3D
three dimensions.
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Product
Entry-level Price Interferometer for Geometry Measurement of Single Fibers
3D SCOPE-V2
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Specifically designed for use in a production environment, 3D Scope-V2 is a robust, compact and easy to use interferometer that brings speed and precision to operators. 3D Scope-V2 supports our Blink software platform. Non-compressed, real time and high quality images are transfered from the hardware to the software via a USB 2.0 link in addition to the automation and control commands.
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Product
3D Scanning Software
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Software is a comprehensive component to any advanced metrology system. Combined with laptops and portable equipment, 3D scanning and measurement is now possible virtually anywhere. 3D scanner software plays a critical role in every stage from the creation of a concept design to the manufacturing and inspection of prototypes. Below is a look at some of the Laser Scanner Software and 3D Scanner Software providers and platforms we represent and handle.
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Product
3D Smart Sensors
Gocator Family
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Scan, measurement and control within a single device. Optimize manufacturing processes and improve quality control decisions at production speed with 3D non-contact inspection.
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Product
3D Contact Profilometer
NanoMap-LS
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NanoMap-LS with large scanning range allows to generate high resolution 3D and 2D images with a press of a button.
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Product
Sensors
NanoFocus Probe
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Scan of 3D topography of high accurate featuresVery high point densitySuitable to perform non-contact roughness measurementsHigh flexibility using a range of different front lenses
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Product
Optical Tensiometers
Theta Flex
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Attension® Theta Flex is a contact angle meter that enables all measurements in one instrument for both research and quality control. It measures static and dynamic contact angle, 3D surface roughness, surface free energy, surface and interfacial tension, and interfacial rheology.
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Product
3D Scanning Reverse Engineering Services
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Reverse engineering is oftentimes a catch-all term used for many design and engineering applications. But trust us, there is so much more to this category for the uses of our 3D scanners, portable CMMs and laser trackers. Also, reverse engineering tends to imply that the 3D scanning will be used solely for product design, when in fact it can be used to address many other engineering functions such as:
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Product
Benchtop 3D Optical Profilometers
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Compact, non-contact metrology instruments used for high-precision, sub-nanometer to micrometer-level measurement of surface topography, roughness, and step heights.
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Product
Volume Checker
Gocator
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For Volume Gauging of Cylinder Heads and Piston Bowls in Small to Medium-Sized Internal Combustion Engines. Gocator snapshot sensor w/ custom measurement tools. 3D non-contact measurement. Replaces traditional optical methods such as fluids, pressurized air, acoustics. Easily handles shape variation. Stereo camera minimizes occlusions.
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Product
ALD Advantages
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Atomic Layer Deposition (ALD) stands out for one reason: control. The most significant advantages of thin film deposition via Atomic Later Deposition over other methods, are manifest in four distinct areas – film conformality, low temperature processing, stoichiometric control, and inherent film quality associated with the self-limiting, and self-assembled nature of the ALD mechanism ALD is exceptionally effective at coating surfaces that exhibit ultra high aspect ratio topographies, as well as surfaces requiring multilayer films with good quality interfaces technology. This thin-film process builds materials one atomic layer at a time, delivering unmatched uniformity and sub-nanometer precision, even on complex 3D structures. That level of accuracy makes ALD a critical technology for advanced semiconductor manufacturing, flexible electronics, and materials research.
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Product
MPO/MTP Multi-Fiber Interferometer
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Anfkom International Co.,Limited
It is an automatic and non contact fiber endface interferometer for both multi fiber and single fiber connectors. It can measure the geometry parameters of multi fiber connector such as fiber height,core dip, X and Y angel, radius of curvature with white light and measure geometry parameters of single fiber connector with red light. The software can display the surface of the connector in 3D image for a very short time, it need only 8s to test 12-core MT connector. It is intelligent , efficient,stable and accurate and very helpful in improving the quality of the product.
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Product
PDS Ploughing Software
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Teledyne PDS Plough supports different ways to monitor your leveling operation. Teledyne RESON provides the software as well as the sensors to accompany the system.Teledyne PDS visualizes the plough in top, profile, and 3D views indicating where leveling has taken place. The position and depth of the plough is logged to a digital terrain model (DTM) which is color-coded for depth. It is possible to display a design depth in the profile views, indicating whether the plough has to be lowered or hoisted.
