3D
three dimensions.
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Product
SMARC Short Size Module with NXP i.MX 6 Multicore Arm® Cortex®-A9
LEC-iMX6R2
Computer on Module
- NXP SoC i.MX6 ARM Cortex A9 Solo, DualLite, Dual or Quad processor- Integrated 2D/3D graphics processors, 3D 1080p video processing, power management- Onboard DDR3L-1600 system memory from 512 MB to 2 GB- Supports up to 64 GB eMMC, 1x SD/MMC, 1x SATA 3Gb/s- Extreme Rugged operating temperature: -40°C to +85°C (optional)- 15 year product availability
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Product
Scanning & Inspection
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API’s offers a range of portable measuring and laser scanning solutions together with robot or tripod mounted 3D structured light scanner.
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Product
PDS Wire Crane Monitoring System
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It shows a real time overview of the wire crane in navigation, profile, and 3D views; displaying the clamshell, pontoon/vessel, design depths and color-coded digital terrain model (DTM). The navigation view highlights the high and low spots and is updated in real time, registering the progress of the dredging work. The registration follows the shape of the clamshell, bucket or orange peel bucket and is visible immediately in all views. The system also shows the open/close status of the dredge tool. Up/down indicators show the operator the exact distance to the seafloor and design depth continuously. 3D design models allow the use of complex designs.
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Product
Permanent Bonding Systems
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The introduction of EVG's wafer-bonding approach, which separates the bond alignment from the bonding step, immediately revolutionized the market. Utilizing high-contact forces under elevated temperatures and a controlled atmosphere, this novel approach is today's process standard, with EVG holding the dominant market share for both semi- and fully automated wafer bonders and a growing installed base of more than 1500 chambers. EVG's wafer bonders offer optimal total cost of ownership (TCO), as well as multiple design features to optimize bonding yield. Multiple modules for bond alignment are optimized for different market requirements in MEMS, 3D integration or advanced packaging. Industry-leading alignment accuracies of less than 100 nm and a high-volume-proven modular platform enables the combination of EVG’s wafer bonding technologies in various applications.
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Product
LM-79 Moving Detector Goniophotometer
LSG-5000
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Moving Detector Goniophotometer completely meets LM-79 Clause 9.3.1 and EN13032-1 clause 6.1.1.3 goniophotometer type 4 requirements. The LSG-5000 is an automatic light distribution intensity 3D curve testing system for measuring light. The measuring distance is from 5m to 30m. It can measure all types of lighting sources, LED or HID luminaires such as indoor and outdoor luminaires, roadway luminaires, street lamps, flood lights and other kinds of luminaires.
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Product
Ready to Use Systems
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The ready-to-use systems offer a variety of solutions with smal learning time and just a few clicks of a button in industries such as food and beverages, electronics and in areas such as deep learning, thermography, 2D and 3D image processing. The systems include the EyeVision software solution for free adaptation, as well as the EmSys computer hardware and an industrial camera from one of the supported manufacturers such as Allied Vision Technologies, Basler, Baumer, Teledyne Dalsa, or thermography cameras from Optris or Flir. Both GigE and USB cameras are available for cameras.
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Product
USB Stereo Camera For NVIDIA GPU
TaraXL
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TaraXL is a USB Stereo camera which is optimized for NVIDIA® Jetson AGX Xavier™/TX2 and NVIDIA GPU Cards. TaraXL's accelerated Software Development Kit (TaraXL SDK) is capable of doing high quality 3D depth mapping of WVGA upto 60fps. This 3D stereo camera is based on MT9V024 stereo sensor from ON Semiconductor.
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Product
New Resistivity Inversion Software
EarthImager 3D
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AGI is proud to introduce the new EarthImager 3D resistivity and IP inversion software. This software inverts resistivity and IP data acquired with electrodes arranged in boreholes and/or on the surface and presents a 3D volume of inverted resistivity data with advanced volume rendering technique. The final resistivity or IP image-volume can be rotated in any orientation, zoomed in and out, and translated to anywhere inside the image window in order to see the volume of interest in detail. Colors representing areas of less interest can be made transparent so that the shape of a pollution plume, for example, can be visible. With EarthImager, 3D resistivity inversion can be as easy as two steps: Read Data and Start Inversion with only a few mouse clicks.
