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Probe Cards
semiconductor bond pad and signal terminals interchangeable electro-mechano Interface to tester.
See Also: Cards, Extender Cards, POST Cards, Test Cards, Probe Card Interfaces, Wafer, Test Probes
- Pickering Interfaces Inc.
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PXI 4-Slot BRIC 96x8 Matrix, 2A 2-Pole (4 sub cards)
40-565A-002-96X8
The 40-565A PXI Matrix BRIC provides a range of high density matrix modules able to switch up to 2 Amps at 150VDC/100VAC The 40-565A BRIC modules are available in 2, 4 or 8 slot PXI sizes to suit most high performance PXI Matrix requirements, constructed using quality electro-mechanical relays for high switching confidence.
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Probe Needles for Wafer Sort and Test Applications
Advanced Probing Systems, Inc.
APS is the global leader in the manufacture of probe needles used in cantilevered probe cards. All probe needles used in wafer sort are manufactured according to customer specifications using stringent in-process quality assurance procedures.
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Probe Cards
PICOPROBE® PROBE CARDS by GGB Industries, Inc., allows for more chip design flexibility because each probe card is custom configured to your circuit for testing wafers on either manual or automatic probe stations. Probe cards with complex layouts consisting of numerous DC contacts and multiple microwave probes with operating frequencies of 40, 50, 67, or 110 GHz can be custom fabricated quickly and inexpensively.
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Probe Card
Japan Electronic Materials Corp.
The probe card is a tool for testing semiconductors used at "Wafer Test" to check quality of IC or LSI in the first process of semiconductor manufacturing. The probe card is expendable.
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Probe Cards
Ceramic Blades
SV TCL offers a variety of ceramic blades and blade probe cards. We have patented ceramic microstrip blade probes available in low leakage and low capacitance for optimal signal transference, while SV TCL's blade cards are ideal for parametric and RF testing.
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Fiber Inspection Probe
FIP-920
FIP-920 Fiber Optic Inspection Probe combines a 3.5” high definition TFT LCD display, provides a detailed image of fiber end-face, zoom in/out feature make it easy to identify the smallest particles, scratches. With the attached SD card memory, you can capture/record the live end-face image, the image file can be reviewed/transferred via SD card reader or USB cable. Up to 8hrs battery working make it possible to inspect the fiber end-face at any time and any place.
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Probe Card
VersaTile™
Celadon has reduced the size of a probe card to 28mm with the VersaTile™ with Advanced Cantilever™ technology. The VersaTile™ with Advanced Cantilever™ technology can fit on a conventional 3-hole mount probe positioner for single site probing. The same VersaTile™ with Advanced Cantilever™ technology can be used in a 300mm VersaPlate™ for multi-site probing.
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3U VPX RL Thermal Load Simulation Module
The 3U power test module is an ideal solution for evaluating heat dissipation in a rugged conduction cooled VPX cage or chassis. This card is a thermal load in the chassis to evaluate the heat dissipation. The chassis can be monitored with temp sensing probes and or FLIR imaging. Different wattages are selected by setting dip switches. The +5 and 3.3V loads are on the top of the module. The +12V and -12V loads are on the bottom side of the module.
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Probe Cards
Vertical Probe Card. (Mobile D-RAM, L.D.I Flip Chip 60um Pitch,. System LSI, Soc Devices). Cantilever Probe Card. Low Leakage Probe Card.
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Vertical Space Transformers
ST
The Space Transformer (ST) is an integral part of the probe card, utilized between the probe head and the PCB. Nidec SV Probe provides a wide variety of space transformation options including: • WST™ (Wired Space Transformer) • MST™ (Modular Space Transformer) • MLC (Multi-Layer Ceramic) • MLO/Mini-PCB (Multi-Layered Organic) • Multi-Site MLO Reflow of Package Substrate • MLC with MLTF to 50µm PitchOne of the main priorities for Nidec SV Probe is the internal development and manufacture of our own probe card components. We now offer in-house manufactured space transformer technologies with shorter lead time and competitive pricing. Contact your sales representative to learn more about our internally manufactured STs or any of our other ST technologies.
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Vertical Probe Cards
B3
The patent-pending B3™ structure requires a minimum number of parts and can handle up to 300 probes. This vertical technology can provide: • Increased Uptime • Extended Probe Lifetime • Reduced Maintenance • Lower Cost of TestThe B3™ is an ideal solution for testing small pads and the low force probes minimize scrub. Planarity also remains stable over time increasing probe card life. Contact your sales representative to learn more about our B3™ probe cards.
