-
Product
High-Speed Switching Diodes 33 To 140 GHz
-
Insight Product Company offers high-speed switching diodes with switching time up to 2 nsec and operating frequency range up to 140 GHz. Silicon p+-p-n-n+ high-speed switching diodes are designed to be used in mm-wave switching devices, phase changers, modulators, attenuators for the millimeter wavelength range. They are fabricated in the metal-ruby packages with hard-lead carrier (diameter 3.0 mm, 1.5 mm).
-
Product
Semiconductor
-
Engineered ceramics are used in the semiconductor industry because of their excellent material properties. Ultra-pure ceramics are often used in the whole cycle of semiconductor manufacturing including Semiconductor Wafer & Wafer Processing, Semiconductor Fabrication (Front End), and Semiconductor Packaging (Back End).
-
Product
EMC Technology Services
-
Our experienced and professionally trained technicians have the skills and background required to fabricate nearly any type of cable. EMC technicians are certified to the J-STD-001 standard biannually.
-
Product
49 lane, 13 port, PCI Express
PEX 9749
-
Broadcom has extended the reach of PCIe for use as a fabric for data center and cloud computing through its ExpressFabric initiative and platform of hardware and software. ExpressFabric can eliminate expensive bridging devices within the rack, such as adapter cards that translate native PCIe to Ethernet and back to PCIe.
-
Product
NVM Express
-
NVM Express is a scalable host controller interface designed to address the needs of Enterprise, Data Center and Client systems for supporting chip-to-chip, board-to-board, adapter and distance solutions. The protocol can efficiently use interconnect and fabric technologies such as PCI Express, Ethernet and Fibre Channel. Teledyne LeCroy provides protocol analysis, emulation, exerciser and other test equipment to service all NVMe storage applications.
-
Product
Process EDXRF Spectrometer
NEX LS
-
Applied Rigaku Technologies, Inc
Featuring advanced third generation EDXRF technology, the Rigaku NEX LS represents the next evolution of scanning multi-element process coatings analyzers for web or coil applications. To deliver superior analytical performance and reliability, the EDXRF measuring head assembly was derived from the established Rigaku NEX Series high-resolution benchtop instrumentation. With this proven technology, the Rigaku NEX LS delivers rapid, non-destructive, multi-element analyses — for coat weight, coating thickness and/or composition — for elements from aluminum (Al) through uranium (U). The measuring head is mounted on a rigid beam and is equipped with a linear traversing mechanism positioned over a roller so that the head-to-surface distance is constant. Common applications include silicone release coaters, converters, denesting Si for vacuum-formed plastics, RoHS compliance, conversion coatings, metalized plastic, top coatings on metal coil and fire retardants on fabric.
-
Product
1-Ch. 6.4 GHz or 2-Ch. 3.2 GHz A/D, 2-Ch 6.4 GHz D/A Kintex UltraScale - XMC
Model 71141
-
- Jade Xilinx Kintex UltraScale FPGA Products and Navigator Design Suite Software Video- Jade Xilinx Kintex UltraScale FPGA Family Brochure- Ideal radar and software radio interface solution- Supports Xilinx Kintex UltraScale FPGAs- Supports VITA-49.2 VITA Radio Transport standard- One-channel mode with 6.4 GHz, 12-bit A/D- Two-channel mode with 3.2 GHz, 12-bit A/Ds- Programmable DDCs (Digital Downconverters)- Two 6.4 GHz, 14-bit D/As- Programmable DUCs (Digital Upconverters)- 5 GB of DDR4 SDRAM- µSync clock/sync bus for multimodule synchronization- PCI Express (Gen. 1, 2 & 3) interface up to x8- VITA 42.0 XMC compatible with switched fabric interfaces- Optional LVDS and gigabit serial connections to the FPGA for custom I/O- Ruggedized and conduction cooled versions available- Synchronize up to four modules with Model 7192 System Synchronization and Distribution Amplifier - PMC/XMC- Synchronize up to twelve modules with Model 9192 System Synchronization and Distribution Amplifier- 1U Rack-mount
-
Product
SmartPower® Intelligent Microwave Generators
-
SmartPower® AX2500 Series intelligent microwave power generators are built on proven experience in designing rugged, reliable microwave power generators for demanding semiconductor fabrication and industrial applications. The compact AX2500 design architecture incorporates field-proven technology, and combines new design features aimed at improved performance and lower cost of ownership.
-
Product
Powered VXS Crates
-
VXS - "VME-bus switched serial" is the new ANSI / VITA 41 standard which combines the 32-bit parallel VME-bus with high speed switched serial interconnect fabrics in order to increase the data transfer bandwidth to several GB/s.
