Solderability
-
Product
160-Pin DIN41612 Connector, Solder Pin, Male
40-960-160-M
DIN41612 Male Connector
Suitable for users to create their own cable assemblies, this product can be supplied with or without the backshell. For applications in LXI products where 4 connectors are used in a horizontal row if the user requires all connectors to have a second fixing then the connector can be fitted with an optional screwlock assembly.
-
Product
Plugbord
3677
-
VECTOR Electronics and Technology, Inc.
44 Gold plated edge contacts (22 each side)on 0.156"(3.96mm) centers. 3-Hole solder pads (0.28” x 0.080”) and buses forinterconnecting multiple component leads. No pattern on reverse side, edge contacts only Row and column legends provided.
-
Product
Emulation & Test Interface
-
Solder down modules to suit any package type provides a cost effective solution for replacement test heads, male or female. The mating top modules can incorporate either a ZIF or standard IC socket and the addition of optional test pins if required from RS Components.
-
Product
PCIe 4.0 Protocol Analyzer
Summit T48
Protocol Analyzer
Teledyne LeCroy’s Summit™ T48 joins the Summit™ T416 as the second protocol analyzer to be released in its family of tools supporting the PCIe 4.0 architecture. The new Summit™ T48 protocol analyzer based on the PCIe 4.0 specification supports up to 16GT/s and up to x8 lane width for protocol analysis. Companies that are interested in testing PCIe 4.0 based I/O cards such as Storage Controllers, Ethernet, Fibre Channel, Infiniband, and others will now be able to get all of the protocol analyzer debugging features they need, while being able to better manage their costs. SSD storage applications will also benefit from the integrated support for SSD bus protocols such as PCIe/ NVMe/ SMBus/ NVMe-MI/ TCG and others. When combined with Teledyne LeCroy’s Summit™ Z416 protocol exerciser, the Summit™ T48 will provide a deeper understanding of test results on a variety of test configurations. Teledyne LeCroy’s wide range of high speed interposers and probes provide full flexibility and connectivity to CEM and other form factor sockets on system boards as well as solder down and mid-bus probes.
-
Product
Solder Cup Connector Kit
Y1142A
-
Used to build custom cables for 34950A – 78-pin Dsub male – 60 V.
-
Product
3.5 Inch SBC with 7th Gen Core i7 CPU and PCIe/104
VENUS
-
Based on the “Kaby Lake” 7th generation Core i7 processor, Venus offers high CPU performance in a small form factor rugged SBC with modest power consumption. It incorporates a full suite of rugged features such as soldered memory, latching connectors, a thicker PCB, and true -40/+85ºC operating temperature, making it suitable for the most demanding vehicle applications. High I/O density, multiple expansion sockets, rugged design, modest power consumption of 14W, and wide temperature operation combine to make Venus an extremely attractive option for applications requiring high CPU performance or ruggedness.
-
Product
25-Pin D-Type Male Solder Bucket
92-960-025-M
D-Sub Male Connector
This accessory is designed to allow users to directly terminate a cable with soldered connections to the connector. When the product is used without a backshell users should make their own cable strain relief arrangements and ensure appropriate electrical precautions are observed.
-
Product
Circbord
8029
-
VECTOR Electronics and Technology, Inc.
Pad-per hole pattern both sides. 0.042" diameter holes plated thru. 0.080" diameter isolated solder pad around each hole on both sides. 0.125" diameter corner mounting holes. Unrestricted component placement and extended area for high density applications..
-
Product
Solderability Tester
LBT210
-
Microtronic Microelectronic Vertriebs GmbH
Microtronic's LBT-210 solderability tester has software that offers statistical information such as mean value, standard deviation, etc. A camera option offers video of the test cycle and storage in memory with the appropriate test measurements and data. Additionally, it has the feature to test under nitrogen. This function can be switched on in the software. An enclosure that is flooded with nitrogen lowers and rises with the device under test.
