SoC
A complete computer "System on a Chip".
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Product
SoC Tester
UltraFLEXplus
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The UltraFLEXplus combines new instrument and software capability with a revolutionary tester infrastructure that provides a step-function improvement in throughput and engineering efficiency – all while leveraging the cumulative test IP developed over the UltraFLEX’s 15 year history .
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Product
SoC Verification
TrekSoC
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TrekSoC automatically generates self-verifying C test cases to run on the embedded processors in SoCs. This verifies your chips more quickly and more thoroughly than an external testbench, hand-written C tests, or running only production code on the processors. TrekSoC's generated test cases target all aspects of full-SoC verification and work in a variety of different environments.
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Product
Test System Optimized for High-Performance Digital and SoC
ULTRAWAVEMX44 and ULTRAWAVEMX20-D16
Test System
Teradyne is the leader in RF/wireless device testing and has a large installed base of UltraFLEX test systems with the UltraWave24 RF instrument. As new devices for handset and base station applications are introduced using mmWave technology, Teradyne’s mmWave instrumentation has expanded in anticipation of new testing demands.
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Product
PCIe/104 OneBank Carrier for Trenz SoC Modules
EMC²-DP
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Sundance Multiprocessor Technology Ltd.
The EMC²-DP is a PCIe/104 OneBank™ Carrier for a Trenz compatible SoC Module and has expansion for a VITA57.1 FMC™ LPC I/O board and also has I/O pins, using a 100-way Samtec RazorBeam connectors system. The add-on board, called “Sundance External Interface Connector – SEIC” contains LEDs, RS232, USB2.0, HDMI, 1Gb Ethernet and SATA . The “SEIC” can be customize for individual applications and bespoke connectors.
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Product
Rugged COM-HPC Server Type Size E Reference Development Platform Based On Ampere® Altra® SoC
Ampere Altra Developer Rugged
Software Development Kit
The rugged 4U rackmount server platform provides a cloud-native environment for embedded edge development. It can host the SOAFEE (Scalable Open Architecture for Embedded Edge) providing a cloud-native environment for embedded edge development and is compatible with Autoware Foundation's Autoware Open AD Kit. It supports the open source EDKII as bootloader with UEFI, so customers can just download a stock AArch64 (arm64) ISO such as Ubuntu and install it through booting a live ISO directly on the target. The same convenience we have become used to by using x86 / amd64 target systems.
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Product
SoC Test Systems
Test System
SoC (System on Chip) devices integrate multiple different functions into a single chip. Our SoC test systems can test all the integrated circuits in SoC devices, including logic, analog, RF, DC and imagers by flexible configuration of the cards/modules used in the test system.
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Product
COM Express Compact Size Type 6 Module Intel Atom® E3900 series, Pentium®, and Celeron® SoC (formerly Apollo Lake)
cExpress-AL
Computer on Module
The cExpress-AL is a COM Express® COM.0 R3.0 Type 6 module supporting the Intel Atom® processor, Intel® Pentium® processor and Intel® Celeron® processor system-on-chip (SoC). The cExpress-AL is specifically designed for customers who need optimized processing and graphics performance with low power consumption in a long product life solution.
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Product
COM-HPC Server Type Size E Module with Ampere® Altra® SoC
COM-HPC-ALT
Computer on Module
ADLINK’s COM-HPC Ampere Altra is the first 80-core COM-HPC Server Type module in the world. It is based on the Ampere® Altra® SoC based on the Arm Neoverse N1 architecture and offers up to 80 Arm v8.2 64-bit cores at 2.8GHz with only 175 Watt TDP. The excellent performance-per-watt architecture makes the COM-HPC Ampere Altra well suited to processing massive data at the edge without requiring a significant initial investment or ongoing maintenance costs.