-
Product
Spray Rating Tester
TF160
-
TESTEX Testing Equipment Systems Ltd.
Spray Rating Tester, to determine the surface wetting resistance of fabrics, which may or may not have been given a water-resistant or water-repellent finish.
-
Product
Ultrasonic Welding
-
It is an ultrasonic plastic welder which utilizes ultrasonic vibration energy to perform secondary processing of plastic(resin). It can be used not only for resin welding but also for various purposes such as resin caulking, fusing and cutting of non-woven fabrics, hood cutting, and packaging processing.
-
Product
Highly Accelerated Life Testing (HALT)
-
Quickly validate reliability and identify manufacturing defects that could cause product failures in the field with MET’s Highly Accelerated Life Test (HALT)HALT technique uses a combination of accelerated stresses to expose product flaws early in the design and manufacturing stages, which improves product reliability and customer confidence inherent to the design and fabrication process of a new product as well as during the production phase to find manufacturing defects that could cause product failures in the field.
-
Product
3-Channel 200 MHz A/D and 2-Channel 800 MHz D/A with Virtex-7 FPGA - XMC
Model 71720
-
- Complete radar and software radio interface solution- Supports Xilinx Virtex-7 VXT FPGAs- GateXpress supports dynamic FPGA reconfiguration across PCIe- Three 200 MHz 16-bit A/Ds- One digital upconverter- Two 800 MHz 16-bit D/As- 4 GB of DDR3 SDRAM- Sample clock synchronization to an external system reference- LVPECL clock/sync bus for multimodule synchronization- PCI Express (Gen. 1, 2 & 3) interface up to x8- VITA 42.0 XMC compatible with swtiched fabric interfaces- Optional user configurable gigabit serial interface- Optional LVDS connections to the Virtex-7 FPGA for custom I/O- Supports GateXpress® FPGA-PCIe Configuration Manager- Synchronize up to eight modules with Model 7893 System Synchronization and Distribution Amplifier - PCIe
-
Product
L-Band RF Tuner and 2-Channel 200 MHz A/D with Virtex-6 FPGA - XMC
Model 71690
-
- Accepts RF Signals from 925 MHz to 2175 MHz- Programmable LNA boosts LNB (low noise block) antenna signal - levels with up to 60 dB gain- Programmable analog downconverter to I + Q baseband signals - 4 to 40 MHz bandwidth- Two 200 MHz 16-bit A/Ds digitize the I + Q signals synchronously- Supports Xilinx Virtex-6 LXT and SXT FPGA- 2 GB DDR3 SDRAM or 32 MB of QDRII+ SRAM- Sample clock synchronization to an external system reference- PCI Express (Gen. 1 & 2) interface, up to x8- Clock/sync bus for multimodule synchronization- VITA 42.0 XMC compatible with switched fabric interfaces- Optional user-configurable gigabit serial interface- Optional LVDS connections to the Virtex-6 FPGA for custom I/O- Synchronize up to eight modules with Model 7893 System Synchronization and Distribution Amplifier - PCIe
-
Product
Impedance Measurement
CITS880s
-
Finer geometries and thinner copper can present a challenge for fabricators measuring impedance on leading edge PCBs. The CITS880s answers that challenge with the introduction of Launch Point Extrapolation (LPE). LPE extrapolates the TDR response back to a point close to the start of the transmission line effectively allowing to users more accurately to measure the instantaneous or incident impedance of the line.
-
Product
AdvancedTCA® Carrier Blade with 4x Intel® Xeon® Processor E3-1515M v5 COM Express Modules and FM10420 Multi-Host Controller
aTCA-9400
Processor Blade
- 4x COM Express Type 6 module slots supporting ADLINK Express-SL/SLE with Xeon® Processor E3-1515M v5 (45W)- Integrated Intel® GT4e GPU providing high-performance H.264/H.265 transcoding- COMe modules connected by Intel® Ethernet Multi-host Controller FM10420, supporting up to 25Gbps Ethernet bandwidth between CPUs- 2x 10G SFP+, 4x 1G RJ-45 Ethernet on front panel- 2x 10G to Fabric channels, 2x1G to Base channels
-
Product
32-lane, 32-port, PCI Express
PEX89032
-
The new PCIe Gen 5.0 (32 GT/s) PEX89000 series builds on the longevity of the Broadcom series of switches, now spanning 13 families. The PEX89000 family allows customers to build systems from simple PCIe connectivity inside the box to high-performance, low-latency, scalable, cost-effective PCIe fabrics for composable hyper-scale compute systems supporting ML/AI and Server/Storage applications.
