Solder Paste Inspection
assures volume and area of paste application.
See Also: Solder Paste, Solder Paste Measurement, 3D Solder Paste Inspection
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Cylinder Inner Wall Inspection
The CylinderInspector is an optical, non-destructive inspection and measurement tool for cylinder surfaces.
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Reel to Reel Non-Contact OS Inspection System for TAB/COD/TCP/TBGA
TRV
*Most suitable mechanism for non-contact inspection*Sprochet-less transfer decreases products damage.*Easy operation by Fixture alignment mechanism*Equipped with Tracing Test function
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Inline 3D-CT Automated X-ray Inspection Systems (3D-AXI)
3Xi Series
Saki's 3D-AXI (X-Ray) series adds significant inspection capability. The system utilizes Planar Computed Tomography (PCT) providing high precision CT imaging at high speed.
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X-Ray Inspection System
TruView™ Cube
The Perfect Solution for a Powerful Small Form Factor X-ray Inspection System. The all new TruView™ Cube X-Ray Inspection System is a fully motorized radiography system developed to meet the stringent requirements of electronics assembly and component inspection. Ideal for applications where space is premium, the the TruView™ Cube X-Ray sits comfortably on your laboratory bench.
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Solder Cup Connector Kit
Y1139A
Used to build custom cables for 34921/23/25/31/32/33/37/38 –50-pin Dsub female – 125 V
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Compact Inspection Camera
Fits in your pocket or clips on your beltAffordable1 meter drop-proofLong, thin camera-tipped probe with excellent depth of field penetrates tight, hard-to-reach spacesProbe is waterproof, holds its configured shape, and coils inside clamshell case for storageFour camera-lighting LEDs produce bright, crisp video on large color LCDFour screen controlsFour useful probe tip accessories (pickup hook, magnetic pickup, 45 mirror, thread protector)
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Wafer Inspection System
JRT Photovoltaics GmbH & Co. KG
In close cooperation with well-known providers of inspection systems, we provide modular systems for quality control and classification of raw wafers.
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Vision Inspection Products
Vision inspection systems use a series of high-speed cameras and imaging software to detect and measure random objects as they move along a conveyor belt. Custom software and measurement algorithms can determine the size, shape, color or composite measurement of any object and convert this into standard units for quality control. Bench, over-line, and in-line systems are available and provide real-time 100% inspection and rejection of any production line.
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Wireless Inspection Cameras
General offers three wireless inspection cameras whose probes can be disconnected from the grip and monitor. They are the DCS18HPART (with a 6mm/0.23 in. diameter articulating probe), the DCS1800HP (with a 5.5mm/0.22 in. diameter non-articulating probe), and the DCS500 (with a 9mm/0.35 in. diameter probe and a 5 in. diagonal color LCD). Wireless inspection cameras offer operating flexibility because the user can use both hands to manipulate the probe.
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Automated And Manual Sample Inspection
In addition to typical in-process, continuous dynamic measurement applications, LaserLinc’s non-contact measurement equipment is well suited for manual and automated off-line sample inspection. Inspecting cylindrical products with long, thin characteristics, such as camshafts and catheters requires checking multiple locations and dimensions for accuracy. Manual inspections of these areas can be difficult because of the complex profile as well as the need for numerous measurement stations, different equipment and skilled personnel.
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X-ray Inspection System
RTX-113HV
Precision X-ray Inspection for BGAs, QFNs, LEDs, sensors, medical devices, and other packaged devices.
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Inline Wafer Electrical quality Inspection
ILS-W2
the Ultimate Wafer Electrical Quality Inspection Unit for Wafer Inspection Systems
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First Article Inspection Services
API’s, on-site, first article measurement services provide inspection data on parts and assemblies with direct comparison against CAD models or drawings. Generated 3D measurement data from our portable metrology equipment and 3D scanners offers a comprehensive analysis of the physical part under measurement. Inspection reports can include 3D color maps or generated 3D models for detailed computer analysis.
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Verification And Print Quality Inspection Solutions
Integrate quality barcode verifiers within your production line using our robust barcode verification technology.
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Building Inspection Kit
MR160-KIT2
Troubleshoot moisture and building problems wherever you go with the FLIR MR160-KIT2. This kit features the MR160, a moisture meter with IGM™ to quickly target problem areas, as well as the C2, a full-featured, pocket-sized thermal camera designed for a wide range of building and electrical applications. The MR160’s integrated pinless sensor and external pin probe provide the flexibility to take either intrusive or non-intrusive measurements. The kit also includes the MR06 wall cavity probe for even greater functionality.
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X5C Compact X-Ray Inspection
Designed with packed convenience food, ready meals and small packaged goods in mind, the X5C is LOMA's smallest X-ray system available, with a machine length of 1000 mm and offers excellent Critical Control Point (CCP) protection in the smallest footprint possible - and manufactured under LOMA's Designed to Survive philosophy to provide one of the toughest systems on the market.