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Product
Intel® Xeon™ SoC, PCIe Gen3, 3U VPX
VPX754
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The VPX754 is a processor module (VITA 46) for general purpose processing in demanding applications. Based on the Intel® 5th generation Xeon 4-core, 8-core or 16-core Processors (Broadwell). The efficient SoC design has low power consumption and integrated PCH technology.
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Product
Advanced SoC Test System
3680
Test System
The Chroma 3680 is an advanced SoC test system with data rate up to 1Gbps. The Chroma 3680 is capable of conducting parallel tests on multiple chips to meet the digital and analog IC testing requirements, with applications including MCU, digital audio, digital TV, set-top box, DSP, network processor, field programmable gate array (FPGA) and consumer electronics.
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Product
COM Express Compact Size Type 6 Module With Intel Atom® Or Intel® Celeron® Processor SoC (Formerly Codename: Bay Trail)
cExpress-BT
Computer on Module
The cExpress-BT is a COM ExpressR COM.0 R2.1 Type 6 module supporting the Intel Atom® processor E3800 Series and Intel® Celeron® N2900/J1900 processor SoC (codename: Bay Trail). The cExpress-BT is specifically designed for customers who need high-level processing and graphics performance with low power consumption in a long product life solution.
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Product
I-Pi SMARC Development Kit Based On Intel® 6th Gen Atom® X6425E Quad-Core SoC
I-Pi SMARC Elkhart Lake
Software Development Kit
The I-Pi SMARC Elkhart Lake is a SMARC-based edge solution development kit powered by Intel Atom x6425E quad-core SoC with integrated Intel UHD graphics and comprehensive high speed interfaces. Development-focused, this kit also supports the latest version of the Intel® Distribution of OpenVINO™ toolkit, which features more deep-learning models, higher inferencing performance, and fewer code changes, making developing ever simpler.
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Product
Emulation Platform
Veloce
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The Veloce® Emulation Platform dramatically reduces risk in the verification of today’s complex SoCs and is a core technology in the Mentor Enterprise Verification Platform™ (EVP). Mentor’s software and application solutions and continual enhancements enable a comprehensive verification environment for IP, chip, and system level verification.
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Product
SMARC
ROM-5620
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Advantech ROM-5620 SMARC2.0/2.1 Computer-on-Module is powered by NXP i.MX 8X SoC which includes two to four Arm Cortex-A35 cores for mid-range automotive and industrial market segments, one Cortex-M4F core for real-time processing, and one Tensilica Hi-Fi 4 DSP for efficient audio and voice codec execution. It also escalates its graphic performance by Vivante GC7000 Lite, 4K H.265 capable decoder, and dual 1080P60 display controller.
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Product
SMARC
ROM-5720
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Advantech ROM-5720 SMARC 2.0/2.1 Computer-on-Module is powered by NXP i.MX8M SOC which includes dual and quad-core Arm Cortex-A53 processors in combination with one Cortex-M4 real time processor and the Vivante GC7000 Lite 3D graphics engine. It provides USB3.0, two Gigabit Ethernet, two MIPI-CSI, PCI Express, and HDMI2.0 up to 4096 x 2160 at 60 Hz and MIPI-DSI for embedded applications. It's the ideal solution for transportation, infotainment, vending, Medical.
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Product
COM Express Type 6 Compact Module With Intel® Atom™ Processor E3845
CEM843
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The CEM843 Intel® Bay Trail SoC system-on-modules come with 6 PCI Express lanes, eight USB signals, double deck DDR3L SO-DIMM sockets supporting up to 8 GB of system memory, and two SATA-300. The CEM843 utilizes quad cores Intel® Atom™ processor E3845, featuring a wide operating temperature range from -40°C to 85°C. The power-efficient compact module is designed with all necessary components and offers the most updated bus interfaces targeting at POS and kiosk systems, gaming, medical PCs, human machine interface, IoT & M2M-related and industrial automation controllers.
