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Semiconductor Substrate
thin crystalline material sliced from ingot.
- Scientific Test, Inc.
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Automated Discrete Semiconductor Tester (ATE)
5000E
Same Proven Technology as all 5000 Series Testers. High Speed Single Test Measure. Capable of Testing Multiple and Mixed Devices. 1KV Standard, 2KV Optional. 1NA to 50A Standard, 100A Optional. 0.1NA Resolution. Complete Self Test. Auto-Calibration. RDSON to 0.1MOHM Resolution. Windows Application Software. Optional Scanner. Optional Wafer Mapping. Optional Curve Trace. MOSFET, IGBT, J-FETTriac, SCR, Sidac, Diac, Quadrac, STS, SBS Transistor, Diode, Opto, Zener Regulator, MOV, Relay. UNDER $23,000.00
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High Volume Semiconductor Substrate Interconnect Tester
GATS-2100
Pre-align *load *CCD camera alignment *electrical test * unload * sort of pass, opens, shorts, and alignment errors.The GATS-2100 concurrent approach provides unmatched volume capability... 2.5 seconds per device. As with all Nidec-Read Test systems, the GATS-2100 offers you the most test technologies for your requirements
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Electrostatic chucks
Semiconductor substrates such as Si wafers or masks for the next generation of extreme ultraviolet lithography (EUVL) are handled in a vacuum. For nm structures and exact overlay, the reproducibility of the substrate evenness is a crucial factor, as unevenness results in structural distortions. Particles are problematic and heat input as well as thermal expansion must be taken into account.
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Fastest Flying Probe Test System for Semiconductor Substrate Interconnect Test
GATS-3200
* Test individual packages or * Test Multi-image panels with Step&Repeat Function * single flying probe top using very high speed voice coil motor (VCM) technology * 50 - 100 tests per second ... high throughput * Dual Flying Probe Top for testing bump-to-bump nets * flying probe head allows testing of all nets including each power and ground point * 4-wire test capability
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Custom Coatings
MICROMATTER provides custom coating services (single or multi-layer) on customer supplied glass, metal and semiconductor substrates.
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Packaging Manufacturing
KLA’s extensive portfolio of packaging solutions accelerates the manufacturing process for outsourced semiconductor assembly and test (OSAT) providers, device manufacturers and foundries for a wide range of packaging applications. Innovations in advanced packaging, such as 2.5D/3D IC integration using through silicon vias (TSVs), wafer-level chip scale packaging (WLCSP), fan-out wafer-level packaging (FOWLP) and heterogeneous integration as well as a wide range of IC substrates create new and evolving process requirements. KLA offers systems for packaging inspection, metrology, die sorting and data analytics focused on meeting quality standards and increasing yield before and after singulation. SPTS provides a broad range of etch and deposition process solutions for advanced packaging applications. Orbotech offers a portfolio of technologies that includes automated optical inspection (AOI), automated optical shaping (AOS), direct imaging (DI), UV laser drilling, inkjet/additive printing and software solutions to ensure manufacture of the highest quality of IC substrates.
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Software
MOS Doping Profile Analysis
Materials Development Corporation
MDC uses the comprehensive Ziegler algorithm toconvert pulsed MOS C-V data to a doping profile. The doping profile is accurate from the oxide semiconductor interface to the maximum depletion depth and is therefore useful for low dose ion implant monitoring. Peak doping, range, and total active dose are computed. The technique is sensitive enough to resolve changes in the substrate doping profile due to redistribution during oxidation.
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SOI Bonding Systems
An accurate wafer bonding process is the key factor in obtaining high quality single crystalline silicon films on insulating substrates. The EVG850 SOI/Direct Wafer Bonding systems are designed to fulfill a wide range of fusion/molecular wafer bonding applications, with main focus on SOI substrates manufacturing. Ultra clean handling of wafers throughout the bonding process assures high-yield and void-free bonds. All essential steps, from cleaning and alignment to pre-bonding and IR-inspection are combined in one high volume production system. EVG850 is the only production bonding system built to operate in high throughput, high-yield environments and guarantees void-free SOI wafers up to 300 mm.The EVG300 series single wafer cleaning systems are designed for efficient removal of particles. In semiconductor processing, efficient cleaning and particles removal prior to critical process steps enables maximum yield. Wafer Bonding is a process which is strongly affected by particles: each particle on the wafer surface produces a void orders of magnitude larger than its diameter, contributing to a dramatic yield loss.
