Flash Memory
retains data absent of power. Also known as: Flash Device
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Product
Xilinx Artix-7 FPGA SoM
TE0710
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Sundance Multiprocessor Technology Ltd.
TE0710s are industrial-grade FPGA modules integrating a Xilinx Artix-7 T FPGA, a gigabit Ethernet transceiver (physical layer), 1 Gbit (128 Mbyte) DDR3 SDRAM with 8-bit width, 32 Mbyte Flash memory for configuration and operation, and powerful switch-mode power supplies for all onboard voltages.
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Product
High Speed Pick and Place Handler
Commander 2000
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At throughput rates in excess of 2000 Units per Hour the HT Commander 2000 system provides unparalleled performance for the production handling and programming of flash memory devices or modules.
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Product
SparkFun SAMD21 Development Board
Qwiic Micro
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Looking for a super small microcontroller to use with the Qwiic eco-system? The SparkFun Qwiic Micro is molded to fit our standard 1"x1" Qwiic standard size which makes it one of our smallest micro-controller offerings to date. At it's core is the powerful and versatile ATSAMD21E18, which is an ARM Cortex M0+, 32-bit microcontroller, with 256KB of flash memory that can run at up to 48MHz! It has 12 digital pins which include 5 analog pins, SPI, I²C, and an additional UART data bus as well as a Qwiic connector for easy integration into the Qwiic ecosystem and I²C prototyping.
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Product
4G DDR4-3200 512X16 1.2V SAM -20~85℃
AQD-SD4U4GN32-SP2
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SAM Original Chip, Industrial Design for Improved Reliability, PCB: 30μ gold finger. Anti-sulfuration, Semi Wide-temp Support -20~85℃.
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Product
8GB SO-DIMM DDR5-5600 262Pin 1GX16 1.1V Unbuffered Hynix Chip
AQD-SD5V8GN56-HC
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Hynix Original Chip, Increased Banks and Burst Length, DDR5 5.6GT/s. Same-Bank Refresh, On-die ECC for Enhanced RAS.
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Product
8GB SO-DDR4-3200 1GbX8 1.2V ECC Samsung Chip
AQD-SD4U8GE32-SE
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8GB, Speed 3200MHz, 30u" Gold Plating Thickness, Anti-sulfurization resistance, ECC.
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Product
16G R-DDR4-3200 1GX8 1.2V Samsung Chip -40~85C
AQD-D4U16R32-SEW
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Registered DIMM, 30u" Gold Plating Thickness, Anti-sulfurization resistance. 1.2V power consumption, Samsung original chip, wide temperatures from -40° to 85°C.
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Product
16GB DDR5-5600 2GX8 1.1V SAM
AQD-D5V16GN56-SB
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SAM Original Chip, PCB: 30μ gold finger, Anti-sulfuration, On-die ECC for Enhanced RAS, Operating Temperature: 0°C ~ 85°C.
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Product
High Performance Power Analyzer
AFM-8A
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AFM-8A has Developed for AFC*(Auto Frequency Control) high performance measurement and frequency update, its update up quickeer than 100mSec. multifunction power analyzer provides high-accuracy measurement and is designed for single phase and three phase application. It includes 4 Digital inputs, 4 Relay outputs, and a RS-485 Modbus RTU Communication port. The user can choose one more communication port, and 2 Analog outputs for output expansion.It provides measure voltage and current of the 2~63 harmonic, and it shows CO2 emissions, which is suitable for power monitoring, management and analyze power quality. It has TOU (time-of-use) function and 4MB Flash memory capacity, allowing users to record data for a long time. It also has a software line adjustment function to reduce the on-site line adjustment work.It has the functions of waveform capture and recording, power record, and event record, which can be used for multifunction power analyzer.
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Product
16GB DDR4-3200 1GbX8 1.2V ECC Samsung Chip
AQD-D4U16GE32-SE
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16GB, Speed 3200MHz, 30u" Gold Plating Thickness, Anti-sulfurization resistance, ECC.
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Product
8GB DDR4-3200 1GbX8 1.2V Samsung Chip
AQD-D4U8GN32-SE
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8GB, DDR 4 3200MHz, 30u" Gold Plating Thickness, Anti-sulfurization resistance, Unbuffered.
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Product
16GB SO-DDR5-5600 2GX8 1.1V SAM
AQD-SD5V16GN56-SB
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SAM Original Chip, PCB: 30μ gold finger, Anti-sulfuration, On-die ECC for Enhanced RAS, Operating Temperature: 0°C ~ 85°C.
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Product
32GB DDR5-5600 2GX8 1.1V SAM
AQD-D5V32GN56-SB
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SAM Original Chip, PCB: 30μ gold finger, Anti-sulfuration, On-die ECC for Enhanced RAS, Operating Temperature: 0°C ~ 85°C.
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Product
16GB SO-DDR4-3200 1GbX8 1.2V ECC Samsung Chip
AQD-SD4U16GE32-SE
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16GB, Speed 3200MHz, 30u" Gold Plating Thickness, Anti-sulfurization resistance, ECC.
