Single Board Computers
Whole computer on one PCB.
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Computer-On-Module
Open Standard Module (OSM)
OSM form factor is the first computer-on-module form factor for solderable BGA mini modules that is natively capable of supporting both ARM and x86 designs. OSM modules are significantly smaller than previously available modules, with the largest measuring 45mm x 45mm. For a growing number of IoT applications this standard helps to combine the advantages of modular embedded computing with increasing requirements regarding cost, foot print and interfaces. The BGA design makes it possible to implement more interfaces on a small footprint. The largest Size-L (Large) measures 45mm x 45mm with 662 BGA pins. The modules are completely machine processible during soldering, assembly and testing.
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PXI FPGA Module
FIO168
Using OpenATE USB/PXI FPGA Carrier, you can develop your design to define custom I/O and control Hardware without prior knowledge PCI I/O and USB interface.
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COM Express Mini Size Type 10 Module with Intel Atom® E3900 Series, Pentium®, and Celeron® SoC (formerly Apollo Lake)
nanoX-AL
The nanoX-AL is a COM Express® COM.0 R3.0 Type 10 module supporting Intel Atom® processor E3900 series system-on-chip (SoC). The nanoX-AL is specifically designed for customers who need optmized processing and graphics performance with low power consumption in a long product life solution.
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COM Express R3.1 Type 6 Compact Size Module With X7000RE And X7000C Intel® Atom® Processors (Amston Lake)
cExpress-ASL
The cExpress-ASL is a COM Express® COM.0 R3.1 Type 6 Compact size module featuring up to 8 core, 64-bit real-time-capable (with Intel TCC and TSN support) Intel® Atom™ x7000RE and x7000C processors (formerly “Amston Lake”). The cExpress-ASL combined with soldered-down memory and extreme temperature option, is specifically engineered for customers who need entry-level computing with real-time prowess, a balanced cost structure, and extended product life support for ruggedized edge solutions running 24/7.
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4x 3U OpenVPX MOSA Mission Computer
SIU34-MCVARM-01
SIU34-MCVARM-01 is a Modular Open Systems Approach (MOSA) DO-178C & DO-254 Certifiable Mission Computers (MC) with low power high performance OpenVPX Xilinx UltraScale+ SBC with Quad Core ARM Cortex -A53, 8 GB DDR4 SDRAM, 32 GB SATA Flash, 2 x 10/100/1000Base-T Ethernet, USB 3.0, FIPS-140-3 Level 3 Cyber Security, and Single Event Upset support.
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COM Express Type 10 Reference Carrier Board
miniBASE-10R
The COM Express approach of custom carrier combined with off the shelf system cores is an excellent solution when you need to customize but lack the time or quantity for a complete redesign. It fits most system integration projects with production volumes from 500 to 10,000 pcs per year. The COM Express concept has a great many advantages over full custom designs, it reduces engineering complexity, lowers the threshold for total project quantity and last but not least brings your product to the market in no time. The average time to design a carrier board is less than half the time of a full custom OEM board.
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FPGA Board
VP889
The VP889 is a high-performance FPGA processing board featuring Xilinx® Virtex Ultrascale+™ and Zynq® Ultrascale+™ technology.
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6U CompactPCI Dual 64-bit PMC Slots Carrier Board
cPCI-8602
- Supports two single-size 32,64-bit/33,66 MHz PMC sites in 4HP width- PICMG® 2.0 32,64-bit/33,66 MHz cPCI bus- PICMG® 2.1 Hot Swap Specification Compliant- 3.3V or 5V V(I/O) for cPCI bus and PMC sites- PLX® PCI-to PCI bridge PCI6154 for PCI bus- Power and HotSwap LED incidators on front panel
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COM Express® Type 7 Reference Carrier Board in ATX Form Factor
Express-BASE7
The Express-BASE7 is an ATX size COM Express Type 7 reference carrier board. Together with the COM Express Type 7 module of your choice and off the shelf add-on cards, you can quickly emulate the functionality of your desired end product for software development and hardware verification.
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SMARC Short Size Module with Freescale i.MX6 Solo, DualLite, Dual or Quad Core Processor
LEC-iMX6
The SMARC ("Smart Mobility ARChitecture") is a versatile small form factor computer Module definition targeting applications that require low power, low costs, and high performance. The Modules will typically use ARM SOCs similar or the same as those used in many familiar devices such as tablet computers and smart phones. Alternative low power SOCs and CPUs, such as tablet oriented X86 devices and other RISC CPUs may be used as well. The Module power envelope is typically under 6W.