-
Product
6U VPX Intel Core i7 Broadwell SBC
VPX6-1959
-
Curtiss-Wright Defense Solutions
The VPX6-1959 rugged, high performance 6U OpenVPX Single Board Computer (SBC) combines Intel's powerful Core i7 processor with the power and flexibility of the VPX platform's high speed fabric interconnects.
-
Product
Single-Tenant Colocation Cabinets
SmartCabs
-
Benefit from the scale and speed of the cloud while still retaining the control, performance, and security of a dedicated infrastructure. SmartCabs are single-tenant colocation cabinets that come complete with built-in power and network connectivity as well as access to the Digital Exchange, our configurable core network fabric.
-
Product
VXS Backplanes
-
VXS (VME Switched Serial) represents an extension of the VME family according to VITA 41.0. This system is downward-compatible, so that assemblies with VME 96-pin connectors can still be used, while adopting the use of serial signals such as Gigabit Ethernet, PCI Express, Serial RapidI/O, and other fabrics.
-
Product
97 lane, 25 port, PCI Express
PEX 9797
-
Broadcom has extended the reach of PCIe for use as a fabric for data center and cloud computing through its ExpressFabric initiative and platform of hardware and software. ExpressFabric can eliminate expensive bridging devices within the rack, such as adapter cards that translate native PCIe to Ethernet and back to PCIe.
-
Product
Wafer Manufacturing
-
Scientific Computing International
A procedure composed of many repeated sequential processes to produce complete electrical or photonic circuits on semiconductor wafers in semiconductor device fabrication process.
-
Product
High Performance Computing
-
We have a strong and wide-reaching industry reputation and participates in many industry organizations including the Open Fabrics Alliance (OFA), the Ethernet Alliance, and the InfiniBand Trade Association (IBTA).
-
Product
45 Degree Flammability Tester
TF310
-
TESTEX Testing Equipment Systems Ltd.
45 Degree Flammability Tester, is to determine the fabric flammability (fabric burning test) under controlled conditions, complies with standards like 16 CFR Part 1610, ASTM D1230, ASTM F2100.
-
Product
EEE Component Testing and Screening Services
-
DPACI performs 100% screening as well as qualification testing on electronic parts supplied to the high reliability commercial, industrial, space, and U.S. military sectors. We generate software and hardware to test microcircuits, discrete semiconductors, hybrids, PEMS, and other EEE electronic components to exact customer and military specifications. Our engineering experience in electronic parts screening, qualification, and in-house test fixture fabrication allows us to provide value added components in a timely manner.
-
Product
Plano Optical Substrate Fabrication
-
Keysight has the technology and expertise to fulfill all your requirements for precision plano substrates up to 300mm:
-
Product
FEA and Strain Gauge Testing
-
Circuit Check began Strain Gauge Testing in 1999 when BGA/SMT technology started replacing PTH components, reducing strain levels was a reactive post fixture fabrication process. We quickly recognized that the “reactionary” process was neither efficient nor were we capable on knowing the lowest achievable strain levels. Our engineering team came up with visual tools utilized during design to easily identify areas of excessive probe force, though still not enough data was generated to identify the lowest possible strain. Finite Element Analysis software models the PCBA and test fixture and applies the pressures from test probes and board supports and indicates the micro strain level applied to the PCBA. Using the FEA software during our design process allows our engineers to modify fixture designs to attain the lowest possible micro strain before fabrication begins.
-
Product
Portable Manual Probing Station
Model W4.0 x L6.5
-
This portable manual probing station is designed for a versatile, comfortable, and accurate operation on up to 4.0” wafers or 4.0” X 6.5” printed circuit board assemblies. This turn-key, manually operated probing station, model W4.0 x L6.5, is part of the D-COAX commitment to the test and measurement and PCB fabrication industries.
-
Product
Automated Monitoring of Airborne Molecular Contamination
AMC-Monitor T-1000
-
The all-in-one analyzer for FOUP, fab and clean-room environment AMC monitoring in the semiconductor industry. The AMC-Monitor is a modular and flexible platform for airborne molecular contaminations (AMC) monitoring in semiconductor applications such as: FOUP analysis with a focus on VOC and condensables incl. full integration with Pfeiffer Vacuum APA 302 pod analyzer. Clean-room monitoring in fabrication plants.
-
Product
Star Fabric to PXI Module
41-921-001
Chassis
This module resides in the Slot 1 position of a PXI chassis and interfaces to the backplane of the PXI chassis. When located in a generic peripheral slot, it can be used to drive two extension PXI chassis.
