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32GB SO-DDR4-3200 2GbX8 1.2V ECC Samsung Chip
AQD-SD4U32GE32-SB
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32GB, Speed 3200MHz, 30u" Gold Plating Thickness, Anti-sulfurization resistance, ECC.
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LGA 4094 AMD® EPYC™ 7003 ATX Server Board with 8x DDR4, 5x PCIe 4.0 x16 + 2x PCIe 4.0 x8, 9x SATA 3, 5x USB 3.0, Dual 10GbE, and IPMI
ASMB-830
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- LGA 4094 (Socket SP3) ATX server board with AMD EPYC™ 7003 processor- DDR4 3200 MHz RDIMM up to 128GB per DIMM- Features 5x PCIe 4.0 x16, 2x PCIe 4.0 x8- Intel® X550 dual 10GbE ports- Eight (via SFF-8643 connector) + one SATA 3 and two M.2 connectors (SATA/PCIe 4.0 compatible)- 0 ~ 60 °C/ 32 ~ 140 °F ambient operating temperature range
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Industrial Memory
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Advantech SQRAM Industrial Memory solutions offer an extensive portfolio of industrial grade DRAM solutions, such as UDIMM, SODIMM, ECC-DIMM, RDIMM, and LRDIMM designed according to the JEDEC standards and cover all technologies including DDR, DDR2, DDR3, DDR4 in wide temp ranges (-40 to 85°C).
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1U Intel® Xeon® Scalable GPU Server With 1x Double-Deck Or 5x Single-Deck PCIe Cards For High-Density AI Inference And Video Analytics.
SKY-6100
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Processor: Dual 2nd Gen Intel Xeon scalable processorsMemory: 8 x DDR4 2666/2933 MHz ECC RDIMM/LRDIMM / Intel Optane DC Persistent Memory, up to 2TBRemote Management: IPMI function supportExpansion: Supporting 1 x PCIe x16 double-deck FH/FL card + 1 x PCIe x16 single-deck FH/HL card or 5 x PCIe x16 single-deck cardsPSU: 1200W 1+1 redundant power supply with 80 PLUS Platinum level certification
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8 Channel A/D & D/A Zynq UltraScale+ RFSoC Gen 3 Processor - SFF Subsystem
Model 6353S
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- Complete RF converter and processing subsystem- Rugged and conduction-cooled- Ideal for integration into custom enclosures- Incorporates Xilinx® Zynq® UltraScale+™ Gen 3 RFSoC- 16 GB of DDR4 SDRAM- Navigator® BSP for software development- Navigator® FDK for custom IP development- Pentek's Quartz Family of Xilinx Zynq UltraScale+ RFSoC FPGA Products Video- Live Signal Acquisition Video: Quartz Model 5950 and Model 6001 RFSoC boards- Pipeline Newsletter: Strategies for Deploying Xilinx's Zync UltraScale+ RFSoC- Please refer to the product datasheet for Installed FPGA IP Module details
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1-Ch 3.6 GHz or 2-Ch 1.8 GHz 12-bit A/D with DDC, Kintex UltraScale - 6U VPX
Model 57841
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- Jade Xilinx Kintex UltraScale FPGA Products and Navigator Design Suite Software Video- Jade Xilinx Kintex UltraScale FPGA Family Brochure- Ideal radar and software radio interface solution- Supports Xilinx Kintex UltraScale FPGAs- One-channel mode with one 3.6 GHz, 12-bit A/D- Two-channel mode with two 1.8 GHz, 12-bit A/D- Programmable DDCs (Digital Downconverter)- 5 GB of DDR4 SDRAM- µSync clock/sync for multiboard synchronization- PCI Express (Gen. 1, 2 & 3) interface up to x8- Optional LVDS and gigabit serial connections to the FPGA for custom I/O- Compatible with several VITA standards including: VITA-46, VITA-48 and VITA-65 (OpenVPX™ System Specification)- Ruggedized and conduction-cooled versions available- Synchronize up to twelve modules with Model 9192 System Synchronization and Distribution Amplifier- 1U Rack-mount
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2U Rackmount Network Appliance With Dual 3rd Gen Intel® Xeon® Scalable Processors, Up To 8 NMC Slots. Ideal For Enterprise Network Security.
