Thermal
The radiation of heat.
See Also: Energy, Chemical, Electrical, Nuclear, Electromagnetic, Thermal Shock, Thermal Test, Infrared
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Quality Control for more Precision in Press Hardening
PRESS-CHECK
The automated test system PRESS-CHECK works with two powerful high-end thermographic cameras for continuous measurement of two-dimensional temperature distribution. This measurement is carried out before the pressing operation on the surfaces of the boards to be processed and subsequently on the resulting molded parts, ultimately enabling exact compliance with the thermal process parameters.
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Probe Cards
Minitile™ with Advanced Cantilever™ technology and WedgeTile™
Each probe is designed for wide temperature ranges and so the probe expansion characteristics are closely matched to the wafer’s expansion characteristics. This allows the user to take a fast measurement while a system is in a settling or thermal stabilization mode and helps compensate for wafer expansion.
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MAX31855 T-Type Thermocouple Arduino Shield
SEN-30004-T03
Four channel MAX31855 digital thermocouple Arduino Shield. Two versions of this shield are avaliable for each thermocouple type: either 'Ch 0-3' (CS pins use Uno/Mega IO pins 7-10) or 'Ch 4-7' (CS pins use Uno/Mega IO pins 3-6), with the only difference being which set of zero-ohm resistors are populated on the board. This allows use of other SPI devices that may be 'hard coded' to specific digital pins on the Arduino, or simply stacking one of each type together to get a total of eight thermocouple channels on one Arduino.Each order comes with one board and a set of four female, long extension, headers that can be soldered to the board. If stacking two of these modules on top of each other, please order both a Ch 0-3 and a Ch 4-7 board, as well as an additional set of headers for stacking. We're working on sourcing even longer headers, but the ones currently available are not long enough to stack as-is (they need to be double-stacked).The MAX31855T supports a measured temperature range of -270C-400C with known thermal characteristics and output resolution of 0.25C. Included thermocouple connectors are type-specific to provide proper material continuity as close to the IC as possible. The SEN-30004 is interfaced via 3 or 4-wire SPI and a high-speed level shifter is included to allow the board to plug directly into an Arduino Uno or MegaNote: we also offer a universal version of this board in a smaller for factor, the SEN-30003-T.FeaturesType-specific, miniature-sized vertical thermocouple connectors (vertical flat blades, see pics)Measures four (4) thermocouple channels, full extended range.Boards are stackable. Up to 8 thermocouple channels may be connected to an Arduino.14-bit SPI interfacePlugs directly into an Arduino Uno or Mega form factor with built-in voltage level translation on-board.Standard Arduino female headers required for easy configuration, one set included with order (1-6x1, 2-8x1, 1-10x1 0.1" female stackable headers), not soldered on.Detects shorts to GND or VccDetects open thermocoupleOther versions available (K, J, and T stocked). Contact Customer Service to place a custom order.Mounting holes for 4-40 sized screwsConnections are spaced for 0.1" pin headerDesigned, manufactured, tested and shipped from the USA The MAX31855T supports a measured temperature range of -270C-400C with known thermal characteristics and output resolution of 0.25C. Included thermocouple connectors are type-specific to provide proper material continuity as close to the IC as possible. The SEN-30004 is interfaced via 3 or 4-wire SPI and a high-speed level shifter is included to allow the board to plug directly into an Arduino Uno or Mega
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Low Temperature MBE
Low-temperature processing systems make it possible to handle advanced, delicate materials without subjecting them to high heat. By maintaining gentle thermal conditions, they unlock new possibilities for working with polymers, flexible films and other materials that can’t tolerate the extreme temperatures of conventional processing.