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Product
Temporary Bonding Systems
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Temporary bonding is an essential process to offer mechanical support for thin or to-be-thinned wafers, important for 3D ICs, power devices and FoWLP wafers, as well as for handling fragile substrates like compound semiconductors. A device wafer is bonded to a carrier wafer with the help of an intermediate temporary bonding adhesive, allowing the typically fragile device wafer to be processed with additional mechanical support. After the critical processes, the wafer stack is debonded. EVG’s outstanding bonding know-how is reflected in its temporary bonding equipment, which has been provided by the company since 2001.
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Product
SUNTEST
XXL+
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Atlas Material Testing Solutions
The Atlas SUNTEST XXL+ is a large xenon lamp weathering and lightfastness test chamber meeting various ISO, ASTM, and ICH industry standards. Its horizontal 3000 cm2 exposure area is best-in-class for 3-D specimen testing.
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Product
Solder Paste Inspection
3D SPI
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Checking all the relevant points in the production process is essential, especially in terms of analyzing the causes of defects, fixing them, and – most importantly – preventing them in the future. That’s why solder paste printing is of fundamental importance for manufacturing complex assemblies: If paste printing isn’t performed correctly, the defect can impact the subsequent assembly and the soldering process, resulting in a tilted component or a poor or missing solder joint.
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Product
PANELMAP
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PANELMAP is a software package used to collect, edit, analyze and visualize measured physical parameters on rectangular semiconductor panels. PANELMAP can import data files from various metrology tools such as ellipsometers, thickness gauges and four point probes. The imported data can then be visualized or printed as line scans, contour plots, 2D or 3D plots or as a histogram.
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Product
Bonding
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With our extensive experience in designing and manufacturing precision wafer bonding equipment, EVG is well recognized for setting industry standards in wafer bonding. EVG wafer bonding systems can be configured for R&D, pilot-line or high-volume production, and for any direct or interlayer-based bonding process, including sophisticated low-temperature covalent bonding. With this portfolio of technologies and equipment, EVG addresses markets for advanced packaging and 3D integration, MEMS, as well as advanced compound semiconductor and SOI substrates, holding the leading position and dominant market share.
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Product
Transformer Turn Ratio Instrument
ART-3D
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The ART-3D is high precision instrument designed to measure ratios, magnetization currents, phase-shifting in power transformers, distribution transformers, potential and current transformers, in conformity to IEEE C57.12.90 and CEI/IEC 60076.
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Product
Tailor-Made to Simulate Low-Temperature Plasma Sources and Systems
Plasma Module
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The Plasma Module is tailor-made to model and simulate low-temperature plasma sources and systems. Engineers and scientists use it to gain insight into the physics of discharges and gauge the performance of existing or potential designs. The module can perform analysis in all space dimensions 1D, 2D, and 3D. Plasma systems are, by their very nature, complicated systems with a high degree of nonlinearity. Small changes to the electrical input or plasma chemistry can result in significant changes in the discharge characteristics.
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Product
3D AOI Series
MV-7 OMNI
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- Exclusive 15MP CoaXPress Camera System- OMNI-VISION® 3D Digital Tri-Frequency Moiré Technology- Leading-Edge 12 Projection Blue DLP Technology- Precision Compound Telecentric Camera Lens- Eight Phase Color Lighting System- 10MP / 18MP SIDE-VIEWER® Camera System- Programmable Z-Axis Multi-Focus System- INTELLI-PRO® Automatic Programming Software- Multi-Functional AOI-SPI Fusion Technology- INTELLISYS® Industry 4.0 Intelligent Factory Automation System
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Product
Surface Profilers
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Taylor Hobson offers a world leading range surface form, surface finish and metrology solutions for 3D contour,ideal for the most demanding applications.
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Product
2D-3D Laser Measurement
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Long range profiling laser displacement sensor is built to satisfy the most demanding automated dimension, angle, curvature and height in the industrial application. At a fast speed of 6,000 frames per second and up to 2.5µm resolution, it also has measuring of up to 800 mm.
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Product
Nano-focus X-ray Inspection System
X-eye NF120
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Nano-focus Tube of 400 nano resolution is installed which is specialized for Semiconductor Packaging, Wafer Level Packaging(WLP) requiring detection of Sub-micron defects.Able to trace and inspect defected area precisely by precise movement of axis with Anti-vibration table.Tomography is available if 3D CT module is added and Wafer Bump Automatic Inspection is available from loading to inspection with wafer handler systems.