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Product
Stylus Profilometry
Dektak®
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Bruker's Dektak stylus profilers are the product of over four decades of proprietary technology advances. They provide repeatable, accurate measurements on varied surfaces, from traditional 2D roughness surface characterization and step height measurements to advanced 3D mapping and film stress analyses. Dektak surface profilers have been widely accepted as a superior solution for measuring thin film thickness, stress, and surface roughness and form in applications ranging from educational research verification to semiconductor process control.
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Product
3D Design
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Rapid Design Exploration. Created for design engineering workflows, our intuitive product design software generates a fast user experience. Rapid design exploration includes detailed insight into real-world product performance. Live physics and accurate high-fidelity simulation combine into an easy-to-use interface that supports faster-time-to-market.
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Product
5D SPI
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On Mek Solder Paset Inspection systems, items which are better inspected in 2D, such as area offset and bridging, are viewed in full colour. Using colour inspection the ISO-Spector S2 SPI can tell the difference between paste, solder mask, silk screen and other PCB features and the SPI system can intelligently give you accurate results. Volume and height measurement in 3D are combined with the 2D inspection in Real-time, to give a True colour 3D image. Other 3D SPI systems only inspect in the 3rd dimension, (Z axis) and make extrapolated assumptions about the 2D image.
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Product
Hardware Platform
SmartScan 3D
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SmartScan-3D is another hardware platform that allows 3D scan using a six axis robot and DUT holder. A DUT is placed on a 360 degree rotating DUT holding jig. Vertical scanning without rotating DUT holder is one variation of SmartScan-3D for any DUT that is standing up, rather than laying flat on X-Y plane. Any scan technology can be integrated to the SmartScan-3D.
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Product
Video Signal Generator
MSHG-600 Plus
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MSHG-600Plus supports a exclusive HDMI 1.4a Signal and output signal to five(5) channels. It is also built-in CEC function according to current market request. *3D video Format Support *It can be On/Off Audio Return Channel with ARC switch separately.
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Product
3D Cameras
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Imaging Development Systems GmbH
3D Machine Vision is considered to be the future of Robot Vision. The integration of 3D data makes it possible to precisely capture and interpret the environment, enabling tasks in robot technology to be solved more efficiently. This applies both to demanding assembly processes, such as gluing or welding, and to the notoriously tricky process of "bin picking". With the Ensenso 3D cameras and the Nion ToF camera, IDS offers powerful camera systems for 3D imaging – with a focus on precision, cost-effectiveness and easy integration.
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Product
3D Measurement Software
PowerInspect®
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3D measurement software for a range of hardware.PowerInspect software makes inspecting complex free-form surfaces simple, across all your inspection hardware. Use the right tools for the job, with one interface on all devices.
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Product
SMARC
ROM-5780
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Advantech ROM-5780 SMARC 2.1 Computer-on-Module is powered by Rockchip RK3399 SOC which includes dual-core Arm Cortex-A72 and quad-core Arm Cortex-A53 processors and Arm Mali-T860MP4 3D graphics engine. It provides rich display interface: HDMI 4K@60Hz, eDP and LVDS to meet different requirement. It also features USB3.0, PCIe 2.0, SATA, Gigabit Ethernet, MIPI-CSI for embedded applications. It is the ideal solution for POS, vending, infotainment, Medical.
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Product
Reverse Engineering Services
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The term “reverse engineering” can be a little confusing. It is sometimes used for things like software and electronic circuits. When 3D scanning companies use the term, they are referring to the process of re-creating design drawings by taking measurements and/or scans of the part itself. It is a 2-step process: 1) capture a 3D scan of the object, and 2) Create a 3D CAD model of the object
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Product
Digital Image Correlation System for Complete 3D Warpage, Thermal Expansion, and Strain Analysis of Materials and Components in the Heating and Cooling Phase
Q-400 TCT
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The Q-400 TCT system is designed for complete three-dimensional and highly sensitive warpage, thermal expansion measurement and strain analysis of materials and components in the heating and cooling phase. Areas from 50 mm x 70 mm down to 2 mm x 3 mm can be investigated. Measurements can be done from room temperature up to 300°C and down to -40°C. The system is specially suited for thermal expansion measurement of electronic components and is frequently used in the development and testing of complex anisotropic materials, components, and structures in electronic applications.
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Product
3D Sensor
C6 Series
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The new 3D C6 series by AT is built on a novel sensor platform that supports the latest industrial standard GigE Vision/GenICam 3D at 1 Gbit/s. These new laser profilers offer an impressive combination of extremely fast and highly precise resolution, reaching up to 4,096 points per profile, a profile speed of up to 200 kHz, and high dynamic range 3D image capture. They are available as compact sensors, MCS, and 3D cameras.
