BGA Inspection
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Product
Inspection System
X-eye 7000B
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Appropriate for the inspection of medium•large size components and detection of surface structure and defects (inside voids and cracks etc).Due to high-energy, high-power Micro-focus X-ray Open Tube, maintenance cost's significantly reduced and long-term use possible with only replacing consumables.Customization is available with selecting main parts by customers depends on their needs for size and material.
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Product
Solder Paste Inspection Machine
3D SPI
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The 6500 series is the measurement equipment provided by Jiezhi Technology for the small pads of solder paste printed on the PCB board. It will cause defects such as sharpness, offset, more tin, and less tin printing during solder paste printing. Causes defects in the later stage of production, this equipment can find problems in advance
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Product
Industrial CT X-Ray Inspection System
X3000
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The X3000 is North Star Imaging’s newest standard system. Whether you are inspecting small or large components, the X3000 is the best option for customers needing a compact system with unique capabilities generally available on a larger X-ray or CT system.
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Product
3D Inline Solder Paste Inspection System
TROI 7700 SERIES
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Using Moire' pattern, Pemtron's three-dimensional lead applicationdosage tester combines 2D color images with 3D measurement data toprovide more detailed, near-real PCB images, unlike traditionalcolor maps. We will also provide you with the best solution forhigh-quality and high-precision PCB production with a varietyof statistical programs, along with information you need toquickly and accurately judge positive/failure.
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Product
Cargo and Vehicle Inspection
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In a world where threats continue to evolve and concealment techniques become more sophisticated, our customers are facing more complex, difficult missions than ever.
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Product
3D Solder Paste Inspection (SPI)
TR7007 SII
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Offering inspection speeds of up to 200 cm2/sec, the TR7007 SII is the fastest solder paste inspection system in the industry. This highly accurate inline shadow-free solder paste inspection solution offers full 3D inspection at resolutions of 15 µm or 10 µm. Built on a high precision linear motor platform, the system's hallmark features include closed loop function, enhanced 2D imaging, auto-warp compensation and fringe pattern technology. Increase capacity without sacrificing additional space with an available dual-lane configuration.
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Product
Automated Optical Inspection (AOI)
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Automated optical inspection (AOI) is an automated visual inspection of printed circuit board (PCB) (or LCD, transistor) manufacture where a camera autonomously scans the device under test for both catastrophic failure (e.g. missing component) and quality defects (e.g. fillet size or shape or component skew). It is commonly used in the manufacturing process because it is a non-contact test method.
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Product
Infrared Camera for CO Detection and Electrical Inspections
FLIR GF346
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The FLIR GF346 optical gas imaging camera detects carbon monoxide (CO) and 17 additional gases without the need to interrupt your plant's production process. CO emissions can be a significant threat to primary steel manufacturing operations; even the slightest leak in a vent stack or pipe can have a devastating effect. With the FLIR GF346, inspectors can scan large areas from a safe distance, pinpointing leaks in real-time, reducing repair down-time, and providing repair verification.
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Product
First Article Inspection Machine
Optima III FAI
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Landrex Technologies Co., Ltd.
First Article Inspection Machine
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Product
GENERAL INSPECTION MACHINE AFTER SOLDER MASK
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DVI is a technology of automated optical inspection, which can inspect deep to the difference from semi-transparent layers or semi-reflective layers.
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Product
Automated LED Inspection and Testing
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Landrex Technologies Co., Ltd.
Automated LED Inspection and Testing
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Product
High-Accuracy Automated Optical Inspection Systems
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Fully-automated and high-accuracy 3D inspection and measurement systems. High-power, long working distance optics and high-resolution digital camera are perfect for high-magnification applications. These are full-color systems capable of high-accuracy measurements, automated defect detection and color verification.
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Product
RC BGA Interposer, LPDDR4 200-ball, Rigid, Connects Using 2x U4207A
W6602A
Interposer
The W6602A LPDDR4 rigid RC BGA interposer for LPDDR4 200-ball DRAM enables capture of simultaneous read and write traffic at data rates and has been tested to 3200 MT/s. Two U4207A zero Ω, 34-channel, soft touch pro, single-ended, 4 x 160-pin direct connect probes are required to connect the W6602A LPDDR4 BGA interposer into two U4164A logic analyzer modules. The W6602A LPDDR4 rigid RC BGA interposer allows signal access to the LPDDR4 signals critical to your debug and validation effort through a U4164A logic analyzer system. The probe works in existing designs and eliminates the need for up-front planning or redesign. The probe connects directly to the balls of the DRAM using a LPDDR4 200-ball riser (included) or an optional 3rd party socket (not provided), enabling operation and acquisition of LPDDR4 signals.
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Product
Defect Inspection Systems
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Candela® defect inspection systems detect and classify a wide range of critical defects on compound semiconductor substrates (GaN, GaAs, InP, sapphire, SiC, etc.) and hard disk drives, with high sensitivity at production throughputs.