-
Product
SparkFun Decade Resistance Box
-
This is the SparkFun Decade Resistance Box, an involved PTH soldering kit that allows you to quickly and accurately dial in a specific resistance value between 0 and 999,990 Ω, in 10 Ω increments. The concept is simple, a decade box is a tool that contains resistors of many values that can be accessed via mechanical switches. All you need to do is just adjust the knobs to output any of the discrete resistances offered by the box. Once assembled, each kit will have controls that correspond to the digits in a decimal number - a control for the tens position, a control for the hundreds position, and so on.
-
Product
200-Pin LFH Connector, Male, M3 Male Screwlocks
40-961A-200-M3-M
LFH Male Connector
This connector is designed to allow users to directly terminate with soldered connections to the 200 pin LFH connector.
-
Product
Mini Coax, Contact, ITA, Solder Sleeve, RG316 & RG178
610103140
Coax Contact (ITA)
Mini Coax, Contact, ITA, Solder Sleeve, RG316 & RG178.Mechanical SpecificationsDurability 20,000 cyclesContact Material Shield – BrassCenter Conductor – BeCuContact Plating Shield – 50µ" Au over 100µ" NiCenter Conductor – 60µ" Au over 100µ" NiContact Termination Solder SleeveInsulator PTFEMating Force 1.5 lbs max [0.68 kg]Electrical SpecificationsCharacteristic Impedance 50 ΩFrequency Range DC to 2 GHzVSWR ≤ 1.2 @ 2 GhzInsertion Loss ≤ 0.05 dB @ 500 Mhz≥ -0.3 dB @ 2 GhzDWV 1500 VDC Min.Contact Resistance < 5 mΩ @ 0.5 Amp & always < 10 mΩCable Specifications RG316 & RG178Environmental SpecificationsOperating Temperature -50°C to +105°CInsulation Resistance 1000 MΩ min.
-
Product
Pulse Heat Unit (Hot Bar Bonder)
-
*This method is most suitable for reliable soldering and thermo-compression because heating and cooling are done applying the pressure force*Good repeatability of heating temperature and time requires no skilled workers*Partial heating in short time allows to reduce thermal damages*For implement of Pb free
-
Product
Solder Joint Inspection System
-
DMC developed the software to inspect the solder joints of automotive power door lock switches.
-
Product
Soldering Test
-
The soldering tests are conducted to determine if materials can withstand soldering effects, such as resistance to soldering heat, as well as the solderability of components during the manufacturing process.
-
Product
Circbord
3677-6
-
VECTOR Electronics and Technology, Inc.
3-Hole Solder Pad. Holes are not plated-thru. Single-sided with no etch or plating on reverse side. Unrestricted component placement.
-
Product
6-Zone SMT Reflow Oven
CR6000
-
A combination of high-mass heat sources and efficient thermal transfer allows the CR6000 to provide excellent reflow soldering results and throughput with a shorter-than-average heating tunnel. Your 6-zone unit also includes advanced features such as a wide combination pin-over-mesh belt conveyor, partnered pre-loaded KIC Auto Focus profile predictions software, and real-time thermal profiling standard.
-
Product
200-Pin LFH Cable Connector, Male
40-961A-200-M
LFH Male Connector
This connector is designed to allow users to directly terminate with soldered connections to the 200 pin LFH connector.
-
Product
Solder Test Pallet
WaveRIDER® NL 2
-
The wave soldering process is one of the most challenging procedures to set up. The ECD WaveRIDER NL 2 greatly simplifies wave solder set up and ensures perfect repeatability, time after time. Board recipe preheat temperatures, conveyor speed, wave height, contact times and parallelism are all measured and monitored using the WaveRIDER NL 2 process pallet.
-
Product
PCBA & Bare Board Cleanliness Tester
Zero-Ion G3
-
For two decades, thousands of electronics assemblers have relied on the Zero-Ion cleanliness testing to verify the cleanliness of post-reflow printed circuit assemblies and bare boards. Over time, as PCB assemblies have become more complex and more densely populated with surface mount components, and as vigorous quality standards such as ISO, TQM and Six Sigma have become commonplace, the ability to meet—and confirm—cleanliness levels has grown in importance. The Zero-Ion ROSE tester has kept pace with customer requirements, and the Zero-Ion G3 is the most advanced Zero-Ion ever designed, capable of testing assemblies reflowed with any solder paste, including no clean—yet its also one of the most affordable cleanliness testers on the market as well, with performance and ease of use second to none.