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Quad-Core Intel® Atom™ Processor 3U CompactPCI® Card
MIC-3329
The Advantech MIC-3329 is based on Intel® Atom™ technology, previously codenamed Baytrail and is designed to provide balanced performance and power efficiency. The MIC-3329 is a 3U CompactPCI® processor blade designed for dual-core Intel® Atom E3826/E3827 and quad-core Intel® Atom E3845 processors, and up to 4GB soldered DDR3L-1066/1333 ECC memory. It is available in single and dual slot form factor, offering a range of I/O functionality by XTM (8HP) & Rear I/O extensions. Front panel I/O on the single slot (4HP) provides 2 x RJ45 GbE ports (Switchable with RIO 4HP),1 x VGA port (Switchable with RIO 4HP), 1 x USB2.0 port and 1 x USB3.0 port. Front panel I/O on the second layer (XTM) provides 2 x COM ports (RS232/422/485), 1 x PS/2 KB/MS and 1 x Audio ports or 2 x M12 GbE ports, 1 x COM ports (RS232/422/485). The MIC-3329 provides an ideal solution for transportation, railway and factory automation applications. Its robust design from a layout and thermals perspective allows it to meet or exceed EN50155 and EN50121-4 using a very low TDP selection of 7W/8W/10W processors. Its low power consumption and industrial SoC features make the MIC-3329 a perfect fit for all fanless system applications.
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TIM Tester
The Analysis Tech TIM Tester 1300 is an automated test system for measurement of thermal impedance and conductivity on thin, thermally conductive materials of the type frequently used for electronic packaging, as well as a wide variety of flexible or rigid solids and semi-liquid or viscous materials. Generally, the TIM Tester 1300 can accommodate samples with high-to-medium thermal conductivity with contact pressures ranging from 10 to 550 psi (70-3800 kpa) and at sample temperature ranging from 15C to 70C.
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Temperature Measurement IR Sensors & Detectors
ST120 TO-5
A single-channel silicon-based thermopile provides lowest cost solutions in a small active area of 1.2mm x 1.2mm in a TO-5 package. Time constant of 25ms with Nitrogen encapsulation gas. Delivers a very low Temperature Coefficient of Responsivity of -0.04%/C. This detector has a very short thermal shock response to ambient temperature change.
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Longwave Infrared (LWIR) Thermal Camera
Boson
Boson longwave infrared (LWIR) thermal camera cores set a new standard for size, weight, power, and performance. Imagine your next big idea, and bring it to life with Boson. FLIR’s XIR™ expandable infrared video processing architecture gives Boson advanced image processing, video analytics, peripheral sensor drivers, and several industry-standard communication interfaces that make it easy to integrate while keeping power consumption low.
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Aircraft Escape Systems
The Emergency Interseat Sequencing System (EISS) was designed an qualified for the F-15K Fighter and has since been installed in the F-15SG and F-15SA configurations of the F-15. The system consists of Thermal Batteries with Initiators, a Digital Interseat Sequencer, Mode Selector, and customer provided cabling Electro-Explosive Devices (EEDs). The system is operated from either thermal battery and aircraft 28Vdc for redundancy. A separate field Test Set (EESSTS) performs both complete system continuity tests and an operational test of the total system installed in the aircraft. The sequencer is programmable and could be used in any escape system.Based on the initiation point, Forward or Aft Seat Handle, Internal or External Canopy Jettison Handles, and the Mode Selector setting, the Sequencer provides firing pulses to the EEDs to support canopy removal, ejection seat inertial reel activation(s) and ejection seat catapult firing(s). Sensing capabilities are provided to determine system state, canopy gone, seat gone, so as to provide the optimum escape timing.
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Local Discomfort Temperature Probe
TP3227PC
Temperature probe composed of 2 independent probes, Pt100 sensor, used for measuring local discomfort due to vertical thermal gradient.
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Thermal Shock Testing
Thermal shock is a very important test for determining the reliability of a product when subjected to sudden changes in temperature and how this stress source can accumulate deterioration or physical damage in performance.
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CHNO Combustion Services
Carbon, Hydrogen, Nitrogen are determined using a 2400 Perkin-Elmer CHN Analyzer. This analyzer uses combustion to convert the sample elements to simple gasses, i.e. CO2, H2O, & N2. Upon entering the analyzer, the sample is combusted in pure oxygen environment at temperatures in the range of 1200-1500 F. The product gasses are separated under steady state conditions, and measured as a function of thermal conductivity.