FWA-6171
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Dual 3rd Gen Intel® Xeon® Scalable Processors, up to 38 Cores32 x DDR4 ECC RDIMM slotsHot-swap 2.5" disk bays and system fan, redundant PSU, 1 x FH/HL Gen4 PCIe x16 slotRedundant BIOS and BMC imageIPMI v2.0 compliant, with web interface8 x Advantech network module expansions w/ PCIe Gen4 bandwidth
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6x 3U OpenVPX MOSA Data Concentrator Unit
SIU36-DCUVARM-01
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SIU36-DCUVARM-01 is a Modular Open Systems Approach (MOSA) DO-178C & DO-254 Certifiable Data Concentrator Unit (DCU) with low power high performance OpenVPX Xilinx UltraScale+ SBC with Quad Core ARM Cortex -A53, 8 GB DDR4 SDRAM, 32 GB SATA Flash, 2 x 10/100/1000Base-T Ethernet, USB 3.0, FIPS-140-3 Level 3 Cyber Security, and Single Event Upset support.
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Multi-site Module Testing System
TCIII-3200ST
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TurboCATS introduces a new line of redesigned TCIII-3200ST DDR4 and DDR3 multi-site module testing system - compact, high-performance, and equiped with enhanced productivity features. The TurboCATS TCIII-3200ST module test system features an optional 8, 16 or 64 module testing, in parallel, for high throughput on your production floor.
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Embedded System Support Intel® 12th/ 13th/ 14th Gen. Core I9/i7/i5/i3 Platform
EPC-B2208
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Support Intel 12th/ 13th/ 14th Gen. Core i9/i7/i5/i3.Two DDR4 3200MHz SODIMM and up-to 64GB.Supports triple independent displays of 2x DP/HDMI/LVDS.One low-profile PCIe expansion slot.
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COM Express Compact Size Type 6 Module with 11th Gen Intel® Core™ and Celeron® Processors (formerly codename: Tiger Lake-UP3)
cExpress-TL
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ADLINK cExpress-TL,based on the 11th Gen Intel® Core™ i7/i5/i3 and Celeron™ processor, is the first COM Express module to support PCI Express Gen 4 at 16 GT/s, effectively doubling the bandwidth of previous generations. Additionally if features support for 2.5GbE Ethernet, leveraging existing Cat5e cable infrastructure being used for 1GbE Ethernet, it supports four USB 3.2 ports with transfer rates up to 10Gb/s. The modules have a configurable power range of 15 to 28 watts, which suits them for fanless space-constrained embedded applications. Typical industries in need of such high-performance/low-power characteristics are transport, medical, industrial automation and control, edge controllers, robotics and multi-camera-based AI. cExpress-TL features the Intel® Iris® Xe, a new graphics core, and supporting AVX-512 Vector Neural Net Instructions (VNNI) can significantly improve the number of elements processed per cycle, providing AI inferencing performance that is up to 3x that of previously available from non-VNNI platforms. Intel® Iris® Xe provides 96 execution units and is able to be configured to support two 8K independent displays or four 4K independent display (HDMI/DP/eDP). Additional support includes In-Band ECC (IBECC), providing ECC level error correction on DDR4 SODIMM memories for mission critical or rugged applications.
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Embedded System supporting FHFL dual-width PEG slot with 8th/9th Generation Intel® Core™ i7/i5/i3 in LGA1151 Socket
DLAP-4000 Series
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- NVIDIA® Quadro® PEG card support- 8th/9th Gen Intel® Core™ i7/i5/i3 processor- Dual SODIMMs for up to 32GB DDR4 non-ECC memory (dependent on CPU)- 1x DVI, 1x HDMI, 1x DP (from CPU), additional display outputs from PEG cards- 1x Mini PCIe slot for Wi-Fi/Bluetooth or LTE module- 300W/500W Flex ATX PSU
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32GB DDR4-3200 2GbX8 1.2V ECC Samsung Chip
AQD-D4U32GE32-SB
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32GB, Speed 3200MHz, 30u" Gold Plating Thickness, Anti-sulfurization resistance, ECC.