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Probe Card PCB's
DTS offers both generic and custom PCBs blanks for probe cards. Probe card PCBs are available for all tester platforms and can be configured for any vertical technology, epoxy cantilever and legacy blade cards. DTS probe card blanks are made to precise specifications required for all probing technologies and are available in high speed and high temperature materials. All probe card PCBs employ a balanced layering construction to maintain tight flatness specifications and minimize warping, allowing good probe planarity. Gold plating on all surface metals facilitates easy soldering and minimizes probe resistance. DTS is continually adding new probe card blanks to its library!
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VPX Interposer
VPX850
The PCIE850 provides a complete test and debug solution for PCI Express Bus. Interposers and probes connect to the PCIE850 providing access to PCI Card, AMX, XMC and VPX systems.
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DDR4 BGA Interposers, DDR4 DRAM X16 Packages
N2115A
The N2115A DDR4 BGA Interposers are soldered in between the DRAM and PC board or DIMM raw card where the DRAM would normally be soldered. They are designed with the PCB or DIMM foot print on the bottom side and the DRAM footprint on the top side. The signals from the memory controller chip and DRAM are then passed directly to the top side of the BGA probe adapter where they can be accessed with the oscilloscope probes.
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Low-leakage Switch Matrix Family
Conducting all the parametric measurements necessary for the numerous test structures on a semiconductor wafer can be a time-consuming and expensive process. With the cost of end-user devices continuing to drop, even laboratory characterization environments must reduce the cost of test. Until now engineers and scientists working on current and future semiconductor process technologies were faced with a difficult choice: either use a semiconductor parameter analyzer with positioners on a wafer prober, which limits the ability to perform automated test, or use a switching matrix and probe card, which reduced the analyzer's measurement resolution. Utilizing a switching matrix with a semi-automatic or fully-automatic wafer prober enables characterization tests to be automated, eliminating the need to have an operator manually reposition the probes each time a new module needs to be tested. This reduces both test time and cost. Due to the many price/performance points available, Keysight's switching matrix solutions provide the flexibility to choose exactly what your testing needs require, without overspending.
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Probe Card
T90™ Series
The 90 mm tile was designed for mounting on a standard 4.5″ probe card holder for multi-site wafer level reliability testing. The 1.6 mm (0.062″) thick rails allow the chassis to slip into planarity adjustable probe card holders for most analytical probe stations.
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Wafer Probe Loadboards/PIB
DTS has a full line of standard PIBs for all major tester platforms. Custom PIB designs can accommodate any test head, prober and manipulator configuration, including probe card changers, overhead direct dock setups and cable interfaces. DTS wafer test loadboards are compatible with a variety of pogo pin interface towers. All PIBs are constructed with impedance control, precision matched line lengths, full power and ground planes and both analog and digital resources to provide high quality signal integrity directly to the device.
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Probe Card
Indexer™
The patented Indexer™ is the industry’s first automatic probe card changer designed for lights out parametric test.*Can support up to five VC20™’s with Advanced Cantilever™ technology, any variety*Card changes are complete in seconds*Fully programmable*Tested for hundreds of thousands of touchdowns.
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PCI Express® 5.0 Interposer
OCP NIC 3.0
The Summit product family includes a wide variety of Interposer systems, designed to reliably capture serial data traffic while minimizing perturbations in the serial data stream. Probes include interposers, which are designed to capture data traffic crossing the PCI Express card connector interface, and MidBus probes, which are designed to capture traffic flowing within a PCB.
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Metrology Systems
VIEW offers a full line of optical metrology systems for wafer, photomask, slider, MEMS, semiconductor package, HDD suspension, probe card, and micro-component process measurements.
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Complete Power Analysis System
PK3564-PRO+
PK3564-PRO+ complete Power Analysis System includes PS3550 Power Analyzer, AC charger, Quick-Start manual, deluxe voltage leads, four eFX6000 flexible current probes, SD memory card, PSM-A Software, Mini Line-to-DC Converter, Bluetooth Adapter, USB Communications Cable, CASW Weather-Resistant Carrying/Operating Case, and 2-year deluxe warranty.
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VX4 System
PrecisionWoRx
The PrecisionWoRx VX4 System gives test facilities and probe card manufacturers the ability to confidently test tighter pitches and smaller probe tips. The system can be easily configured to specific requirements for a variety of probe card technologies. For processes using cards with very small probe tips, the system’s high-resolution optics deliver a detailed field-of-view for high accuracy and repeatability.
