SoC
A complete computer "System on a Chip".
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Product
PC/104 OneBank Board
EMC2-ZU3EG
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Sundance Multiprocessor Technology Ltd.
The EMC²-ZU3EG is a PCIe/104 OneBank™ SBC with a Xilinx Zynq SoC and a VITA57.1 FMC™ LPC I/O board. The main processing power of the EMC²-ZU3EG is a Dual Core ARM9 and combined with traditional FPGA fabrics/gates + High-Speed I/O interfaces, like USB2.0, HDMI, 1Gb Ethernet and SATA and provide an total solution for any Embedded Application.
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Product
SoC Test System
T2000
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SoC devices require small-lot high-mix manufacturing methods in the present era of rapid generation change. Semiconductor makers struggle with requirements to replace their testers on a 2-3 year cycle. The T2000 addresses their needs by enabling rapid response to market needs with minimum capital investment.
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Product
Linux-based Development Platform For The GridARM™ ΜController
PEAK gridARM Evaluation Board
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The ARM7 microcontroller gridARM™ was developed by Grid Connect® as a system on a chip solution (SoC) for the implementation of embedded applications with a focus on industrial communication. The Evaluation Board PEAK-gridARM is a Linux-based development platform for the gridARM™ microcontroller. It has connections for Gigabit Ethernet, high-speed CAN, USB 2.0, RS-232, SPI and I²C. The digital and analog inputs of the evaluation board can be manipulated with buttons and potentiometers. The states of the microcontroller, the supply and the message traffic are displayed via LEDs. A board support package for Linux enables access to the hardware resources of the PEAK-gridARM evaluation board.
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Product
Intel® Atom™ SoC E3825/ J1900 Pico-ITX SBC, DDR3L, 24-Bit LVDS, VGA Or HDMI, 1 GbE, Half-Size Mini PCIe, 4 USB, 2 COM, SMBus, MSATA & MIOe
MIO-2263
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Embedded Intel® Atom™ SoC E3825 & Celeron J1900 up to Quad-Core processor design, DDR3L 1333MHz support up to 8GBIntel Gen 7 DirectX®11.1 support, dual independent display by 24-bit LVDS + VGA or 24-bit LVDS + HDMIFlexible design using integrated multiple I/O: MIOe to approach vertical applications & keep domain knowhowRich I/O interface with 2 COM, 1 SATA, USB3.0, PCIe Mini Card and mSATASupports iManager, SUSI APIs, WISE-DeviceOn and Edge AI Suite
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Product
76kWh Lithium Battery 384V 200AHSolar Energy Storage LiFePO4 battery System
SPVLI-76KWH
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Zhejiang Sandi Electric Co., Ltd
SANDI ESS lithium battery system is composed of lithium battery modules, BMS system, PV charge controller, AC/DC Charger, central control unit CCU, temperature detector, integrated structure and other parts; the solar panels in the system are battery storage and power for output; BMS module completes the detection and control of voltage, current, temperature, SOC, SOH and charging and discharging related parameters of power battery pack; PV controller and inverter realize bidirectional AC/DC function to meet the charging and discharging conversion demand of power battery pack; each detector is used to monitor the ambient temperature in real time to ensure the safety of the system.
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Product
Wireless Networking Systems
ZigBee®
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Silicon Labs is the vendor of choice for OEMs developing ZigBee networking into their products. The Silicon Labs ZigBee platform is the most integrated, complete and feature rich ZigBee solution available a family of Wireless SoCs, based on ARM Cortex processor and 2.4 GHz transceiver, together the most reliable, scalable and advanced ZigBee software and supported by best-in-class development tools.
