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Product
1 GHz A/D and D/A with Virtex-6 FPGA - 3U VPX
Model 52630
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- Complete radar and software radio interface solution- Supports Xilinx Virtex-6 LXT and SXT FPGAs- Supports gigabit serial fabrics including PCI Express, Serial RapidIO and Xilinx Aurora- One GHz 12-bit A/D- One GHz 16-bit D/A- Up to 2 GB of DDR3 SDRAM or 32 MB of QDRII+ SRAM- Sample clock synchronization to an external system reference- LVPECL clock/sync bus for multiboard synchronization- Optional LVDS connections to the Virtex-6 FPGA for custom I/O- 3U VPX form factors provides a compact, rugged platform- Compatible with several VITA standards including: VITA-46, VITA-48 AND VITA-65 (OpenVPX™ System Specification)- Ruggedized and conduction-cooled versions available- Synchronize up to twelve modules with Model 9192 System Synchronization and Distribution Amplifier- 1U Rack-mount
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Product
6U CompactPSB 4-slot SSR FSL 33MHz VIO 5V BW 64-Bit
80965-004-6800
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6U CompactPSB Backplane 4-slot, PICMG 2.0 R3.0, system slot right, PICMG 2.16 R1.0 fabric slot left, supports full hot swap function according to PICMG 2.1 R2.0, 1Gb/s Ethernet switching, clock frequency 33MHz, V(I/O) +5V, bus width 64-bit
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Product
Custom Testing
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You create a custom test plan (a file that lists a series of tests to be run), to meet requirements specific to your environment and apply that test plan to any number of clusters. You specify the order in which tests run and the specific components to be tested. After you set up your custom test environment, you run the test procedure from SMIT and view test results in SMIT and in the Cluster Test Tool log file. For information about customized testing, see Setting up custom cluster testing.*Fixture Design*Fixture Fabrication*Custom Test Stands*Prototype Testing Services*Product Safety Testing Services
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Product
Electronic Moisture Analyzer
MOC-120H
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The moisture content of a variety of samples can be measured using an array of drying modes. The drying status can be seen at-a-glance with the fluctuation range display. Active in a variety of fields (cereals, starch, flour, noodles, brewed products, sea foods and marine products, meat products, spices, sweets, dairy products, dried foods, vegetable oils and other food articles; pharmaceuticals; ores; cokes; glass materials; cement; chemical fertilizers; pulp and paper; cotton; various fabrics and other industrial goods); enabling measurement of samples (cereals, foods, and chemical products) under various conditions (powder, particles, paste, and liquid).
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Product
Fibre Channel Test & Simulation Interface for PCI
PCI-FC4
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Avionics Interface Technologies
Supports Point-to-Point, Switched Fabric, and Arbitrated Loop topologies - Two independent Fibre Channel ports - Two SFP sockets accept fiber or copper transceivers - Each port supports 1, 2, and 4 Gbps speeds - Comprehensive decoding of FC-1, FC-2, and Upper Layer Protocol (ULP) frames - Full Error Injection and Detection - IRIG-B Time Code Encoder/Decoder for Data Correlation - In-line Port Configuration for Transparent AnalyzerSupports multiple ULPs including FC-AE-ASM, FC-AE-RDMA, FC-AE-1553, and FC-AV - Compatible with AIT’s fcXplorer GUI Bus Analyzer Software
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Product
Semiconductor
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Engineered ceramics are used in the semiconductor industry because of their excellent material properties. Ultra-pure ceramics are often used in the whole cycle of semiconductor manufacturing including Semiconductor Wafer & Wafer Processing, Semiconductor Fabrication (Front End), and Semiconductor Packaging (Back End).
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Product
CCD Foundry Services
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Teledyne DALSA Semiconductor’s 150mm CCD process offers surface or buried channel operation at up to 15V with two or three layers of polysilicon and one, two or three layers of metal. A modular processing approach allows our foundry customers to adjust process parameters to meet the most demanding requirements for CTE (>99.999%), charge storage capacity, and dark current (<1nA/cm2). The base process uses 1X projection lithography with 2.5µm design rules, allowing die sizes of up to 100mm X 100mm. Where required, tighter alignment tolerances and smaller feature sizes can be obtained by using 5X lithography, using a mix and match or all-stepper approach. The maximum die size attainable with the stepper is 22mm X 22mm, but larger sensors can be fabricated using stitching.