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Product
Mini-ITX SBC With Intel® Celeron® Processor N3160 (up To 2.24 GHz) SoC, VGA/HDMI/LVDS, USB 3.0, Mini PCIe Card, MSATA And HD Audio
MANO300
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The MANO300 mini-ITX motherboard built with the latest Intel® Celeron® processor N3150 (codename: Braswell) with integrated Intel® Gen 8 graphics supporting up to 4K resolution. Two SO-DIMM sockets are provided to support up to 8GB of DDR3L-1600 memory. The 12V single voltage DC power jack or ATX power makes the power input selection more flexible for different automation and embedded industries. Its friendly fanless cooling system design and compact form factor aimed at space-limited applications as well as harsh environments.
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Product
Fanless Embedded System With Intel® Celeron® J1900 2.0 GHz, HDMI, VGA, 2 GbE LAN, 4 USB And 2 COM
eBOX625-842-FL
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The eBOX625-842-FL industrial-grade, extreme slim, fanless embedded system is powered by quad cores Intel® Celeron™ J1900 2.0GHz SoC (system-on-a-chip). Through the use of Intel® Bay Trail-D type quad-core SoC and one 8 GB DDR3L-1066/1333 SO-DIMM socket, the energy-efficient embedded box computer offers outstanding performance, yet remarkably power efficient experience. Dramatically lighter and rugged enclosure enables the compact system to fit into limited space and withstand any harsh industry environment. The eBOX625-842-FL features dual displays and rich connection capability, including VGA, HDMI, 2 LAN ports, 2 COM ports, 4 USB 2.0 and 8-channel DI/DO, providing an ideal solution for variety applications from digital signage, transportation, kiosk, industrial control automation, medical equipment and IoT & M2M applications.
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Product
Emulation Adapters
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With some of the more advanced 32-bit microcontrollers and SoCs, the full program and data trace capabilities of the device are not made available on production silicon. Instead, semiconductor vendors provide special 'emulation devices'. These typically feature more pins than the production device, thereby providing the interface to the trace interface.
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Product
Networking Solutions
Bluetooth Solutions
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Quickly introduce Bluetooth connectivity into sports and fitness, consumer electronics, beacons and smart home applications with easy-to-use and innovative Bluetooth SoCs, modules and software from Silicon Labs.
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Product
Qseven V2.0 SoM Evaluation Kit With Quad/DualLite 800 MHz (Industrial) SoC, 1GB Memory, 4GB EMMC, Gigabit Ethernet, Audio And CAN
Q7M120-120-EVK
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*Ultra low power consumption Cortex™-A9*High flexibility Qseven v2.0 compliant design*2 CAN 2.0B*18/24-bit TTL LCD*LVDS/HDMI 1080P*10/100/1000 Mbps Ethernet*Linux3.0.35/Android4.3*Audio
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Product
AMD Zynq™ UltraScale+™ MPSoC XMC Board
IC-MPS-XMCa
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The IC-MPS-XMCa is a XMC FPGA card based on the AMD Zynq™ Ultrascale+™ ZU4CG MultiProcessor SoC.
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Product
Ultra-Low Power Computing Module
CM22303
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LinkedHope Intelligent Technologies Co.,Ltd.
CM22303 uses Intel® 7th generation Kaby Lake-Y platform and Core M Ultra low-power SoC processors, and integrates the full functions of CPU, GPU and South/North Bridge on a single chip. The processor provides powerful computing and display performance with dual-core and four threads configuration. Its turbo frequency can boost up to 3.6 GHz and the display output resolution can be up to 4K. CM22303 has an amazing thermal design power consumption of only 4.5W (TDP) and can be used for a variety of high-performance fanless designs. SPI BIOS is designed on board to support dual-channel low voltage on board memory (up to 16GB), Gigabit Ethernet, TPM module and other functions. With high-performance and low power consumption, it can be widely used in the field of low power embedded systems. Meanwhile, CM22303 adopts COM Express standard and is compatible with Type10 pin out definition, and also provides rich peripheral interfaces such as USB3.0/2.0, PCIe, SATA, HD Audio etc.