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Hand-held Fiber Inspection Microscopes
The WL-C series hand-held fiber microscopes use coaxial illumination to provide users with maximum detail. It easily can detect the finest scratches and contamination, making it ideal for critically inspecting polish quality.
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PHOTOMASK INSPECTION MACHINE
NEGATIVE FILM
Negative film and photomask inspection originated from the extensive use of printed circuit boards. Negative films and photomasks are used in large quantities. The early detection method is to use the "inspection light table" for inspection, which requires too much manpower and material resources, and manual testing may be due to eye fatigue and negligence.
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Magnetic Particle Inspection
Shanghai Xianda Denshijiki Industry Co.,Ltd
Using the "leakage magnetic flux" phenomenon generated from the scratches, the magnetic powder (or fluorescent magnetic powder) of the ferromagnetic material scattered on the surface by magnetizing the specimen is adsorbed to the scratch. Observe this and detect scratches.
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Connector, 104-Pin D-Type Male, Solder Bucket, 5A
40-960-104-M
This 104-pin male D-type connector allows users to create their own cable assemblies. Cable connection is via solder buckets - supplied with rear cable entry backshell.
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The Ultimate Inspection Tool
ULTRAPROBE 9000
The Ultraprobe 9000 Kit Complete is a digital ultrasonic inspection, information storage and retrieval system that is so versatile, so easy (most operators are able to use the Ultraprobe 9000 within 15 minutes) and so much fun to operate, you'll be looking for opportunities to use it every day.
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Wafer Sorter and Inspection
SolarWIS Platform
Eliminating the opportunity for problematic wafers to enter cell manufacturing lines greatly improves output and yield. ASM AE’s wafer sorter features 3D area inspection capability to inspect wafer thickness, total thickness variation (TTV), saw marks, as well as wafer bow and warpage. SolarWIS also includes modules that can inspect for stain, geometry, micro-cracks, edge chips, resistivity, P or N conductivity and lifetime.
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68-Pin VHDCI Connector, Slimline - Male, Solder
C068VMR-6SB-6A
This slimline version of the VHDCI connector is designed to allow users to directly terminate a cable with soldered connections to the 68 Way VHDCI connector. It is difficult to terminate cable to the 68 pin VHDCI because of the high density and fine pitch. Pickering Interfaces recommends the use of purchased cable assemblies for applications where most or all of the contacts are in use.
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E-beam Metrology And Inspection
Our HMI e-beam solutions help to locate and analyze individual chip defects amid millions of printed patterns.
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(AOI) Automated Optical Inspection Systems
For automated defect detection and high-accuracy measurements. VisionGauge Online High-Speed AOI systems are perfect solutions for demanding high-throughput, high-resolution applications. These systems are perfect for a wide range of applications including MicroElectroMechanical systems (for MEMS inspection or MEMS measurement), semiconductor & discrete device inspection and measurement.
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Test & Inspection
Our test and inspection products support maintenance, product quality testing, diagnostics, and quality control. The extensive range of products covers almost any application need you to have.
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End Face Inspection
Cleave quality inspection. High precision interferometers for checking the end face quality of cleaved optical fibers and for cleave process optimization. Crisp and clear fringe patterns and software with advanced measurement functionality. Ideal for use in production settings and when working with difficult to cleave fibers in laboratory environments. Fiber holder adaptors available for use with cleavers and splicers from the major splicer manufacturers. This facilitates easy transfer of the fiber from cleaver to interferometer and then onto the splicer with no need for reclamping.
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Micro Coax, Two Piece Contact, ITA, PCB Vertical Mount, Solder
610141109
For vertical PCB terminationsUsed with standard 50 and 120 Pin Micro Coax ModulesUp to 10GHz transmission speeds (PCB design dependent)Two-piece contact that allows for pin replacement, field repairableMates to all existing Micro Coax contactsMechanical SpecificationsDurability 10,000 cyclesContact Material Center Conductor – BeCuShield – BrassContact Plating 50µ" Au over 100µ" NiContact Termination Center Conductor - SolderShield - CrimpInsulator PTFEMating Force 1.5 lbs max [0.68 kg]Electrical SpecificationsCharacteristic Impedance 50ΩFrequency Range DC to 10 GHzVSWR 1.59 @ 10 GHzInsertion Loss – √f(GHz) x .325 dBDWV 800 V RMSContact Resistance 6 mOhms center/4 mOhms outerEnvironmental SpecificationsOperating Temperature -65°C to +125°CVibration MIL-STD 202, Method 204, Test Condition DShock MIL-STD 202, Method 213, Test Condition IInsulation Resistance 2000 MOhms Min.
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Solder Paste
MVP Versa (3D SPI)
The first part of any SMT process is Paste. MVPs Versa and 900 Series platforms provide high accuracy paste inspection. High accuracy paste measurements are made using a choice of 10um or 5um 3D measurement systems.
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Highly Integrated Optical Inspection
BOA
BOA is a highly integrated optical inspection tool for controlling quality and increasing productivity. It comprises all the elements of an industrial machine vision system in a tiny smart camera style package.