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Product
Qseven V1.2 SoM Evaluation Kit With I.MX287 454 MHz (Industrial) SoC, 128MB Memory, 4GB EMMC, Gigabit Ethernet, Audio, CAN And BSP
Q7M100-100-EVK
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*Ultra low power consumption ARM9*High flexibility Qseven v1.2 compliant design*5 UART*2 CAN*24-bit TTL LCD*10/100 Mbps Ethernet*Linux 2.6.35
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Product
Pico-ITX SBC With Intel® Pentium® N3710 & Celeron® N3060 Processor, HDMI (VGA)/LVDS, LAN And Audio
PICO300
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The PICO300, an extreme-compact fanless pico-ITX motherboard, is built with the Intel® Pentium® N3710 or Celeron® N3060 processor (codename: Braswell SoC). One SO-DIMM socket is provided to support up to 8GB of DDR3L-1600 memory. The PICO300 is supported in dual display configurations along with one 18/24-bit single/dual-channel LVDS and a choice of VGA or HDMI. Furthermore, the tiny 2.5” pico-ITX embedded board features Intel® integrated Gfx graphic engine to build excellent media and graphics performance capability. In addition, the compact size of the pico-ITX form factor also makes the PICO300 suitable for space-constrained embedded applications. It runs fanless operation, and supports -20°C to +60°C operating temperature. Combined all features as above, the PICO300 is ideal for any media editing, imaging, graphics and video intensive applications that be applied for a wide array of industrial IoT industries.
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Product
PCIe/104 OneBank Carrier for Trenz SoC Modules
EMC²-DP
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Sundance Multiprocessor Technology Ltd.
The EMC²-DP is a PCIe/104 OneBank™ Carrier for a Trenz compatible SoC Module and has expansion for a VITA57.1 FMC™ LPC I/O board and also has I/O pins, using a 100-way Samtec RazorBeam connectors system. The add-on board, called “Sundance External Interface Connector – SEIC” contains LEDs, RS232, USB2.0, HDMI, 1Gb Ethernet and SATA . The “SEIC” can be customize for individual applications and bespoke connectors.
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Product
SoC Test Systems
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Specifically designed for high-throughput and high parallel test capabilities to provide the most cost-effective solution for fabless, IDM and testing houses. With the full functions of test capability, high accuracy, powerful software tools and excellent reliability, 3650-EX is ideal for testing consumer devices, high-performance microcontrollers, analog devices and SoC devices.
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Product
SMARC Short Size Module With Qualcomm® QRB5165 Series Octa-Core SoC
LEC-RB5N
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- Qualcomm® Kryo™ 585 CPU (8x Arm Cortex-A77 cores)- Qualcomm® Hexagon™ Tensor Accelerator (HTA) running up to 15 TOPS- 4K HDMI/MIPI DSI display, MIPI CSI cameras- 2x PCIe x2 Gen3- 2x GbE Ethernet- 2x USB 3.1/2.0 and 4x USB 2.0- GPIO/SD and UFS- 5VDC +/-5% voltage input
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Product
Azure Defender For IoT
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Accelerate IoT/OT innovation with comprehensive security across all your IoT/OT devices. For end-user organizations, Azure Defender for IoT offers agentless, network-layer security that is rapidly deployed, works with diverse industrial equipment, and interoperates with Azure Sentinel and other SOC tools. Deploy on-premises or in Azure-connected environments. For IoT device builders, Azure Defender for IoT offers lightweight agents to embed device-layer security into new IoT/OT initiatives.
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Product
COM Express Compact Size Type 6 Module with AMD Ryzen™ Embedded V2000 APU (Zen 2 architecture)
cExpress-AR
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The cExpress-AR, featuring the new AMD Ryzen™ V2000 APU with its high performance integrated Radeon™ graphics, is the first Type 6 module on the market to support an octa-core (8-core) embedded SoC, with up to 16 threads and an impressive turbo boost up to 4.2 GHz. Compared to earlier embedded quad-core V1000 processors, the additional cores combined with AMD's Zen 2 architecture result in a more than two-fold performance increase and double the performance-per-watt efficiency.
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Product
PANAVIA Modules
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AIM’s PANAVIA test, simulation, monitoring and analysis modules use our field proven Common Core hardware design giving you the best performance, best feature set and highest functional integration on the market. The use of SoC (System on Chip) based core design with one processor for real time bus protocol support, massive memory and IRIG-B time code encoder/decoder functions are standard. AIM delivers versions of our modules with extended temperature range and conformal coating. With 8 Tx and 8 Rx channels per module, functions include autonomous transmit sequencing, continuous clock and data transmissions, host controlled double buffering, programmable interrupts, data selection on specific tag identifier, selectable triggers on data and/or tags with full protocol error injection/detection, real time bus recording and time stamping to ensure your bus integrity. Each module is delivered with a Board Support Package (BSP) comaptible to the legacy PCI and cPCI hardware modules.