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Product
µHELIX® Test Probes
Series S200, S300, S400, and S500
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Test Probes for fine-pitch applications: CSP, BGA, SiP, SoC, flex-circuits, micro pcb, sub-mm center-to-center spacing, half mm, quarter mm spacing. Excellent for use in sockets, fixtures, and contactors for semiconductor testing and in coaxial installations.
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Product
COM Express Compact Size Type 6 Module with AMD Ryzen™ Embedded V2000 APU (Zen 2 architecture)
cExpress-AR
Computer on Module
The cExpress-AR, featuring the new AMD Ryzen™ V2000 APU with its high performance integrated Radeon™ graphics, is the first Type 6 module on the market to support an octa-core (8-core) embedded SoC, with up to 16 threads and an impressive turbo boost up to 4.2 GHz. Compared to earlier embedded quad-core V1000 processors, the additional cores combined with AMD's Zen 2 architecture result in a more than two-fold performance increase and double the performance-per-watt efficiency.
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Product
RISC-based DIN-rail Fanless Embedded System With I.MX 6UL Processor, COM, CANbus, 2 LANs And DIO (2-in/1-out)
IFB112
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The IFB112.supports the low power consumption NXP (Freescale) i.MX6UL ARM® Cortex™-A7 528MHz SoC. The design concept of IFB112 is aiming to meet the demands of mission-critical applications. The gateway controller with IP30-rated aluminum and steel enclosure supports an extended operating temperature ranging from -40°C to 70°C, a wide voltage range of 9V - 48V DC power input with terminal block, and has been designed to withstand vibration up to 5G. For system integrators with wireless communication needs, the IFB112 has one PCI Express Mini Card slot, one SIM card slot, and two internal antennas. It supports one serial port, two LANs and one CANbus port to enable fast and efficient data acquisition and communication. Its digital I/O port provides users with a convenience of digital devices connection.
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Product
PCI Express IP
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Rambus silicon-proven, high-performance PCI Express® (PCIe®) 6.0, 5.0, 4.0 and earlier generation digital controllers are optimized for use in SoCs, ASICs and FPGAs. These market-leading solutions for high-performance interfaces address AI/ML, data center and edge applications.
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Product
3U CompactPCI Quad-Core Intel Atom® Processor X Series Blade
cPCI-3630
Processor Blade
The ADLINK cPCI-3630 Series is a 3U CompactPCI® 2.0 processor blade featuring the 64-bit Intel Atom® Processor X Series SoC (formerly Apollo Lake I) and soldered DDR3L-1600 MHz ECC memory up to 8GB.
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Product
Rugged Conduction Cooled 3U CompactPCI Processor Blade with Quad-Core Intel® Atom™ Processor
CT-3620
Processor Blade
The ADLINK CT-3620 Series is a Rugged Conduction-Cooled 3U CompactPCI processor blade in single-slot (4HP) width form factor featuring a quad-core Intel® Atom™ SoC and soldered DDR3L-1333 ECC memory up to 4GB. Graphics is integrated graphics on the CPU and storage is provided by an onboard 32GB SSD. Rear IO signals include 2x GbE, 1x USB 2.0, VGA, 2x COM, and 1x SATA 3Gb/s, providing for expansion with an optional Rear Transition Module (RTM).
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Product
SMARC Short Size Module with Rockchip PX30 Quad-Core ARM Cortex A35
LEC-PX30
Computer on Module
LEC-PX30 based on power-efficient quad-core Arm® Cortex®-A35 SoC is a low-power, low-cost, entry-level, small-sized SMARC rev 2.0 module. For applications, such as IoT controllers, IoT gateways, wearable and mobile industrial devices, basic HMI, sensor concentrators, requiring good computing performance at low power consumption (1.5W- 5W) and Linux Yocto capability, LEC-PX30 is an ideal solution.