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3U CompactPCI Serial M.2/U.2/SATA Storage Carrier
cPCI-A3H20
- 1x NVMe M.2 and 1x NVMe U.2 drive slot- 1x optional SATA 6Gb/s M.2 drive slot shared space with NVMe U.2- Status LEDs on faceplate: drive activity, hot-swap status, user-configurable- Operating temperature: -40°C to +85°C with qualified modules- EN50155 compliant
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Qseven® Standard Size Module With Intel® 6th Gen. Atom® X6000 Processors (Formerly Elkhart Lake)
Q7-EL
The ADLINK Q7-EL is a Qseven module that supports Intel Atom® x6000 (x6425RE, x6414RE, x6413E) processors (formerly Elkhart Lake) with integrated Intel® UHD graphics and high-speed interfaces. With mechanical dimensions of 70mm width, 70mm length, and 2.3mm of overall height, Qseven ranks as one of the smallest COM standards currently available. Q7-EL modules support up 16GB LPDDR4 memory, up to 256GB eMMC storage and are also available with rugged operating temperature range and low power envelope, making them a perfect match for mission critical fanless edge computing applications that require safety and reliability at all times.
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COM Express Compact Size Type 6 Module With Intel Atom® Or Intel® Celeron® Processor SoC (Formerly Codename: Bay Trail)
cExpress-BT
The cExpress-BT is a COM ExpressR COM.0 R2.1 Type 6 module supporting the Intel Atom® processor E3800 Series and Intel® Celeron® N2900/J1900 processor SoC (codename: Bay Trail). The cExpress-BT is specifically designed for customers who need high-level processing and graphics performance with low power consumption in a long product life solution.
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Printed Circuit Board
RISER-PCM-1
WINSYSTEMS’ RISER-PCM-1 boards are designed to provide extra space in a PC/104 stack. They are printed circuit boards (PCBs) with PC/104 mounting holes and bus connectors. They allow a board with either tall components or heat sinks to be placed in a stack of boards in a location other than only at the top. The additional separation is 0.60 inches using standard PC/104-type spacers.
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Computer On Module
ITX-M-CC452-T10
The ITX-M-CC452-T10 is an industrial Mini-ITX small form factor Type 10 reference carrier board designed to fully test WINSYSTEMS’ COMeT10-3900 COM Express Type 10 Mini module. The carrier board adheres to the PICMG COM Express specifications providing compatibility with other COM Express mini type 10 modules.
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COM Express R3.1 Type 6 Compact Size Module Based On Intel® Core™ Ultra Processors
cExpress-MTL
Featuring Intel’s latest Intel® Core™ Ultra processors (formerly “Meteor Lake-U/H”), the cExpress-MTL, a COM Express® COM.0 R3.1 Type 6 Compact size module, presents Intel’s modular architecture that combines CPU+GPU+NPU all-in-one to the embedded market. It provides up to 8 GPU Xe-cores (128 EUs), an 11pTOPS/8.2eTOPS NPU, and 14 CPU cores at 28W TDP.
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COM Express Basic Size Type 6 Module with 6th Gen Intel® Core™, Xeon® and Celeron® Processors (formerly codename: Skylake)
Express-SL/SLE
The Express-SL/SLE is a COM Express® COM.0 R2.1 Basic Size Type 6 module supporting the 64-bit 6th Generation Intel® Core™ and Xeon® E3-and Celeron® processors (codename "Skylake-H") with IntelR QM170, HM170, CM236 Chipset.
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SMARC® Short Size Module with Intel Atom® E3900 Series, Pentium™ N4200 or Celeron™ N3350 Processor (codename: Apollo Lake)
LEC-AL
The LEC-AL Computer-On-Module (COM) combines the SMARC® 2.0 standard with the latest Intel Atom® E-Series and Pentium® and Celeron® N-series System-on-Chips (SoCs), providing ideal solutions for low power consumption and high performance requirements. The module provides the high integration, high performance, low power, and ruggedness favored by Internet- of-Things (IoT) applications such as retail transactional clients, digital signage, and in-vehicle infotainment systems. The LEC-AL module utilizes the latest Intel E-series and N-series SoCs, which are based on the Intel 64 Architecture, the new HD Graphics 500/505 engine, and a faster, 4-vector image processing unit. The SoCs are manufactured on Intel's industry-leading, tri-gate 14nm process, improving system performance by supporting more than 4 GB of both virtual and physical memory.
