3D SPI
checks form, height, surface area, bridges, volume, x/y offset and coplanarity of solder.
See Also: 3D Solder Paste Inspection
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Product
USB-8452, 3.3 MHz I2C, 50 MHz SPI I2C/SPI Interface Device
781964-02
Interface Module
The NI USB‑8452 is a master interface for connecting to and communicating with inter-integrated circuit (I2C) and serial peripheral interface (SPI) devices. With plug‑and‑play USB connectivity, the USB‑8452 is a bus-powered, portable solution to communicate with consumer electronics and integrated circuits. It also includes eight general-purpose digital I/O lines for a variety of applications, such as configuring the address of I2C devices, toggling LEDs, or strobing convert and data ready lines common to analog converter chips. You can physically place the USB‑8452 more closely than PCI interfaces to I2C/SPI devices, which reduces I2C bus length and minimizes noise problems. Additionally, the interface provides +5 V and GND to power circuits with no external power supply.
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Product
3D Form Measurement
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Ensure that components function and can be fitted correctly with efficient form monitoring. ISRA’s 3D form measurement systems capture component geometries down to the nanometer level while ensuring the shortest cycle times.
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Product
3D Metrological Software
InnovMetric PolyWorks
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Powerful metrological software which can effectively process vast amounts of data from 3D scanners in real time. Due to its modular architecture the software covers a large number of applications: one-point inspection by touch measurement systems, scanned data processing and data comparison to CAD models or complete reverse engineering – CAD model creation.
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Product
3D Automated Optical Inspection Systems (3D-AOI)
3Di Series
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Saki’s 3Di Series applies cutting edge technologies to improve production efficiency and enhance production quality across the entire assembly line.
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Product
3D Measurement And Inspection
LOTOS
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LOTOS automatic measuring systems can measure the full outer contours or individual areas of any measurement object quickly and precisely, irrespective of the shape, and test them for imperfections. The three-dimensional, non-contact measurement is carried out using optical measurement sensors with accuracy in the μm range. The result is a representation of the measurement object as a 3D model. Powerful, intuitive software allows the measurement results to be assessed extremely quickly.
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Product
3D Software
Geomagic Design X
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Geomagic Design X is an all-round, professional reverse engineering software with a smart combination of history-based CAD with 3D scan data processing, letting you produce feature-based, editable solid models compatible with your existing CAD software.
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Product
3D Solder Paste Inspection system
PI Series
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PI Series is a new generation 3D Solder Paste Inspection system that overcomes the limitations of traditional SPIs and satisfy all your inspection needs. The PI Series allows to easily implement Solder Paste Inspection in any PCBA line. These new generation systems are very intuitive to use, allowing non-experienced persons to get expected results.
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Product
3D Roughness Measurement System
IF-Profiler
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The If-Profiler is a handheld 3D roughness measurement system for high resolution measurement of surface finish. You measure roughness of flat and curved components with only one system. Measurements are performed both profile based (ISO 4287) and areal based (ISO 25178). The measurement system achieves flexible measurements and applications at high measurement speed. Various positions and measurement fields are traceably and intuitively measured. The IF-Profiler is also used to measure geometries with steep flanks and various coatings.
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Product
Process Improvement Software for SPI & AOI
SIGMA Link
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SIGMA Link software suite links altogether solder paste inspection (SPI), automated optical inspection (AOI) and manufacturing execution system (MES). For Smart Factories, SIGMA Link is the essential element to connect inspection machines to Manufacturing Execution System. This real-time interface ensures full traceability and enables interlocking of machines to automate SMT lines while driving yield to new levels.
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Product
Mek Selective 3D AOI
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Every one of our desktop AOI and inline AOI systems is optimised for the demands of today’s advanced SMT applications and critical manufacturing environments. All are capable of delivering Selective 3D, using our unique stereoscopic imaging from the 9 cameras of the GTAz /GDAz optical heads.
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Product
USB Logic Analyzer- High Speed Data Logger -SPI / IC Analyzer
LOG Storm
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Logic analyzers are key tools for that process – they offer visibility over what happens in your digital electronic system.
