Thermal Expansion
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Product
Coupler Workstations
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Workstations using pure hydrogen gas from a tabletop generator, tank supply, or oxygen, can achieve high enough temperatures to develop Fused Biconic Tapered devices, Power Combiners, Wavelength Division Multiplexers, Thermal Core Expansion devices, and many other products.
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Product
Digital Image Correlation System for Complete 3D Warpage, Thermal Expansion, and Strain Analysis of Materials and Components in the Heating and Cooling Phase
Q-400 TCT
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The Q-400 TCT system is designed for complete three-dimensional and highly sensitive warpage, thermal expansion measurement and strain analysis of materials and components in the heating and cooling phase. Areas from 50 mm x 70 mm down to 2 mm x 3 mm can be investigated. Measurements can be done from room temperature up to 300°C and down to -40°C. The system is specially suited for thermal expansion measurement of electronic components and is frequently used in the development and testing of complex anisotropic materials, components, and structures in electronic applications.
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Product
Horizontal Dilatometers
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TA Instruments’ unique True Differential configuration makes our dilatometers the preferred choice for the most accurate measurement of Coefficient of Thermal Expansion (CTE). The high precision linear position sensor, the thermostat equipped measuring head housing, and the use of thermally ultra-stable materials all contribute to the outstanding displacement resolution, and ensure the most accurate measurement of low CTE values.
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Product
Serial I/O Expansion
PCM-G-COM8
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The PCM-G-COM8 is an 8-channel PC/104-compatible serial module. It is well suited for embedded applications requiring a large number of serial I/O ports. Each channel supports RS-232, RS-485, and RS-422 electrical levels to interface to a wide variety of serial communications devices such as modems, data collection equipment, and distributed I/O terminals. The PCM-COM8 will operate over the full industrial temperature range of -40° to +85° Celsius.
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Product
Thermal Enclosures
LDP
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Bemco LDP Thermal Enclosures are always custom. They are environmental enclosures constructed using the techniques normally employed with Bemco's LDF Series of Wide Range Expendable Refrigerant, FL-I Series of Integral Walk-in, and FL-M Series of Modular Walk-in Chambers. The LDP enclosure illustrated at left has hinged stainless steel doors, with the protective paper still in place, and hinged sides to allow full interior access.
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Product
Special Function I/O Expansion
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This add-in module is 40 times faster than USB 1.x implementations and supports signaling up to 480 Megabits per second (Mbps). It is based upon the NEC uPD720101 USB 2.0 host controller that is supported by a wide range of operating systems including Windows and Linux.
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Product
Thermal Transport
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The thermal transport probe measures thermal conductivity and thermoelectric power (defined by the Seeback Coefficient). Electrical and thermal contacts are made to opposite ends of the sample allowing for customisation to suit the sample requirements of the user.
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Product
Thermal Shock
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Trialon routinely test products for the automotive, military, medical, aerospace, heavy truck and customer markets in our facilities in Michigan and Indiana.
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Product
PMC/XMC Expansion Card
EXP238
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The EXP238 is a 6U VMEbus form factor expansion card offering three XMC/PMC expansion sites. When ordered as an option for the XVB603 VMEbus single board computer, the 3-slot solution greatly expands system flexibility.
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Product
PCI Expansion Card
4624-4
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VECTOR Electronics and Technology, Inc.
120 contacts (60 each side) on 0.050" centers. Pad-Per-Hole & Peripheral Buses. 32-bit ISA format. Universal tab fits both 3.3V and 5V tab notch patterns. Mounting bracket included. Peripheral buses for voltage and ground distribution. I/O mounting area for D-sub and ribbon cable connectors.
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Product
FlexRay Communications Expansion Kit
OP-SB88
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The FlexRay communication is anticipated as a next-generation high-speed in-vehicle network.The OP-SB88 is an expansion kit that allows monitoring of FlexRay communications on up to two channels in real time. The kit incorporates a monitor function that does not require complicated parameter settings, and a simulation function with which the OP-SB88 works as a FlexRay communications node to transmit and receive data, thus powerfully supporting the initial development. The filter function and high-capacity memory greatly shorten the analysis time of trouble.
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Product
Expansion I/O Module.
SI-MOD66xx
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The SI-MOD66xx is a family of high resolution, multi function data acquisition and control modules that plug into any SI-CxDSP carrier processor card for the PCI bus.
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Product
Analog Input Expansion Board
MSXB 037
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The Microstar Laboratories Analog Input Expansion Board, part number MSXB 037, provides analog input expansion for Analog Backplane systems. The Analog Input Expansion Board is compatible with the MSXB 030-01 and MSXB 031-01 Analog Backplanes.
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Product
Simultaneous Thermal Analyzer
SDT 650
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TA Instruments invites you to experience the world’s finest Simultaneous DSC/TGA, the Discovery SDT 650. Discover the advanced engineering and attention to detail that provides enhancements in every aspect of performance and a new level of user experience. Available with or without an Autosampler, the Discovery SDT is sure to meet your needs and exceed your expectations.
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Product
Thermal Anemometers
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Thermal Anemometers for the measurement of air velocity. Devices are also known as Hot Wire Anemometers, and the instruments can come with telescopic as well as articulated 90° angled probes.