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Value Family 9th Gen Intel® Core™ i7/i5/i3® Processor-Based Embedded GPU/AI Platforms
MVP-5100-MXM Series
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- 9th Gen Intel® Core™ i7/i5/i3 LGA processor- Dual SODIMMs sockets for up to 32GB DDR4- Abundant I/O: Up to 4x additional DP 1.4 from MXM, 2x DP++, DVI, VGA, 3x GbE, 3x COM, TPM2.0- 3x USB 3.1 Gen 1, 3x USB 2.0- Rich storage options: 2x 2.5" SATA, M.2 2280
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DDR4 X16, 2-Wing, Small KOV, BGA Interposer For Logic Analyzers
W4636A
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The W4636A DDR4 x16 – 2 wing BGA interposer for 96 ball DDR4 DRAM is designed for data rates up to and including 2.4 Gb/s. The W4636A probes all ADD/CMD/CNTRL and partial DQ/DQS, and it is designed for minimal KOV for space limited systems under test. The W4636A is the least expensive DDR4 BGA interposer for a logic analyzer.
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Mini PC
DS-410
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Palm-sized mini PC designed for hospitality and signage applications. Stylish Aluminum Die-cast Design with Intel Atom® J6412 processor. Optimized GFX performace by on board 4GB/8GB DDR4 (3777Mhz). Support HDMI 2.0 up to 4K(3840 x 2160), and VGA up to Full HD.
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4G DDR4 2400 288Pin 512MBX8 1.2V Registered Samsung Chip
AQD-D4U4GR24-SG
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DDR4-2400 Registered DIMM. – standard height, 30μ" gold plating thickness (IPC-2221 Standard) 1.2V power consumption. Low-power auto self- refresh (LPASR) Provides better reliability, availability and serviceability (RAS) and improves data integrity.
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Rugged SODIMM DDR4 2666/3200
SQR-YD4N
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Robust PCB designed with Mounting Hole with Military MIL-810G verified. Extreme Data Transfer rate up to 3200 MT/s, Capacity: up to 32GB. Wide Temperature supported: -40°C ~ 85 °C, Original IC chip (Samsung/Hynix).
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7th Gen Intel Core Mobile Processors, I7, I5, I3 3.5" SBC W/ MIOe
MIO-5391
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7th Gen Intel Core i7/i5/i3 + PCH QM175Dual channel DDR4 2400, Max 32GB (ECC optional)1 Intel i210 GbE & 1 Intel i219 GbE support iAMT, rich I/O: 2COM, SATA, USB3.0, SMBus/I2C,16 bit GPIO full-size Mini PCIe or mSATA /M.2 E Key support NVME, 12V Power inputFull-size Mini PCIe or mSATA /M.2 E KeySupport NVME (optional)Supports iManager, SUSI APIs, WISE-DeviceOn and Edge AI Suite
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Product
Logic Analyzer Probe
FS2510AB
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The FS2510AB is a logic analyzer probe used to test DDR4 DIMM memory. When used with the triggering and analysis capabilities of Keysight’s U4154A/B/64A logic analyzer modules, it gives the user an effective tool for debugging, testing and verifying DDR4 DIMMs.
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Product
Server Boards
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Advantech Serverboards support Intel Xeon Processor, DDR4, IPMI 2.0 with iKVM and Quad LANs features. Our Serverboard enables various system configurations and diverse options of modules to help fulfill various field application.
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COM-HPC Server Type Development Kit based on Ampere® Altra® SoC
Ampere Altra Dev Kit
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Ampere Altra Dev Kit consists of a COM-HPC Server Base carrier paired with a COM-HPC Server Type Size E module and heatsink with fan. The module features Ampere® Altra® SoC (Arm Neoverse N1-based architecture) harnessing 32/64/96/128 Arm v8.2 64-bit cores for up to 1.7/2.2/2.8/2.6 GHz and providing support for up to 768GB DDR4 memory, offering unprecedented performance and power per watt with exceptional scalability.