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Product
Floor-Standing 3D Optical Profilometers
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High-precision, non-contact metrology systems designed for rapid, automated, large-area surface characterization in industrial and R&D settings.
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Product
3D Semiconductor & MEMS Process Modeling Platform
SEMulator3D
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SEMulator3D® is a powerful 3D semiconductor and MEMS process modeling platform that offers wide ranging technology development capabilities. Based on highly efficient physics-driven voxel modeling technology, SEMulator3D has a unique ability to model complete process flows. Starting from input design data, SEMulator3D follows an integrated process flow description to create the virtual equivalent of the complex 3D structures created in the fab. Because the full integrated process sequence is modeled, SEMulator3D has the ability to predict downstream ramifications of process changes that would otherwise require build-and-test cycles in the fab.
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Product
3D Software
Geomagic Wrap
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Geomagic Wrap 2017 delivers a new and improved 3D scan-to-model workflow. From expanded file format support to manipulating texture maps for bringing your printed parts to life, the 3D scan data toolbox of Geomagic Wrap provides a wealth of possibilities.
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Product
3D Sensor (Shiny Surfaces)
reflectCONTROL
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reflectCONTROL is designed specifically to meet the high quality requirements that ensure high quality for shiny surfaces. The system based on deflectometry projects a striped pattern onto the measurement object. Defects on the surface cause deviations from the striped pattern which are recorded by cameras and evaluated by software.
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Product
3D Automated Optical Inspection
Zenith UHS
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High-speed full 3D AOI that brings about a revolution in SMT process management Industry-leading speed for full 3D measuring inspection equipment skill solutions- Only solution in the industry to set inspection criteria according to IPC-610 standards- Performs defect diagnosis through measurement-based data and eliminates the causes of possible errors- Powerful 3D solder joint inspection
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Product
3D RF Noise Measurment System
EMI-360
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3D RF Noise Measurement System EMI-360 to realize the new EMC measurement.EMC measurement is possible to realize a low-cost and time reduction.
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Product
Sapphire 3D Microscope
WDI-2000
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The Sapphire 3D Microscope: HS-WDI-2000 was designed with high quality lighting parts and a good optical system design,can get a very clear image.with the digital camera,it can provide the image in time, widely used in LED,Solar,SEMI…
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Product
SPI | AOI | AXI
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Suitable for a wide variety of SMT applications, Omron’s automated inspection solutions are designed to ensure the highest degree of quality and consistency in PCB production.
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Product
3D AOI Series
MV-9
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- Exclusive 15MP / 25MP CoaXPress Camera System- OMNI-VISION® 3D Digital Tri-Frequency Moiré Technology- Leading-Edge 12 Projection Blue DLP Technology- Precision Compound Telecentric Camera Lens- Eight Phase Color Lighting System- 10MP / 18MP SIDE-VIEWER® Camera System- Programmable Z-Axis Multi-Focus System- INTELLI-PRO® Automatic Programming Software- Multi-Functional AOI-SPI Fusion Technology- INTELLISYS® Industry 4.0 Intelligent Factory Automation System
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Product
USB-8451, 250 kHz I2C, 12 MHz SPI I2C/SPI Interface Device
779553-01
Interface Module
The NI USB‑8451 is a master interface for connecting to and communicating with inter-integrated circuit (I2C), System Management Bus (SMBus), and serial peripheral interface (SPI) devices. With plug‑and‑play USB connectivity, the USB‑8451 is a portable solution to communicate with consumer electronics and integrated circuits. It also includes eight general-purpose digital I/O lines for a variety of applications, such as configuring the address of I2C devices or toggling LEDs. The USB‑8451 can be physically located more closely to I2C/SPI devices than PCI interfaces, reducing I2C bus length and minimizing noise problems. Additionally, the interface provides +5 V and GND to power circuits with no external power supply.
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Product
TTL/I2C/SPI Expansion Kit
OP-SB85L
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OP-SB85L is the interface expansion kit that has a port to measure TTL / CMOS signal level communications, and the one to measure the voltage of high-speed analog input. The port for TTL / CMOS supports the measurement of TTL / CMOS level communications that power supply system is from 1.8V to 5V. It is suitable for monitoring the communication between the LSI and the interface IC on the printed circuit board by directly probing into the lines. It supports the protocol of not only UART and HDLC but also I2C and SPI on monitoring and simulating.