-
Product
Computer-On-Module
Open Standard Module (OSM)
Computer on Module
OSM form factor is the first computer-on-module form factor for solderable BGA mini modules that is natively capable of supporting both ARM and x86 designs. OSM modules are significantly smaller than previously available modules, with the largest measuring 45mm x 45mm. For a growing number of IoT applications this standard helps to combine the advantages of modular embedded computing with increasing requirements regarding cost, foot print and interfaces. The BGA design makes it possible to implement more interfaces on a small footprint. The largest Size-L (Large) measures 45mm x 45mm with 662 BGA pins. The modules are completely machine processible during soldering, assembly and testing.
-
Product
Carriers For Various Machining Processes
-
MG Products has multiple types of solder carriers. Two major types are those for selective soldering and those for wave soldering. Our wave soldering carriers are tailor-made and designed by our experienced engineers. These carriers make it possible to solder THT components on complex arrangements, even with bottom-mounted components.
-
Product
Full 3D Inline Metrological & Imaging AOI
-
Metrological Full 3D AOI is achieved by measuring all 3 dimensions (X, Y and Height) to detect every measurable solder and component defect pre-reflow and/or post reflow soldering.
-
Product
Dip Coating Systems
-
SCS Dip Coating systems, which are available in free-standing floor or tabletop models, are specifically designed for production applications that do not require large in-line systems. SCS dip coating systems can be used to apply a range of coatings, as well as photo-resists and solder masks, that are part of printed circuit board applications all with a level of precision that manufacturer's demand. Both SCS models include a host of features that make them an ideal choice for lab and production operations.
-
Product
Prototyping Adapters/Interposers
-
Prototyping adapters breakout from any package type to 2.54mm pitch pins or a larger pitch SMT footprint to solder to your development board. Our extensive design library means that many are available for fast delivery or next day from RS Components.
-
Product
68-Pin Micro-D Male Solder Bucket With Backshell
40-962B-068-SB-M
SCSI Male Connector
This connector is designed to allow users to directly terminate with soldered connections to the 68-Pin SCSI Style Micro D connector. Pickering Interfaces recommends the use of purchased cable assemblies for applications where most or all of the contacts are in use.
-
Product
20-Pin GMCT Male Connector, 10A, Panel Mount, Solder Bucket
40-963-020-10A-M
GMCT Male Connector
The 40-963-020-10A-M connector is designed to allow users to directly terminate a cable with soldered connections. It is supplied with removable solder bucket contacts suitable for wires up to 16 AWG. Included is the screwlocks/fixing screws and male solder bucket contacts.
-
Product
Tool, Soldering Fixture, Micro Coaxial, Receiver and ITA
910121178
Soldering Fixture
Tool, Soldering Fixture, Micro Coaxial, Receiver and ITA.
-
Product
Single Board Computers
PX1-C441
-
WINSYSTEMS’ PX1-C441 single board computer (SBC) is a PC/104 form factor SBC with PCIe/104™ OneBank™ expansion featuring the latest generation Intel Apollo Lake-I Dual-core or Quad-core SOC processors for processing graphics. It includes up to 8 GB of soldered down LPDDR4 system memory and a non-removable eMMC device for solid-state storage of an operating system (OS) and applications. In addition, the board supports M.2 and SATA devices.
-
Product
Flex Socket Test Module
JT 2127/Flex Socket Test Module
Test Module
The JT 2127/Flex STM memory socket tester is a family of hardware adapters specifically designed for the testing of of PCB-mounted DIMM & SODIMM sockets using a JTAG/boundary-scan controller and supporting software. The testing of memory sockets has always been troublesome for test and production engineers using JTAG/boundary-scan systems. Even when it is possible to create memory writes/reads from a boundary-scan compliant access device on the UUT (Unit Under Test), the initialization process may fail leaving you with little diagnostics information. What’s more it can still be uncertain whether fault lays with the DIMM module itself or the socket. Using the new JT 2127-Flex system from JTAG Technologies you get pin-point diagnostics from a known-good test interface so you can be certain that your socket is soldered correctly.