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Product
16GB ECC SO-DDR5-5600 2GX8 1.1V SAM
AQD-SD5V16GE56-SB
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SAM Original Chip, Anti-sulfuration, PCB: 30μ gold finger. Independent Power Management IC build-in, ECC function support.
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Product
8GB SO-DDR5-5600 1GX16 1.1V SAM
AQD-SD5V8GN56-SC
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SAM Original Chip, PCB: 30μ gold finger, Anti-sulfuration, On-die ECC for Enhanced RAS, Operating Temperature: 0°C ~ 85°C.
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Product
Wide Temperature Server DIMM
SQR-RD4M
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Original Hynix IC chip adopted, Wide operating temperature support -25~85oC, Data transfer rate up to 3200 MT/s.
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Product
Universal In-System Programming Tool
ScanExpress JTAG Programmer
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ScanExpress JTAG Programmer is a universal in-system programming (ISP) solution designed for convenience and versatility—a modular, multi-functional, and high-performance tool to program, read, and verify Flash memories, serial EEPROMs, CPLDS, FPGAs, and more.Like all Corelis ScanExpress family products, ScanExpress Programmer is a tool for all phases of the product life cycle—whether programming early code during product development, programming production code during manufacturing, or reprogramming units out in the field, ScanExpress Programmer is designed to fit all in-system-programming needs.
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Product
16GB ECC DDR5-5600 2GX8 1.1V SAM
AQD-D5V16GE56-SB
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SAM Original Chip, Anti-sulfuration, PCB: 30μ gold finger. Independent Power Management IC build-in, ECC function support.
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Product
16GB DDR4-3200 1GbX8 1.2V Samsung Chip
AQD-D4U16GN32-SE
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16GB, Speed 3200MHz, 30u" Gold Plating Thickness, Anti-sulfurization resistance, Unbuffered.
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Product
16GB SO-DDR4-3200 1GbX8 1.2V Samsung Chip
AQD-SD4U16GN32-SE
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16GB, Speed 3200MHz, 30u" Gold Plating Thickness, Anti-sulfurization resistance, Unbuffered.
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Product
32GB DDR4-3200 2GbX8 1.2V Samsung Chip
AQD-D4U32GN32-SB
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32GB, Speed 3200MHz, 30u" Gold Plating Thickness, Anti-sulfurization resistance, Unbuffered.
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Product
Low pin and internal configurable analog MCU
RL78/G11
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The RL78/G11 microcontroller line-up concept is based on small packages like 20 to 25pin, in small 16KB flash memory and rich analog peripherals such as A/D converters, D/A converters, comparators and PGA and these are configurable as PGA+ADC+VBGR, PGA+CMP, CMP+DAC/VBGR, or PGA+CMP+DAC/VBGR. Using the smart features like DTC and ELC a lot of peripherals can be connected internally to reduce CPU workload and can save overall power consumption. It also supports very low power operation (100 uA @ 1 MHz ) and a high speed 4µs wake up. Available in small 3x3mm² WFLGA , 4x4mm² HWQFN and standard 20pin LSSOP, this MCU line is suitable for sensor application, Lighting/power sources and many small appliances.
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Product
16G SO-DDR5-5600 2GX8 1.1V SAM -20~85℃
AQD-SD5V16GN56-SBH
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SAM Original Chip, Industrial Design for Improved Reliability, PCB: 30μ gold finger. Anti-sulfuration, Semi Wide-temp Support -20~85℃.
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Product
32G SO-DDR5-5600 2GX8 1.1V SAM -20~85℃
AQD-SD5V32GN56-SBH
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SAM Original Chip, Industrial Design for Improved Reliability, PCB: 30μ gold finger. Anti-sulfuration, Semi Wide-temp Support -20~85℃.
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Product
32GB R-DDR5 5600 R-Dimm 2GX8 1.1V SAM
AQD-D5V32GR56-SB
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SAM Original Chip, Industrial Design for Improved Reliability, Compatible with server platform, 30u” golden finger, Operating Temperature: 0°C ~ 85°C.
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Product
SODIMM DDR4 3200MT/s
SQR-SD4S
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Original Hynix IC chips adopted, Data transfer rate: 3200MT/s. Capacity: 4/8/16/32GB, Operating temperature: 0 °C ~ 85 °C Lifetime warranty.
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Product
Storage Technologies
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We engage with companies across the storage landscape, from flash memory chips used in mobile devices to massive cloud data centers. And here is how!
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Product
4G DDR4 2400 288Pin 512MBX8 1.2V Registered Samsung Chip
AQD-D4U4GR24-SG
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DDR4-2400 Registered DIMM. – standard height, 30μ" gold plating thickness (IPC-2221 Standard) 1.2V power consumption. Low-power auto self- refresh (LPASR) Provides better reliability, availability and serviceability (RAS) and improves data integrity.