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Product
16GB SO-DDR4-3200 1GbX8 1.2V ECC Samsung Chip
AQD-SD4U16GE32-SE
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16GB, Speed 3200MHz, 30u" Gold Plating Thickness, Anti-sulfurization resistance, ECC.
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Product
DDR4 MSO Probes
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The DDR4 DIIM and SO-DIMM Mixed Signal Interposers connect Address, Command and Control signals of a DDR4 bus to the Keysight V-Series Oscilloscopes with the MSO option. These interposers also provide accessibility to DDR4 signals for convenient analog probing. The user can then easily observe both the digital and analog representation of the DDR4 Address, Command and Control bus. Solder down N5541A analog probes purchased separately from Keysight Technologies.
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ATCA Rugged Blade Processor With Dual Xeon Cascade Lake-SP
ATC128
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The ATC128 is a high performance ATCA processor blade featuring dual 24 core Intel® Xeon® processors, each with six banks of memory providing up to a total of 384 GB DDR4 memory with ECC.
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Fanless Network Appliance For Edge Deployment With 5G And Wi-Fi6. Ideal For Edge Computing And 5G Network Infrastructure.
FWA-1212VC
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Intel Atom® C3336/C3558 network SoC with Intel® QuickAssist Technology1 x DDR4 2133/2400MHz, SODIMM (ECC optional) up to 16GB2 x 1GbE SFP/RJ-45 combo ports (auto-negotiation) + 4 x 1GbE RJ-45 LAN portsReserve 1 x M.2 3052/3042 / 1 x M.2 2230 and 1 x Mini-PCIe for RF module selectionDefault 16GB eMMC onboard
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DRAM SO-DIMM DDR4 Memory
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Improve performance up to 50% (compared to SO-DDR3.) with Advantech! We offer industrial grade SO-DDR4 2666/2400/2133 memory with 30μ" gold plating connector (260 pin) featuring 1.2v low operating voltage with faster burst accesses.
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Product
9th Gen Intel® Xeon®, Core™ i7/i3 and 8th Gen Intel® Core™ i5 Processor-Based Embedded Fanless Computer
MXC-6600 Series
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- 9th Gen Intel® Xeon®, Core™ i7/i3 and 8th Gen Intel® Core™ i5 Processor- Dual SODIMMs for up to 32GB DDR4- Rich I/O: 2x DP++, 1x HDMI, 2x GbE, 6x COM, 8-ch DI, 8-ch DO, TPM 2.0- 2x USB 3.1 Gen2, 2x USB 3.1 Gen1, 4x USB 2.0- Rich storage: up to 4 internal 2.5" SATA 6 Gb/s ports with RAID 0/1/5/10 support, CFast, M.2 2280
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Product
LGA 1200 Intel® Xeon® W & 10th Gen. Core™ MicroATX Server Board with 4 x DDR4, 3 x PCIe, 6 x USB 3.2, 5 x SATA3, Quad/Dual LANs, and IPMI
ASMB-587
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- LGA 1200 Intel® Xeon® W and 10th Gen. Core™ i9/i7/i5/i3 processor with W480E chipset- DDR4 ECC/Non-ECC 2933/2666/2400 MHz UDIMM up to 128 GB- One PCIe x16 and 2 x PCIe x4 slots- Triple displays - DVI-D, VGA, and HDMI 2.0 ports- Five SATA 3 ports and six USB 3.2 ports- One M.2 22110/2280 (SATA / PCIe compatible)- 0 ~ 60 °C (32 ~ 140 °F) ambient operating temperature range
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Product
8GB DDR4 SODIMM-3200 1GbX8 SAM
AQD-SD4U8GN32-SE
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DDR4 3200Mhz Unbuffered SO-DIMM, 30u" Gold Plating Thickness, Anti-sulfurization resistance, 1.2V power consumption. Samsung original chip, 100% tested for stability, compatibility and performance.