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Defect Inspection Systems
Candela® defect inspection systems detect and classify a wide range of critical defects on compound semiconductor substrates (GaN, GaAs, InP, sapphire, SiC, etc.) and hard disk drives, with high sensitivity at production throughputs.
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Automatic Online Flatness and Surface Appearance System
UltraSort200
The UltraSort continues our 25 year tradition of providing metrology solutions to semiconductor wafer manufacturers. Designed for volume wafer production, this automated system offers superior performance in rapid, repeatable, accurate, noncontact qualification of silicon and alternative substrate wafers.
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Automated Front & Backside Mask Aligner System
Model 6000
With over 4 decades of manufacturing in the semiconductor industry, OAI meets the growing challenge of a dynamic market with an elite class of production photolithography equipment. Built on the proven OAI modular platform, the Model 6000 has front and backside alignment that is fully automated with a submicron printing capability as well as submicron top to bottom front side alignment accuracy which delivers performance that is unmatched at any price. Choose either topside or optional backside alignment which uses OAI’s customized advanced recognition pattern software. These Mask Aligners have OAI’s Advanced Beam Optics with better than ±3% uniformity and a throughput of 200 wafers per hour in first mask mode, which results in higher yields. The Series 6000 can handle a wide variety of wafers from thick and bonded substrates (up to 7000 microns), warped wafers (up to 7 mm-10mm), thin substrates (down to 100 micron thick), and thick photo resist.
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Molded Interconnect Subtrate
A substrate interposes between an IC chip and a motherboard to enable the IC chip to communicate with the motherboard effectively. Typically, the IC chip is attached onto the substrate and assembled into an IC package before connecting to the motherboard. It is an essential part of the IC package and is responsible for a successful packaging process. Also, it plays an important role in making the IC chip to become a real product and a real solution for end customers. In the past years, semiconductor technologies were highly driven by PC applications which follow Moore’s law in technology migration. In recent years, the emergence of mobile applications increasingly, become the main driver in the semiconductor industry. These mobile applications requires a new kind of substrate that have ability for making IC packages with smaller form factor, thin profile, better thermal, mechanical and electrical performance.
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Electrostatic Chucks
Chucks grip for micropatterning, temperature control, or robotics ...*insulating substrates,*hard disk drive head substrates,*semiconductor wafers,*InP-coated sapphire,*metal foils,*... and many other materials.
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Non-Contact Mapping Life Time System
MWR-2S-3
The device is designed for express non-destructive contactless local measurement of non-equilibrium charge carrier effective lifetime in silicon substrates, epi-wafers and solar cells at different stages of manufacturing cycle. It can be used for incoming and outcoming inspection of silicon ingots and wafers, tuning and periodic inspection of semiconductor and solar cell technology quality. Lifetime determination is based on measuring photoconductivity decay after pulselight photo-exciting with usage of reflected microwave as a probe.
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Metrology Solutions for Semiconductors
Bruker Semiconductor develops, manufactures, markets, and supports metrology solutions for thin films, which are based on novel, rapid, non-contacting and non-destructive X-ray technology. With Bruker’s acquisition of Jordan Valley Semiconductors, a name synonymous with unparalleled worldwide customer service and support, 75% of the world's top 25 semiconductor manufacturers rely on Bruker metrology tools for front-end and back-end applications, including development of their next-generation thin films. Bruker commitment to innovation and technology leadership drives the continued release of new advancements in metrology, and has garnered numerous awards and industry recognition. In applications ranging from C-S thin films materials characterization to wafer substrate analysis and defect detection, Bruker’s systems provide simulation analysis and fit. HRXRD, XRR, WA-XRD, and XRDI measurement types are fully supported, enabling researchers, production engineers, and process developers unparalleled capabilities. Whether you are a semi and C-S fabricator, R&D center or academy, or an industry materials research facility, Bruker has a specifically designed solution for your metrology needs.
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Wafer Analysis Systems
Tropel®
Corning Specialty Materials has a long heritage of providing solutions to semiconductor equipment manufacturers. The Tropel line of wafer analysis equipment enables measurement of wafer substrates from 2” to 450mm regardless of material type and surface finish.
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Reticle Manufacturing
An error-free reticle (also known as a photomask or mask) represents a critical element in achieving high semiconductor device yields, since reticle defects or pattern placement errors can be replicated in many die on production wafers. Reticles are built upon blanks: substrates of quartz deposited with absorber films. KLA’s portfolio of reticle inspection, metrology and data analytics systems help blank, reticle and IC manufacturers identify reticle defects and pattern placement errors, thereby reducing yield risk.