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Product
PDS Multibeam Survey and Processing/Charting
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Teledyne PDS for Multibeam Surveys provides the functionality for survey planning, data acquisition, data processing, editing, volume calculations and chart production. This turnkey solution offers the surveyor and helmsman a strong tool to carry out the multibeam survey efficiently. Progress is shown real time in top, profile, and 3D views using a color-coded digital terrain model (DTM). Various filter settings can be applied to the multibeam data online, thus providing real-time data processing. Quality control displays reassure the operators that the data is of the desired quality.
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Product
3D Machine Vision Process Control Solutions
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In the age of automation and robotics, manufacturers utilizing automated dispensing in their assembly lines face growing challenges to maintain process control of their manufacturing processes. To eliminate errors and optimize product quality, they increasingly need the help of machine vision based “eyes of automation”. Whether manufacturing automobiles or medical devices, they need high-speed inspection tools to confirm the accuracy of their dispensing process and the overall quality of their products.
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Product
ReMesh
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ReMesh is the CAD program, which provides powerful tools for geometry creating, checking and editing. Program has tools to remesh discretely or semi-analytically specified geometry in 3D and has convenient interface for editing geometry manually. Problems with remeshing of such geometries arise in EMC simulations.
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Product
Potable Coordinate Measuring Machines
Romer
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A first in the world of portable measuring arms: The ROMER Absolute Arm features absolute encoders and is therefore the first measuring arm which does not require referencing before measurement. When the arm is turned on, it’s ready to go.Quality control, inspection, on-machine verification, reverse engineering, virtual assembly or 3D modelling. Wherever these needs arise, you will find the ROMER Absolute Arm. Much more than just a metrology tool, its value lies in its versatility.Portability, stability, light weight and high-performance laser scanners make the ROMER Absolute Arm an all-purpose 3D measurement, analysis and digitising tool that can be used by anyone, anywhere and with minimum training.Unlike many metrology devices, the ROMER Absolute Arm does not require warm-up time or initialization, thanks to a stable carbon fiber structure and industry leading Absolute encoders. Simply take the measuring arm to the part, switch it on and start measuring.
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Product
3D Profilers
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AEP Technology offers different kinds of 3D profilers. Rugged platform, advanced electronic equipment, clean test space, low carbon emission, low machine noise, high-end lens, etc., make our surface profiler unique in the imaging world. In addition to providing stand-alone contact 3D profilers and optical 3D profilers, we also provide the world's only cross-platform, dual-mode 3D profiler that is compatible with both tactile and optical profilometers.
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Product
Automated Optical Inspection (AOI)
TR7700 SIII 3D
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TRI’s ground breaking 3D AOI solution delivers the fastest hybrid PCB inspection combining optical and blue-laser-based true 3D profile measurement for the highest automated defect symptom coverage possible. Integrated state-of-the-art software solution and third generation intelligent hardware platform offer stable and robust 3D solder and component defect inspection and with high inspection coverage and easy programming.
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Product
Robot Guidance
Single Spot
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Point applications, such as handling, welding, bolting, adhesive spots etc. often need precise positioning of the tool. Only this way the specified product quality can be achieved. The Single Spot Solution measures local part tolerances prior to the application and delivers the 3D data for correction of the application points.
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Product
Semi-auto 4 Point Probe System for Solar Cell Substrate
RG-100PV
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*Measurement system for thin film on substrate samples for multi-points measurement*Even pitch and random pitch for Max.1,000 points*2-D/3-D square mapping software for even pitch
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Product
PC Edition Ynit
RH-2000
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"RH-2000" is a digital microscope which can evolve and customize. 2D Measurement, 3D Measurement, and Tilting. "RH-2000" enables you to make a high performance observation and analysis.
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Product
PDS Bar Sweep Survey Software
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Teledyne PDS Bar Sweep supports different ways to monitor your leveling operation. Teledyne RESON provides the software as well as the sensors to accompany the system.Teledyne PDS visualizes the bar in top, profile, and 3D views indicating where the leveling has taken place. The position and depth of the bar is logged to a digital terrain model (DTM) which is color-coded for depth. It is possible to display a design depth in the profile views, indicating whether the bar has to be lowered or hoisted.