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Product
CompactPCI CPSB 2.16 6U 8 slot, 6 w/cPCI, 2 Fabric, no P2
107PS21608-0257R
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CompactPCI CPSB 2.16 6U 8 slot, 6 w/cPCI, 2 Fabric, no P2, fully compliant to the PICMG 2.16 Packet Switching Backplane specification.
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Product
3-Channel 200 MHz A/D and 2-Channel 800 MHz D/A with Virtex-6 FPGA - 3U VPX
Model 52620
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- Complete radar and software radio interface solution- Supports Xilinx Virtex-6 LXT and SXT FPGAs- Supports gigabit serial fabrics including PCI Express, Serial RapidIO and Xilinx Aurora- Three 200 MHz 16-bit A/Ds- One digital upconverter- Two 800 MHz 16-bit D/As- Up to 2 GB of DDR3 SDRAM or 32 MB of QDRII+ SRAM- Sample clock synchronization to an external system reference- LVPECL clock/sync bus for multimodule synchronization- Optional LVDS connections to the Virtex-6 FPGA for custom I/O- 3U VPX form factors provides a compact, rugged platform- Compatible with several VITA standards including: VITA-46, VITA-48 AND VITA-65 (OpenVPX™ System Specification)- Ruggedized and conduction-cooled versions available- Synchronize up to eight modules with Model 7893 System Synchronization and Distribution Amplifier - PCIe
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Product
Optical Thin-Film Metrology for Advanced Thin Films
FilmTek 6000 PAR-SE
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Scientific Computing International
Production-proven metrology system for film thickness, refractive index and stress measurement for a broad range of film layers at the 1x nm design node and beyond. Accommodates 200 or 300 mm wafer metrology. Combines spectroscopic ellipsometry and DUV multi-angle polarized reflectometry with a wide spectral range to meet the challenging demands associated with multi-patterning and other leading-edge device fabrication techniques.
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Product
cPSB 2.16 4 slot - 3 w/cPCI, 1 FS
107PS11604-0157R
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CompactPCI CPSB 2.16 6U 4 slot, 3 w/cPCI, 1 Fabric, fully compliant to the PICMG 2.16 Packet Switching Backplane specification.
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Product
Chip Manufacturing
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KLA’s advanced process control and process enabling solutions support integrated circuit manufacturing. Using KLA’s comprehensive portfolio of defect inspection, review, metrology, patterning simulation, in situ process monitoring and data analytics systems, IC manufacturers can manage yield and reliability throughout the chip fabrication process - from research and development to final volume production. SPTS provides deposition process solutions for insulating materials and conducting metals that cover a range of chip manufacturing process steps. IC manufacturers use KLA's array of products and solutions to help accelerate their development and production ramp cycles, to achieve higher semiconductor die yield and improved IC quality, and to improve overall profitability in the IC manufacturing process.
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Product
Moisture Management Tester
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Sataton Instruments Technology CO., Ltd
Moisture management tester (MMT) is the tool for the measurement, evaluation and classification of liquid moisture management properties of textile fabrics. By testing the changes in electrical resistance of textiles placed between two horizontal electrical sensors with concentric pins, the tester can calculate fabric liquid moisture content changes that quantify dynamic liquid moisture transport behaviors in multiple directions of the specimen. The software of tester can grade the liquid moisture management properties of a fabric by using the predetermined indices. The tester is used to determine the liquid moisture management properties of knitted, woven and nonwoven textiles, and also can be used to test the one-way transport capability of diapers.
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Product
Easy-to-assemble and Collapsible RF Test Enclosure With Fabric Shielding, ≥ 90 DB Isolation, 300 MHz - 18 GHz
dbTENT
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The dbTENT is an easy-to-assemble, store and transport high-performance RF test enclosure. Whether you need to make measurements in the field or in the lab, the dbTENT provides superior 90 dB of isolation over a wide frequency range thanks to its patented double layer conductive fabric design. Featuring an interchangeable customisable I/O panel, the dbTENT meets all your needs for non-permanent isolated testing. With a setup time of only minutes, the dbTENT will get you ready for testing instantly in a wide variety of environments.