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Product
Expansion Adapter Chassis
TB3-TO-CMC-LP
Chassis
The TB3-TO-CMC-LP is an expansion adapter chassis using the Intel Thunderbolt 3 interface. The adapter allows the use of a front I/O XMC or PMC card outside its normal confines of a single board computer (SBC) or PC hosted carrier card. The TB3-TO-CMC-LP enables the deployment of XMC or PMC modules in systems previously unable to host them -- laptops, small form factor PCs, and other computers lacking add-in slots.
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Product
Marine Thermal Vision
Ocean Scout TK
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As a thermal imager, the Ocean Scout TK creates images based on heat, not visible light. Vessels, watercraft, buoys, and other obstacles give off heat and appear clearly in all lighting conditions from pitch darkness to blinding sun glare.
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Product
Thermal Vacuum Chamber
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Telstar Vacuum Solutions offers innovative custom solutions in design, construction and installation of space simulation thermal vacuum chambers, specially developed to optimize testing efficiency.
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Product
Digital Expansion Board
MSXB 013
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Digital Expansion Boards. The MSXB 013 Digital Input/Output Expansion Board expands 16 digital input lines and 16 digital output lines to 64 digital input lines and 64 digital output lines.
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Product
Thermal Chuck Systems
C-Series
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Advanced Temperature Test Systems GmbH
Looking for a chuck system that gives you the possibility to cool down to - 60C and up to + 300C. The C-Series represents a product line of air cooled thermal chuck systems for a wide temperature range
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Product
Thermal Load Boards
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Thermal Engineering Associates, Inc.
A Thermal Load Board (TLB) is used to simulate an application printed circuit assembly (PCA) either before all the heat-producing components are available for mounting on the application PCA or if the heat-producing components require complex electronic circuitry to create heat within the components. The TLB is typically designed to be as mechanically and thermally equivalent to the application PCA and usually offers a way to vary the power dissipation of the elements that simulate the heat-producing components.
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Product
Thermal Voltage Converter
1395B
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The 1395B TVC. Has better thermal stability than it's predecessor. Measuring ac voltages between 20 Hz and 100 MHz with increased accuracy and reliability. The 1395B can be used as a primary ac voltage standard and/or standard for the calibration of ac calibrators and voltmeters.
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Product
Thermal Shock Chamber
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The Thermal Shock Chamber is specially designedwith independant temperature zones to facilitatethe automatic transfer of product under testthereby simulating a temperature shock to test the reliability of the product as per military and other international standards.
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Product
Thermal Sensitivity Tester
NTE-2A
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The NTE-2A Thermal Probe is a sophisticated, non-invasive device for the clinical evaluation of neuropathy and the assessment of short fiber neurological function. Individual thresholds are compared to normals to statistical normals. These results provide an accurate means of tracking chronic changes in small fiber nerve function. It can be used for pain studies and in any application were a variable, accurately-controlled temperature stimulus is required. The NTE-2A is often used in conjunction with the Vibratron II to assess peripheral neuropathies.
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Product
Air and Thermal Management
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Honeywell Aerospace Technologies
Honeywell's range of electronic and electro-pneumatic systems for air and thermal management are proven to deliver highly reliable and efficient operation with lower total costs of ownership for aircraft operators.
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Product
Catalysis and Thermal Analysis
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A system for catalyst characterisation, reaction testing, kinetic and thermodynamic measurements.
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Product
Thermal Imaging Camera
IRT301
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Wuhan JOHO Technology Co., Ltd
IRT301 Thermal Imaging CameraIRT301, a fixed-site thermal security camera lets you aware of intruders and other threats to your facility clearly in total darkness, smoke, mist and other harsh situation. It is compatible with a wide variety of third-party accessories, permit them easy to integrate. It enable to control and operation over digital and analog networks. With 384x288 pixel detector, it delivers high quality thermal image in any harsh environmental conditions, IRT301 is ideal for both indoor and outdoor surveillance, applications covered from industrial monitoring to city or boundary security monitoring. ApplicationBorder security and surveillanceRoad, channel, warehouse monitoringBuilding and industrial safety monitoringKey FeaturesRugged, waterproof and dustproof designHigh resolution, high frame rateAdvanced image processing technologyStandard interfaceVarious lenses and pan-tilt optionsTechnical specificationDetectorDetector MaterialUFPA microbolometer, AsiResolution384x288, 25mSpectral range8m~14mNETD80mK@30LensFocus
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Product
Thermal Chuck Systems
L-Series
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Advanced Temperature Test Systems GmbH
The perfect system for high power applications with an extraordinary performance at a wide temperature range between - 65C and + 300C.Each system contains a high performant liquid-cooling unit.
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Product
CAN/LIN Communications Expansion Kit
OP-SB7GX
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OP-SB7GX is the expansion kit which makes it possible to monitor, and simulate CAN and LIN communications. It enables monitoring of CAN and LIN data in any combination up to 2 channels at a time. Suitable for evaluation of mixed in-vehicle networks of CAN and LIN.
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Product
Thermal FFF
TF2000
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The new award winning Postnova TF2000 Thermal FFF Series was invented to become the first professional modular Thermal FFF system available. It is completely integrated by the NovaFFF single software platform which runs the entire system from autosampler to detectors. The TF2000 Series incorporates the combined solid know-how and the proven technologies from three decades of leadership in FFF. Due to its unique design, the TF2000 Thermal FFF system offers more flexibility, higher robustness and better performance than traditional chromatographic systems. No separation column with stationary phase is required anymore and consequently the TF2000 technology sets a complete new standard and offers a real alternative to column-based polymer characterization techniques.