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COM-HPC Client Type Reference Carrier Board in ATX Form Factor
COM-HPC Client Base
The COM-HPC Client Base is an ATX size COM-HPC Client Type reference carrier board based on PICMG COM-HPC Revision 1.0. Together with the COM-HPC Client Type module of your choice and off the shelf add-on cards, you can quickly emulate the functionality of your desired end product for software development and hardware verification.
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Digital Input Board
VME-1129
VME-1129 128-bit high voltage digital input board with Built-in-Test and input filter. This product complies with the VMEbus specification (ANSI/IEEE STD 1014-1987, IEC 821 and 297), with the following mnemonics: A24:A16: D32/D16/D08 (EO): Slave:39/3D: 29/2D Form Factor: 6U
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COM Express
COM Express, defined by the PCI Industrial Computer Manufactures Group (PICMG), is the most successful Computer-On-Module (COM) standard in the embedded market today. COM Express employs a mezzanine-based approach, whereby an off-the-shelve module with two 220-pin board-to-board connectors, plugs into a custom, application-specific carrier board.
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Relay Output Board
VME-2232A
VME-2232A is a 32-Channel Relay Output Board with Built-in-Test (BIT). Software compatible with the VMIVME-2232 and the VMIVME-2533.
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Motion Control Terminal Board For Mitsubishi J2S-A Servo Amplifiers
DIN-812M0
- On-board connector type: 100-pin SCSI-II female- Suitable for Mitsubishi J2 super servo- Dimensions: 123 mm x 107 mm x 44 mm (WxLxH)- Available for PCI-8132
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34945EXT Distribution Board, For Two 87104x/106x L7x0xx Multiport Or 87406B Matrix Switches
Y1151A
The Y1150A-Y1155A distribution boards enable simple connections to the external switches. The distribution boards plug onto the 34945EXT and are used to route the power and control signals from the driver module to the switches using standard cables.
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sbRIO-9482, Non-Enclosed, 4-Channel, SPST Relay, 60 VDC (1 A)/250 VAC (1.5 A) C Series Relay Output Module
783000-01
The sbRIO‑9482 directly connects to a wide array of industrial devices such as motors, actuators, and DC devices. Each channel provides access to an electromechanical relay for switching signals up to 60 VDC (1 A) or 250 Vrms (1.5 A), features channel‑to‑channel isolation, and has a LED that indicates the status. Non-enclosed modules are designed for OEM applications.
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SMARC 2.1 Reference Carrier Board with M.2 Extension
I-Pi SMARC Plus
The I-Pi SMARC Plus is small (110mm x 110mm) SMARC reference carrier board based on SGeT SMARC (Smart Mobility ARChitecture) 2.1 hardware specification. Together with the SMARC short size module of your choice and off the shelf add-on cards, you can quickly emulate the functionality of your desired end product for software development and hardware verification.
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COM Express Compact Size Type 6 Module with Intel Pentium, Celeron N3000 Series and Atom x5 E8000 SoC (formerly codename: Braswell)
cExpress-BW
ADLINK cExpress-BW provides two DDI channels (with up to 4K resolution) and one eDP or DDI3 channel supporting three independent displays, enabling it to drive multiple HD screens without the need for a discrete graphics card. In addition, LVDS is optionally available to support next generation displays. The cExpress-BW offers up to five PCI Express lanes x1. A wide range of operating systems are supported, including Linux, Windows 7 and 8.1u, Windows Embedded Standard 7, Windows Embedded Industry 8.1 and VxWorks.
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Qseven Module with 4th Generation Intel Atom® Processor E3800 Series SoC (formerly codename: BayTrail)
Q7-BT
The Q7-BT Computer-On-Module (COM) combines the Qseven® 2.0 standard with the Intel® Atom™ E3800 series System-on-Chip (SoC), providing an ideal solution for mid-range power and high, pin/area density requirements. The module provides the high integration, high performance, low power, and ruggedness favored by Internet-of-Things (IoT) applications such as retail transactional clients, digital signage, and in-vehicle infotainment systems.
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Digital Output Board
VME-2533
VME-2533 32-bit Differential Digital Output Board. VMEbus specification compatible double height form factor.
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Terminal Board for General Purpose with 100-pin SCSI-II Connector
DIN-814-GP
- Available for PCI-8134, PCI-8164, PCI-8154, PCI-8158 and PXI-8164- Supports Specific Servos by Cable Selecting- On-board Connector Type: 100-pin SCSI-II- Dimensions: 146 mm x 85 mm x 44 mm (W x L x H)