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Product
FPGA Boards
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For over two decades, Digilent has proudly worked with Xilinx to become a global leader in the design and manufacturing of cost-optimized field-programmable gate array (FPGA) and System on a Chip (SoC) development boards. Optimized for accessibility and flexibility, our control system boards are suited to a wide array of applications ranging from embedded vison and sensor fusion to networking and RF to embedded measurement and control systems. Enjoy high performance-to-price ratio, ease-of-use through onboard peripheral support, extensive documentation and example designs, and an open-source philosophy.
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Product
RISC-based DIN-rail Fanless Embedded System With I.MX 6UL Processor, COM, CANbus, 2 LANs And DIO (2-in/1-out)
IFB112
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The IFB112.supports the low power consumption NXP (Freescale) i.MX6UL ARM® Cortex™-A7 528MHz SoC. The design concept of IFB112 is aiming to meet the demands of mission-critical applications. The gateway controller with IP30-rated aluminum and steel enclosure supports an extended operating temperature ranging from -40°C to 70°C, a wide voltage range of 9V - 48V DC power input with terminal block, and has been designed to withstand vibration up to 5G. For system integrators with wireless communication needs, the IFB112 has one PCI Express Mini Card slot, one SIM card slot, and two internal antennas. It supports one serial port, two LANs and one CANbus port to enable fast and efficient data acquisition and communication. Its digital I/O port provides users with a convenience of digital devices connection.
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Product
Battery Test Equipment
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Improper functioning of battery systems installed in utilities, power plants, telecommunication systems, industrial applications and etc., can cause severe failures of the supported equipment and loss of critical information. Therefore, the battery test verifies their actual SOC (State of Charge) or SOH (State of Health) and prevents unwanted scenarios which could result in a significant budget loss as well as endanger of human lives.DV Power battery test equipment is able to perform the following battery measurements, using BLU and BVR devices:- Voltage (String and Cell)- Capacity- Temperature- Density of electrolyteAll of the above-mentioned measurements are performed with the highest accuracy. The advanced DV-B Win PC software enables collecting both numerical and graphical results. These features provide an easier and more efficient analysis. After the test, DV Win software generates a test report with a single click. A user can easily customize the report and save it in different formats, such as CLS, PDF, Word, or RTF.
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Product
Hybrid Verification Platform
HES-DVM
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HES-DVM™ is a fully automated and scalable hybrid verification environment for SoC and ASIC designs. Utilizing the latest co-emulation standards like SCE-MI or TLM and newest FPGA technology, hardware and software design teams obtain early access to the hardware prototype of the design. Working concurrently with one another they develop and verify high-level code with RTL accuracy and speed-effective SoC emulation or prototyping models reducing test time and a risk of silicon re-spins.
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Product
Mini-ITX SBC With Intel® Celeron® Processor N3160 (up To 2.24 GHz) SoC, VGA/HDMI/LVDS, USB 3.0, Mini PCIe Card, MSATA And HD Audio
MANO300
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The MANO300 mini-ITX motherboard built with the latest Intel® Celeron® processor N3150 (codename: Braswell) with integrated Intel® Gen 8 graphics supporting up to 4K resolution. Two SO-DIMM sockets are provided to support up to 8GB of DDR3L-1600 memory. The 12V single voltage DC power jack or ATX power makes the power input selection more flexible for different automation and embedded industries. Its friendly fanless cooling system design and compact form factor aimed at space-limited applications as well as harsh environments.
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Product
Emulation Adapters
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With some of the more advanced 32-bit microcontrollers and SoCs, the full program and data trace capabilities of the device are not made available on production silicon. Instead, semiconductor vendors provide special 'emulation devices'. These typically feature more pins than the production device, thereby providing the interface to the trace interface.