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Product
3D Electromagnetic Simulation Software
XFdtd®
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A full-featured simulation solver, XFdtd outpaces other methods in efficiency as the number of unknowns increases. XF includes full-wave, static, bio-thermal, optimization, and circuit solvers to tackle a wide variety of applications, including antenna design and placement, biomedical and SAR, EMI/EMC, microwave devices, radar and scattering, automotive radar, and more. It also works with Remcom's ray-tracing products to provide thorough simulation capability at the low-, middle-, and high-end of the electromagnetic spectrum.
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Product
3D CMOS Image Sensors
Flash
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High-resolution in a rectangular format, specifically designed for 3D laser triangulation - Very high frame rate and throughput combined with high power efficiency, delivering outstanding sampling resolution and speed with a high Gbps/W ratio - HDR feature embedded on-chip, to measure all kinds of surfaces - Feature-rich sensors, to perfectly meet application challenges.
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Product
contact/non-contact portable 3D measurement system
ScanArm
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The FARO ScanArm combines all of the advantages of the FaroArm with a hand held laser scanner and is the perfect contact/non-contact measurement system. Unlike other scanning systems, the ScanArm’s hard probe and the Laser Line Probe can digitize interchangeably without having to remove either component. Users can accurately measure prismatic features with the hard probe, then laser scan sections requiring larger volumes of data — all in one simple tool.
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Product
High-speed In-Line 3D CT Inspection System
X-eye 6300
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Automatically inspects the defects of products in customer's line with high-speed 3D CT tomography.Able to inspect every defects of Double-sided PCBA & BGA mounted components precisely by solving overlapped X-ray image issue.Inspection speed of 3 sec/1FOV from loading to automatic Good/NG judgement.
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Product
USB-8452, 3.3 MHz I2C, 50 MHz SPI I2C/SPI Interface Device
781964-03
Interface Module
The NI USB‑8452 is a master interface for connecting to and communicating with inter-integrated circuit (I2C) and serial peripheral interface (SPI) devices. With plug‑and‑play USB connectivity, the USB‑8452 is a bus-powered, portable solution to communicate with consumer electronics and integrated circuits. It also includes eight general-purpose digital I/O lines for a variety of applications, such as configuring the address of I2C devices, toggling LEDs, or strobing convert and data ready lines common to analog converter chips. You can physically place the USB‑8452 more closely than PCI interfaces to I2C/SPI devices, which reduces I2C bus length and minimizes noise problems. Additionally, the interface provides +5 V and GND to power circuits with no external power supply.
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Product
3D Guidance®
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The 3D Guidance® electromagnetic tracking solution delivers exceptional performance and value for OEM image-guided interventional and therapy systems and medical trainers that require real-time navigation tracking capabilities. The 3D Guidance solution tracks 6DOF sensors that can be embedded into OEM instruments such as ultrasound probes, rigid and flexible scopes, and laparoscopic tools. Continuous in-vivo tracking is maintained through difficult anatomy, even when sensors are out of sight. Low latency and fast update rates ensure the most subtle tool movements are instantly tracked and visualized within the OEM host interface. The 3D Guidance solution is available in the driveBAY™ and trakSTAR™ configurations, as based on the Electronics Unit. The trakSTAR is a standalone desktop unit that connects to a direct power source. The smaller driveBAY fits inside the drive bay of a computer, OEM imaging cart, or medical trainer/simulator, using the host’s power supply. Both share the same tracking accuracy and reliability. The ready-to-use configuration facilitates cost-effective integration and speeds time to market.
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Product
Full 3D Inline Metrological & Imaging AOI
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Metrological Full 3D AOI is achieved by measuring all 3 dimensions (X, Y and Height) to detect every measurable solder and component defect pre-reflow and/or post reflow soldering.
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3D Cameras
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*Visual assessment of distance, level or volume*Time-of-flight measurement principle*Illumination, measurement and evaluation in one unit*Output of distance and grey values*Integration by means of intuitive parameter setting software