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Product
SPI Flammability Tester (Vinyl Material)
TF318
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TESTEX Testing Equipment Systems Ltd.
SPI Flammability Tester (Vinyl Material), to determine the ignition properties of vinyl plastic film material according to CFR 16 Part 1611 U.S.A. Flammable Fabrics Act for flammability of apparel vinyl plastic film.The rate of burning shall not exceed 1.2 in./s as judged by the average of five determinations lengthwise and five determinations transverse to the direction of processing, when specimen is placed at an angle of 45 degree and expose to the standardized flame (22# fire nozzle, 1/2 inch. In length).
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Product
Plano Optical Substrate Fabrication
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Keysight has the technology and expertise to fulfill all your requirements for precision plano substrates up to 300mm:
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Product
LVDS Digital I/O with Kintex UltraScale FPGA - XMC
Model 71810
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- Jade Xilinx Kintex UltraScale FPGA Products and Navigator Design Suite Software Video- Jade Xilinx Kintex UltraScale FPGA Family Brochure- Supports Xilinx Kintex Ultrascale FPGAs- Front panel digital I/O can be used as a status and control or data interface- PCI Express (Gen. 1, 2 & 3) interface up to x8- VITA 42.0 XMC compatible with switched fabric interfaces- Optional LVDS and gigabit serial connections to the FPGA for custom I/O- Ruggedized and conduction-cooled versions available
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Product
Circular Locus Tester
TF225
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TESTEX Testing Equipment Systems Ltd.
Circular Locus Tester, to determine surface deterioration and quality of fabrics (wool, chemical fiber, mixed, kitted and woven fabrics). Using an active friction system, fabric is rubbed against a nylon brush and abrasive or an abrasive only under controlled conditions. Results of the test are achieved in minutes. The relative motion of the locus specimen grip and the abrasive platform is a circle with a relative speed of 60+/-1 r/min. The grip offers pressure to the specimen which is adjustable with a tolerance of +/-1%. For added control and safety, the machine is equipped with a self-stop switch.
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Product
Multi-Fabric Switch
PEX431
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Designed to enable the development of complex, scalable, high performance 3U VPX systems in today’s increasingly-connected military/aerospace world, the PEX431 is characterized by significant flexibility. The PEX431 Multi-Fabric Switch and XMC Carrier Card allow designers to build complex VPX systems with multiple single board computers and multiple I/O modules. PEX431 supports PCIe switching, GigE switching and the ability to host a XMC mezzanine.
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Product
2-Channel 500 MHz A/D and 2-Channel 800 MHz D/A with Virtex-6 FPGA - XMC
Model 71650
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- Complete radar and software radio interface solution- Supports Xilinx Virtex-6 LXT and SXT FPGAs- Two 500 MHz 12-bit A/Ds- One digital upconverter- Two 800 MHz 16-bit D/As- Up to 2 GB of DDR3 SDRAM or 32 MB of QDRII+ SRAM- Sample clock synchronization to an external system reference- Front panel clock/sync bus for multimodule synchronization- PCI Express (Gen. 1 & 2) interface up to x8 wide- VITA 42.0 XMC compatible with switched fabric interfaces- Optional user-configurable gigabit serial interface- Optional LVDS connections to the Virtex-6 FPGA for custom I/O- Synchronize up to eight modules with Model 7893 System Synchronization and Distribution Amplifier - PCIe
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Product
Multi-purpose Textile Flammability Tester
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TESTEX Testing Equipment Systems Ltd.
Multi-purpose Textile Flammability Tester, to determine the flammability resistance of textile fabrics and for the flammability test of toys and toy material. Multi-purpose Textile Flammability Tester complies with ISO 6940 (1995&2004) / 6941 (1995&2003), ISO 15025, EN71-2, etc. Please contact us for more information about flammability test method.