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Grid-EYE High Performance Type
Panasonic Industrial Devices Sales Company of America
Panasonic's Grid-EYE® Series High-Performance Type is an 8x8 (64) pixel Infrared Array Sensor. This Sensor offers digital output (I2C) for thermal presence, direction, and temperature values. The built-in lens includes a 60-degree viewing angle. The Grid-EYE Sensor features compact SMD design using MEMS thermopile technology. This Sensor offers several advancements over the original Grid-EYE, including higher accuracy, enhanced resolution, and longer detection distance for true next-generation performance.
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EHV Circuit Breaker Analyzer
DigiTMR S2
The Vanguard DIGITMR S2 is an inexpensive, easy to use digital circuit breaker analyzer. The DIGITMR S2 can be operated stand-alone or can be computer-controlled. It can fully analyze a circuit-breaker’s performance by testing the contact time, stroke, velocity, over-travel, and contact wipe. Contact and motion analysis can be performed for all breaker contact operations (Open, Close, Open – Close, Close – Open, and Open – Close – Open). Timing results are recorded and displayed on the 240 x 128 pixels back-lit LCD screen and can also be printed on the built-in 4.5″ wide thermal printer.
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4-CH RTD Thermal Input EtherCAT Module
EPS-3504
ADLINK" s EPS slave system features modular design for flexible high channel density, rugged construction, easy maintenance, and intelligent performance, compatible with 3rd party EtherCAT products. Precise time-deterministic control enables I/O synchronization for critical applications, and FPGA and ARM technology allow users to fully monitor status of EPS modules and systems, including operating temperature and usage cycle of relay switching, as well as motion control status for general purpose motor drive control. In addition, the ADLINK EtherCAT configurator enables auto-scan and configuration across EtherCAT systems. The EPS" unique structural and electronic design supports hot-swappable function, reducing repair time, and the rugged construction and operating temperature range of -20°C to 60°C allow operation in the harshest environments.
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Solar Panel Testing Chamber
ZPH Series
CSZ's solar panel testing chambers aid in qualifying that modules can withstand the thermal stress caused by repeated changes in high and low temperatures along with exposure to high humidity. Unique air flow design and distribution ensures precise air flow required for solar panel testing.
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Pressure Transducers with Serial(485) Interface
P855
The Validyne model P855 is a digitally compensated differential pressure transmitter designed for industrial pressure measurement applications. The on-board microprocessor provides high accuracy and improved stability in changing thermal environments.
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MOSFETs
Vishay is one of the world's foremost manufacturers of power MOSFETs. The Vishay Siliconix MOSFET product line includes a diverse range of advanced technologies in more than 30 package types, from the chipscale MICRO FOOT® and thermally advanced PowerPAK® families to the classic “TO” transistor outline. Single- and multi-die MOSFETs are available with integrated features such as Schottky body diodes and ESD protection, while our unique PowerPAIR® devices combine optimized combinations of MOSFETs for synchronous buck converters and other applications in a single package.
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LXI EMR Low Thermal EMF Matrix 14x33
60-511-004
This high density 1-pole matrix has excellent thermal stability and substantially reduced thermal EMF figures when compared to a conventional switching matrix.
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Thermal Camera
The thermal camera allows real-time thermography with 100Hz frame rate via USB 2.0 interface. The camera is lightweight, compact and rugged (IP65). Measurement ranges of -20C to 100C, 0C to 250C, or 150C to 900C are selectable in software. Interchangeable lenses are available with 6x5, 23x17, 48x31 and 72x52 field of view.
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BGA Sockets
Ironwood has the most comprehensive collection of BGA (Ball Grid Array) sockets that can be used for prototype application, silicon validation, system development, thermal characterization, burn-in application, functional production test, etc. BGA socket can be defined as an electromechanical device, which provides removable interface between IC package and system circuit board with minimal effect on signal integrity. BGA sockets for prototype applications, silicon validations, system development applications uses low cost elastomer contact technology.
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Thermal Imaging Surveillance Cameras
Shenzhen Everbest Machinery Industry Co.,Ltd.