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Product
Fiber End-face Interferometer
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Anfkom International Co.,Limited
1.Automatic MeasurementSANA2 is equipped with the locking handle sensing unit to monitor the device locking status. To further simplify the testing process, the instrument can start the measurement once the device to be tested is fully locked. Operator can also click the button aside the locking handle to trigger the measurement.2.0~12° APC Angle Auto TuningBenefit with the unique fixture design, SANA2 can tune the APC angle precisely from 0°to 12°automatically, meeting any special requirement on APC angle setting.3.Simple and User Friendly Interfaces and Excellent 3D ImagesThe software of A 2 is simple and user friendly, you can change the language within the software. It provide many endface rebuild method such as 3D, 2D, plot to assist the engineers about the process. The test reports and data are generated automatically for analyzing and tracing.4.Auto Centering ImagesSANA2 has auto centering image function that can find the fiber and makes it to center automatically within one click.No mouse drag or hardware adjustment is needed.5.Cleave Angle Measurement
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Product
Computer Vision and Visualization
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Fraunhofer Institute for Telecommunications
The Computer Vision and Visualization Department consists of three research and development groups working on innovative technologies in the field of monocular, stereoscopic and multichannel video processing. It covers the entire processing chain from original capture to rendering, with a focus on advanced 2D and 3D analysis, post-production synthesis, computer vision, image understanding, human-machine interaction, and immersive media , The department also has expertise in processing complex systems consisting of multiple cameras, sensors, displays, projectors or screens.
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Product
Ultra High 4.18 (119.00) 11.70 (332.00) General Purpose Probe
EPA-3D-2
General Purpose Probe
Current Rating (Amps): 6Average Probe Resistance (mOhm): 35Test Center (mil): 125Test Center (mm): 3.18Full Travel (mil): 250Full Travel (mm): 6.35Recommended Travel (mil): 167Recommended Travel (mm): 4.24Mechanical Life (no of cyles): 2,000,000Overall Length (mil): 1,300Overall Length (mm): 33.02
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Product
3D Measurement
PSD-Array
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The PSD array consists of 16 parallel one-dimensional PSD elements on the same chip. By utilizing the triangulation technique the reflection of a laser line or multiple laser spots onto the PSD array will provide information about the contour of the illuminated object. The possibility for simultaneous readout of the 16 elements together with the fast response of each element makes the PSD array suitable for applications like high speed 3D contour measurements and measurements of parallel, moving objects such as cantilevers.
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Product
Antenna Test Chamber for Automotive Radar
ATS1500C
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The R&S®ATS1500C radar test chamber is a compact antenna test range (CATR), consisting of a gold-plated parabolic reflector and a two-axis positioner for 3D movements of the radar module. Combined with the R&S®AREG800A target simulator and other Rohde & Schwarz test and measuring instruments, it can be used for a variety of applications, including antenna characterization, module calibration, RF performance validation, interference testing or in-band compliance testing. The chamber is equipped with a universal feed antenna which gives access to both polarizations in parallel. Automated temperature testing over the range of -40 to 85°C is possible with an optional enclosure.
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Product
Intel® Atom™ Processor E3845 Fanless Expandable Embedded Computer with PCI/PCIe Slots
MXC-2300
Industrial Computer
Featuring the latest Intel® Atom™ E3845 processor, the Matrix MXC-2300 series excels with minimal power consumption, exceptional 3D graphics, and powerful media acceleration, delivering a leading improvement in performance and cost-efficiency over any previous generation Atom-based system.
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Product
Stand alone Software
MeX
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MeX is a stand alone software package that turns any SEM with digital imaging into a true surface metrology device. Using stereoscopic images the software automatically retrieves 3D information and presents a highly accurate, robust and dense 3D dataset which is then used to perform traceable metrology examination. The results are obtained irrespective of the SEM magnification providing metrology at macro and micro levels. No additional hardware is necessary to run MeX and it can be used with any SEM. Due to the unique AutoCalibration routine the calibration data is automatically refined. Thereby only MeX enables traceable 3D measurements at any magnification in the SEM.