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Product
SMARC Short Size Module with NXP i.MX 6 Multicore Arm® Cortex®-A9
LEC-iMX6R2
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- NXP SoC i.MX6 ARM Cortex A9 Solo, DualLite, Dual or Quad processor- Integrated 2D/3D graphics processors, 3D 1080p video processing, power management- Onboard DDR3L-1600 system memory from 512 MB to 2 GB- Supports up to 64 GB eMMC, 1x SD/MMC, 1x SATA 3Gb/s- Extreme Rugged operating temperature: -40°C to +85°C (optional)- 15 year product availability
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Product
PC/104 OneBank Board
EMC2-ZU4CG
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Sundance Multiprocessor Technology Ltd.
The EMC²-ZU4CG is a PCIe/104 OneBank™ SBC with a Xilinx Zynq SoC and a VITA57.1 FMC™ LPC I/O board. The main processing power of the EMC²-ZU4CG is a Dual Core ARM V7 and combined with traditional FPGA fabrics/gates + High-Speed I/O interfaces, like USB2.0, HDMI, 1Gb Ethernet and SATA and provide an total solution for any Embedded Application.
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Product
Generates Test Cases on ICE
TrekSoC-Si
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TrekSoC-Si automatically generates self-verifying C test cases to run on the embedded processors in SoCs in in-circuit emulation (ICE), FPGA prototyping, and production silicon. This verifies your chips more quickly and more thoroughly than hand-written diagnostics or running only production code on the processors. TrekSoC-Si's generated test cases target all aspects of full-SoC verification and work in a variety of different environments. TrekSoC-Si is a companion to TrekSoC, which generates test cases for simulation and acceleration. TrekSoC-Si extends the benefits of TrekSoC into hardware platforms.
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Product
DOOH Digital Signage
DS-330
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Intel Atom x7433RE, Processor N97 and i3 N305 Quad Core SoC with triple display, dual LAN, Fanless Box PC. Intel® Atom™ x7433RE, Processor N97, i3 N305.
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Product
Rugged PC Compatible
SYS-427
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WINSYSTEMS’ SYS-427 is a rugged, embedded computer featuring the latest generation Intel Apollo Lake-I SOC processor. Its small size, low power, and extended operational temperature make it a great fit for rugged embedded systems in the industrial control, transportation, energy, and industrial IoT markets.
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Product
COM Express® Compact Size Type 2 Module with Intel Atom® E3800 Series or Intel® Celeron® Processor SoC (formerly codename: Bay Trail)
cExpress-BT2
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The cExpress-BT2 is a COM Express COM.0 R2.1 Type 2 module supporting Intel Atom® processor E3800 Series and Intel® Celeron® N2930/J1900 processor SoC (codename: Bay Trail).
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Product
Intel® 5th Generation Xeon Processor, AMC
AMC752
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The AMC752 is a Processor AMC in a single module, mid-size based on the Intel® 5th generation Xeon (Broadwell). The efficient SoC design has low power consumption and integrated PCH technology. The module follows the AMC.1, AMC.2 and the AMC.3 specifications.
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Product
COM-HPC Server Type Development Kit based on Ampere® Altra® SoC
Ampere Altra Dev Kit
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Ampere Altra Dev Kit consists of a COM-HPC Server Base carrier paired with a COM-HPC Server Type Size E module and heatsink with fan. The module features Ampere® Altra® SoC (Arm Neoverse N1-based architecture) harnessing 32/64/96/128 Arm v8.2 64-bit cores for up to 1.7/2.2/2.8/2.6 GHz and providing support for up to 768GB DDR4 memory, offering unprecedented performance and power per watt with exceptional scalability.
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Product
Custom & ASSP
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Offering innovative SoC, SiP, ASIC, audio/video ASSP and other custom solutions and foundry services across a wide variety of applications in the automotive, industrial, medical, and aerospace & defense markets.
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Product
Universal PMICs
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PowerArchitect™ design and configuration software speeds development and significantly reduces overall time-to-market compared to legacy analog power solutions. An I²C interface and multiple GPIO pins ensure easy system integration. Configurable warning and fault levels, fault behavior and power up and down sequencing ensure any load can be properly powered and protected. The power system design can be completed with confidence long before the final revision of the SoC or ASIC is available.