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Semiconductor
Copper Mountain Technologies USB VNAs provide a low-cost semiconductor testing option, offering measurement speeds on the order of 10,000 points per second while maintaining 80-90 dB dynamic range, are uniquely suited for deployment into such demanding scenarios. Additional considerations for these applications include availability of external trigger inputs and outputs, amenability to external program control, size of the instrument, and parallel processing capability.
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Semiconductor
DieMark
DieMark Inking Systems are available in Electric and Pneumatic models and utilize convenient, disposable DieMark Ink Cartridges to streamline and optimize the process of marking defective die. With models available for nearly every test platform and configuration, Xandex inking systems are in operation daily in every corner of the world where wafer sort is performed.
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Semiconductor Test
Ismeca NY32
32-position turret platform for semiconductor test, inspection and packaging, providing the highest process integration capabilities. Integrating innovative hardware and software technology such as Intelligent Features that enables extended autonomous operation and productivity.
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Semiconductor Relays
Panasonic Industrial Devices Sales Company of America
Panasonic Semiconductor Relays are categorized into two types: PhotoMOS® and Solid State Relays (SSRs).
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Semiconductor Solutions
Bruker's suite of technologies for semiconductor manufacturing address critical metrology and process needs across the broadest range of applications from R&D to process improvement. 75% of the world's top 25 semiconductor manufacturers rely on Bruker metrology tools for front-end and back-end applications, including development of their next-generation products.
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Semiconductor Laser
·Fibre coupling semiconductor laser·The product range of wavelengths is 450nm~1550nm ·The product range of power is 2mW~300W ·A Variety of package coupling form,can be integrated indicator light,a photoelectric detector, a semmiconductor refrigerator,optical switch function·Solution of flexible and diverse,providing customized service sub system
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Semiconductor Assembly
With the know-how that we have cultivated over many years in the semiconductor manufacturing process, we respond to the diverse needs of our customers regardless of prototype production and mass production.
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Semiconductor Lifecycle Management
Defense and space applications no longer drive the semiconductor industry. There is such a mismatch between the market life of a modern semiconductor, which can be measured in months to a couple of years, and the platform needs of defense and space platforms, measured in decades.Semiconductor Lifecycle Management (SLiM™) from Teledyne e2v HiRel Electronics solves this headache. We have many years of experience partnering with customers to save cost and lower risk when dealing with platform extensions.
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Semiconductor Optical Amplifier
SOA
Amonics SOA is a polarization maintaining optical amplifier with high fiber-to-fiber gain. It is designed for transmitter applications to increase optical launch power to compensate for the loss of other optical devices. The benchtop version incorporates a user-friendly front panel housing a LCD monitor display, key switch, power control knob and optical connectors. RS232 computer interface is also equipped on the rear panel. 1MHz with 10ns pulse width intensity modulation is available. The OEM module version is an ideal building block for OEM system integration, especially in optical communication network and CATV applications. It requires only a single +5V power supply.
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Semiconductor
The semiconductor industry faces continuous pressure to reduce device size and costs while improving performance and reliability. Semiconductor, test and assembly automation manufacturers demand the same improvements from the motion technology which drives it. Haydon Kerk Pittman continues to develop new technologies in motors, lead-screws, gears, encoders, actuators, slides, drives and complete sub-systems that increase operational speeds and accuracy while lowering the cost of ownership.
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Semiconductor Thermal Analyzers
Analysis Tech Semiconductor Thermal Analyzers measure semiconductor junction temperatures using the electric method of junction temperature measurement on all types of semiconductor devices.
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Fully Automatic Test Machine for Ceramic Substrates
U800CCT
1. CCD automatic alignment, with an accuracy of ± 10μm2. Support layout test, displacement function3. The upper and lower jigs X, Y, θ are automatically fine-tuned to improve the yield4. Automatic loading and unloading of magazine5. Automatic bad marking and verification of scratches
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Semiconductor Test Services
Tests regarding function, electrical and optoelectronical parameter. Electrical test of wafer up to 8? and packaged devices - selection and volume test.
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Semiconductor Electrical Test
We conduct electric property test (final test) of the completed (packaged) LSI products. We will support testing of analog devices, logic devices, other electronic parts, modules, application products and so on. We will test according to customer's specification regardless of evaluation, trial production, mass production, by know-how cultivated with long-time mass production results. Test initial examination ~ From consistent correspondence up to selection and evaluation, individual correspondence such as design only is accepted.