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Multisite Probe Card
T300 ButtonTile™
The Celadon T300™ probe cards are designed for long-term, multi-site, high-density wafer level reliability or burn-in tests up to 400°C. In today’s economic environment, conventional reliability data is needed quickly while eliminating the cost, electrical stress, and delay of parts packaging while maintaining a wafer performance map.
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Metrology
SV TCL also has the capability to emulate the testing environment with our probe card analyzers including newly installed direct dock analyzers in the United States, Taiwan and Vietnam. SV TCL is dedicated to continuous product improvement so that we can provide our customers the latest and most innovative test solutions.
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AUTOMATED TEST STAND DESIGN
Automated test systems may be as simple as a laptop with a DAQ module or a stand-alone controller, but they typically require a mix of off-the-shelf and custom hardware. All that hardware is integrated and wired into a test stand. Portable or mobile test stands are ideal for in-the-field research and development and servicing of multiple laboratories or manufacturing lines. Test stand access to the front panels of hardware and subcomponents allows manual configuration of non-automated settings. Quick disconnects, cable harnesses, and easy access to probes provides efficient setup and tear-down. Expandable or modular rack mount and card base systems facilitate future needs. Ergonomic considerations include keyboard and display placement, along with number of monintors. Safety is always crucial with proper E-stop placement and keeping dangerous elements away from users.
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Cantilever type Probe Card / C type
CE Series
Japan Electronic Materials Corp.
*Standard Cantilever Probe Card*Low Contact force*Stable Contact*High accuracy of alignment*Suitable for variety of Devices
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PCIe 4.0 Protocol Analyzer
Summit T48
Teledyne LeCroy’s Summit™ T48 joins the Summit™ T416 as the second protocol analyzer to be released in its family of tools supporting the PCIe 4.0 architecture. The new Summit™ T48 protocol analyzer based on the PCIe 4.0 specification supports up to 16GT/s and up to x8 lane width for protocol analysis. Companies that are interested in testing PCIe 4.0 based I/O cards such as Storage Controllers, Ethernet, Fibre Channel, Infiniband, and others will now be able to get all of the protocol analyzer debugging features they need, while being able to better manage their costs. SSD storage applications will also benefit from the integrated support for SSD bus protocols such as PCIe/ NVMe/ SMBus/ NVMe-MI/ TCG and others. When combined with Teledyne LeCroy’s Summit™ Z416 protocol exerciser, the Summit™ T48 will provide a deeper understanding of test results on a variety of test configurations. Teledyne LeCroy’s wide range of high speed interposers and probes provide full flexibility and connectivity to CEM and other form factor sockets on system boards as well as solder down and mid-bus probes.
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Probe Card Test & Analysis
Automated probe card test and repair is used to monitor probe card health to ensure cards are ready and capable of testing semiconductor devices. In cases where the card is not meeting performance specification, repairs may be performed such as tip adjustment or card cleaning, thus returning the card quickly to a production state.
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Complete Power Quality Analysis System
PK4564
PK4564 complete Power Quality Analysis System includes PS4550 Power Quality Analyzer with extended memory, AC charger, Quick-Start manual, deluxe voltage leads, four eFX6000 flexible current probes, SD memory card, CAS3 hard-shell carrying case, PSM-A Software, and 1-year deluxe warranty.
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Probecard testers
MANAGER
Today more complex probe cards are being used. More pins,higher density and larger array requires a new approach inprobe card analysis. With the soaring cost of new generationprobe cards, repair of defective cards becomes an necessity.BE Precision Technology offers all capabilities with the newMANAGER V. Future proof, up to 450 mm full wafer contactprobe cards can be analyzed with up to 88.000 test channels.High-end materials are used to stand extra tough requirements—such as 500 mm diameter diamante viewing window,ultra stiff carbon flip-table, high power Z–stage to generate 600Kg of contact force
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Generic Probe Cards, PIB's, and Loadboards
Test Spectrum can provide generic Probe Cards, Probe Interface Boards (PIB), and loadboards. Choose from existing configurations already designed, or a generic test board for your specific tester configuration can be designed quickly.Teradyne J750 Probe Card and PIB; Teradyne Integra Flex PIB; Teradyne Ultra Flex PIB; Teradyne Catalyst PIB; Credence Quartet PIB (Probe Interface Board); Advantest 93K 1024 PIB