Visible light digital camera640x480 resolution with flash provides sharp images regardless of lighting conditionsPicture-in-pictureDisplays thermal image super-imposed over a digital imageLED flashlightAllows the visual camera and fusion to be used in poorly lit environmentsWide temperature range: -20 to 400°C targeting electrical and industrial applications±2% accuracy reliable temperature measurementThumbnail view: easy to view and analyze images quicklyThe image rotationThe ability to automatically rotate the active imageAudio recorded with the video imageA speaker to listen to audio recorded with the video imageCapacitive touchscreenMore easy, productive and effective to operate itLi-ion rechargeable batteryLasts >4hrs continuous use, replaceableCopy to USBEasy uploads images from camera to USB memory cardArea (minimum/maximum) modeShows the minimum or the maximumTemperature reading in the selected areaInside Memory 100M bytesData and Live video transform between camera and PC or smartphone
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SCOUT-16
The Phoenix Scout-16 is an excellent entry-level, lightweight system with a 40 meter recommended AGL. A strong fit for a smaller scan areas and teams on a budget, the Scout-16 also features options for photogrammetry, hyperspectral, thermal imaging, and more.
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Cryogenic ICP® Accelerometers
Cryogenic ICP® accelerometers are specifically designed to operate at temperatures below the typical -65 ºF (-54 ºC) temperature limit of most voltage mode sensors. The use of specialized, built-in, cryogenic circuitry and quartz shear sensing technology promote survivability in demanding environments such as liquid nitrogen. Each sensor is hermetically sealed and individually tested to determine the thermal coefficient of sensitivity at -320 ºF (-196 ºC) ensuring reliable operation and accurate measurements. These sensors have been successfully used in the presence of liquid helium during structural testing of rocket boosters.
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Dopant
In semiconductor manufacturing, electrical performance starts with atomic-level control. Dopant technologies make that possible by introducing carefully measured doping constituents that help devices conduct, switch and perform reliably. For precise control of fluxes for Molecular Beam Epitaxy (MBE) dopant constituents, or for gases that do not require thermal cracking, Veeco’s Dopant products are ideal.
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Thermal Imagers & Systems
Advanced Energy’s turn-key thermal imagers and systems accurately measure temperature and use reliable infrared technology. These high-tech instruments can precisely determine the temperature and temperature distribution of small and fast-moving objects.
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Thermal Profiler
KIC K2
The latest-generation mobile-friendly profiling technologyThe KIC K2 Thermal Profiler features a compact and robust design that allows it to fit through the tight, heated chambers of lead-free reflow ovens. A plug-and-play hardware and graphical user interface makes profiling both quick and easy. The profile data measured by the K2 can now be viewed on either a PC or on a mobile device using the Profile Viewer App.
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Fanless Vision System With LGA1151 Socket 7th/6th Gen Intel® Core™ I7/i5/i3 & Celeron® Processor, Intel® Q170, Vision I/O, 4-CH PoE And 4-CH LED Output
MVS900-512-FL
The CAPA500 features the LGA1151 socket 7th generation Intel® Core™ processor family (codename: Kaby Lake) with 35W TDP (thermal design power), as well as the Intel® H110 chipset (Q170 optional). The CAPA500 supports one 260-pin DDR4-2400 SO-DIMM with a memory capacity up to 16GB for extensive storage. The compact 3.5-inch embedded motherboard also offers display outputs through HDMI, VGA and LVDS for triple independent display applications. Moreover, the compact-sized embedded board runs on +12 VDC power, supporting auto power-on. It can operate at a wide range of temperatures from -20°C to 60°C under active thermal control. The 146 mm x 104 mm embedded SBC is suitable for IoT/M2M-related, industrial control, self-service terminal, digital signage, POS, kiosk and many other applications where high-speed processing and graphics performance under limited space is required.
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Mechanical Load Tester
Solar modules and collectors, whether on roofs, in façades, or freestanding, are often exposed to high mechanical stress or load: A deep layer of snow or strong winds can greatly affect the materials and connections. Mechanical load test stands accurately test the durability of PV modules and thermal solar collectors.