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Product
RF Power Transistors
Silicon Bipolar
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Macom Technology Solutions Holdings Inc.
At MACOM we offer a broad range of silicon bipolar transistor products designed for applications ranging from DC to 3.5 GHz. Our silicon bipolar transistors are ideal for civil avionics, communications, networks, radar, and industrial, scientific, and medical applications. Our all-gold metallization fabrication processes ensure high performance and long term reliability for ground and space applications.
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Product
SQUID Sensors
Magnetometers
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The famous cart-wheel design multiloop dc SQUID magnetometers, designed and fabricated by PTB-Berlin are available in three different sensitivities.
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Product
Fence Vibration Sensor
ENVIROMUX-FENCE1
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Detects when individuals climb over or cut through chain link or wire mesh fences. Advanced built-in signal processor prevents false alarms. Four sensitivity settings to tune each sensor to a particular fence section and intrusion type. Two open-collector outputs – alarm and power failure. UV resistant case and epoxy sealed electronics provides maximum resistance to harsh environments. Rated NEMA 4X and UL94 5V. Use individually or chain units with each ranging from 40 to 60 feet away. Includes mounting brackets for installing the sensor to fence fabric. Screw terminals. Operating temperature: -4 to 131°F (-20 to 55°C). Operating voltage: 9-15V DC.
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Product
8-Channel 250 MHz A/D with DDC, Kintex UltraScale FPGA - XMC
Model 71131
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- Jade Xilinx Kintex UltraScale FPGA Products and Navigator Design Suite Software Video- Jade Xilinx Kintex UltraScale FPGA Family Brochure- Complete radar and software radio interface solution- Powerful Xilinx Kintex UltraScale FPGAs- Eight 250 MHz 16-bit A/Ds- Eight multiband DDCs (digital downconverters)- 5 GB of DDR4 SDRAM- Sample clock synchronization to an external system reference- LVPECL clock/sync bus for multimodule synchronization- PCI Express (Gen. 1, 2 & 3) interface up to x8- VITA 42.0 XMC compatible with switched fabric interfaces- Optional LVDS and gigabit serial connections to the FPGA for custom I/O- Ruggedized and conduction cooled versions available
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Product
144-lane, 72-port, PCI Express
PEX89144
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The new PCIe Gen 5.0 (32 GT/s) PEX89000 series builds on the longevity of the Broadcom series of switches, now spanning 13 families. The PEX89000 family allows customers to build systems from simple PCIe connectivity inside the box to high-performance, low-latency, scalable, cost-effective PCIe fabrics for composable hyperscale compute systems supporting ML/AI and Server/Storage applications.
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Product
Shrinkage Template Scale
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TESTEX Testing Equipment Systems Ltd.
Shrinkage Template Scale, suitable for all shrink testing standards. Shrinkage Template Scale complies with AATCC 135/150/160/179, BS EN 3759, ISO 3759, etc. Welcome to contact us if you have any problems about fabric shrinkage test method.
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Product
Chassis 8 Slot
PXIe 4U/ 42HP
Chassis
As PXI has evolved into high-speed serial fabric technology, so has the Hartmann Electronic product line with the addition of its PXIe solutions. More power, more bandwidth, more functionality.
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Product
Propeller Meters
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Measures accurately over a flow range of 10:1 or greater.± 2% of rate accuracy, guaranteed by certified wet calibration at three test points in.Sparling’s National Institute of Standards and Technology (NIST) traceable hydraulic flow lab.Sturdy cast or fabricated steel construction.Operating temperatures are over 100° F(unless higher temperature construction is specified).Suspended solids are over 0.5% of volume.Easily maintained with standard tools.Registration can be furnished in any standard Engineering Unit.
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Product
Yarn Count Tester
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TESTEX Testing Equipment Systems Ltd.
Yarn Count Testing Machine, automatically calculates count systems used for sliver, roving and yarn, and can also be used for fabric yield. Yarn Count Tester consists of an accurate electronic balance with a capacity of 400g or 200g x 0.001g and built-in calculating program. Please contact us if you want to know more about yarn count test method.