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Product
3D Solder Paste Inspection (SPI)
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Systems designed for solder paste inspection (SPI) quickly and reliably check the solder paste deposits on the circuit board.
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Product
Surface Defect Inspection System
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Wafer for inspection of surface condition of specular flat substrate, glass substrate, others φ 100 ~ φ 300 compatible
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Product
Software Module with a Virtual Gage for Real-Time Inspection and Assembly
Verisurf Build
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Verisurf BUILD is the industry-leading tool for real-time model-based inspection, tool fabrication, and computer-aided assembly.Inspect position and profile, set details and fabricate tools, jigs, and fixtures faster and at lower cost than any other process or software.Evolved and perfected from a large installed base at today’s modern aerospace, automotive, and industrial tooling manufacturers.
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Product
Nano-focus X-ray Inspection System
X-eye NF120
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Nano-focus Tube of 400 nano resolution is installed which is specialized for Semiconductor Packaging, Wafer Level Packaging(WLP) requiring detection of Sub-micron defects.Able to trace and inspect defected area precisely by precise movement of axis with Anti-vibration table.Tomography is available if 3D CT module is added and Wafer Bump Automatic Inspection is available from loading to inspection with wafer handler systems.
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Product
Inspects MEMS and Wafer Level Devices
NorCom 2020-WL
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The NorCom 2020-WL is specifically designed for wafer-level inspection and leak tests up to 1000 devices per cycle. The system can inspect up to an 8” wafer on or off a saw frame. It is designed to test MEMS and other wafer level devices that have a cavity.
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Product
Protective Coating Inspection
Kit 5
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A more comprehensive kit than kits 1-4, the Elcometer Protective Coatings Inspection Kit 5 expands the range of instruments available to the protective coatings inspector.
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Product
Radiographic Inspection Test
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The radiographic inspection is a non-destructive x-ray method for detecting internal physical defects in small component parts which are not otherwise visible. Radiographic techniques are intended to reveal such flaws as improper positioning of elements, voids in encapsulating or potting compounds, inhomogeneities in materials, presence of foreign materials, broken elements, etc.
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Product
Magnetic Particle Inspection
NDT
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DCM Tech offers a comprehensive selection of Magnetic Particle Inspection machines for non-destructive testing (NDT). Easily and quickly detect internal and subsurface damage on critical parts. Contact DCM to speak to your regional Technical Specialist about adding an MPI to your shop.
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Product
Auto Macro Wafer Defect Inspection
EagleView
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EagleView automated macro defect semiconductor wafer inspection system provides industry leading throughput, defect detection accuracy, and wafer classification for semiconductor manufacturing. EagleView systems have inspected over 100 million semiconductor wafers worldwide. The EagleView macro defect inspection tool resolves many of the problems and pitfalls of manual and micro wafer inspection by automating and standardizing semiconductor wafer inspection processes while creating complete images of every wafer in the cassette. Unlike manual micro defect wafer inspection, EagleView’s automated wafer inspection is always consistent, tireless, reliable, and fast. EagleView helps find macro defects while there’s still time to take corrective action.
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Product
Portable gear inspection- and 3D-measuring systems
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ultimate independent measurement - on the production machine or on the shop-floor without rotary table
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Product
For Real-Time X-ray Inspection Systems
Image Processors
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A number of image processing software packages are available. Features include frame averaging, measurement, text, label, marking, 3-D rendering, video recording and image storage. Additionally, BGA analysis and void measurement software can be added as well as other options. See our image processors for x-ray inspection machines below.
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Product
Real-time X-ray Medical Device Inspection System
The Bench-X
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Our latest real-time, compact system used for Medical Device X-ray Inspection. Very configurable and compact with high resolution at relatively low radiation levels.
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Product
Process Control, Measurement and Inspection Workstation
ScanINSPECT VPI
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ScanINSPECT VPI is a fully integrated, stand-alone process control, measurement and inspection and programming workstation for use in setting up processes before the production floor in the PCB or Hybrid Microcircuit assembly industries.
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Product
NUV-PL SiC Defect Inspection System
VS6845E
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Industrial Vision Technology Pte Ltd.
Comply with IEC63068-3 Standard: Test method for defects using photoluminescence, Model VS-6845 SiC Wafer defect inspection system has capability on Non-destructive recognition criteria of defects in silicon carbide homoepitaxial wafer for power devices.
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Product
Concrete Inspection
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Concrete structures are normally constructed using steel reinforcement and Elcometer offers Concrete Covermeters and Rebar Locators to either measure the depth of concrete over the rebar or simply to detect the rebar under the surface. Half-cell versions of the Covermeter can be used to assess the probability that corrosion is taking place on the rebar. Test Hammers are used to assess the surface hardness of cured concrete and Elcometer offers several moisture meters that can be used to determine if the structure is sufficiently dry for coating.
