HDI Compact is an automated 3D scanning solution. The rotary table automatically spins the object and stops at predetermined intervals. The scan head captures high resolution, accurate 3D scans of an object each time. Once the object spins a full 360 degrees, all the scans are then automatically cleaned up and merged together to create a full digital 3D model.
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3D Sensing
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The rapidly growing field of 3D sensing is currently addressed by the following 3D camera technologies: stereoscopic imaging, time-of-flight (ToF) sensing, and structured light.
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3D Solder Paste Inspection
aSPIre 3
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Industry-leading measurement accuracy and inspection reliability- Perfect solution to eliminate shadow problems, base plane settings, and problems with projection direction- Full 3D foreign material inspection solution for the entire PCB- High productivity through the highest accuracy
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Ensenso 3D Cameras
X Series
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Imaging Development Systems GmbH
The Ensenso X series is a modular and ultraflexible 3D camera system. The projector module with 100 W LED projector power is equipped with an integrated Gigabit Ethernet switch and can be combined with selected GigE uEye camera models to a customised 3D camera system.
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3D LaservScanners
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With unsurpassed accuracy and scan quality API’s Hemispherical Scanner is ideal for use Building Information Modeling (BIM), historical preservation and forensics.
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3D Scanner
Artec Ray II
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With the high-accuracy, long-range, wireless Ray II laser 3D scanner you can precisely and rapidly capture large to massive objects, scenes or areas, and from up to 130 m away. Expect 3D point accuracy that meets high professional standards and best-in-angular-class accuracy.
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3D Software
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Along with manufacturing professional 3D scanners, Artec develops smart 3D scanning software. Meticulously designed to meet the needs of both new and experienced users alike, it is the best choice for any application.
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3D Sensors
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Teledyne DALSA offers powerful, innovative 3D sensors combining industry-leading performance with cutting-edge feature sets and value.
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Simple 3D Measurement & Inspection
XG-X Series Vision System
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Abundant processing power is available even with multiple camera connections, including the 21 megapixel color camera, line scan cameras, or 3D cameras. XG-X Series offers high-speed, high-resolution cameras for high-accuracy inspection, providing powerful solutions for a variety of problems that arise in manufacturing.
