IC
circuitry in a chip.
See Also: Integrated Circuit, Chip, Digital IC Testers, IC Test, IC Clips, IC Probes
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Millimeter-wave and Microwave GaAs Specialty ICs
Keysight Technologies provides MMIC Specialty ICs ideal for microwave radio, aerospace and defense, and instrumentation applications.
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RF Power Pallets
Macom Technology Solutions Holdings Inc.
MACOM is a leading provider of pallet amplifier solutions supporting applications such as avionics, radar, and industrial, scientific, and medical (ISM). Pallets are easy to use building block amplifiers ready to “drop-in” to higher level assemblies. Both standard and custom options are available to meet demanding customer requirements. We can design single or multi-stage pallets that integrate features including DC sequencing utilizing MACOM’s Power Management IC (PMIC), control/monitoring functions and output filtering to meet specific size and input/output requirements.
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PMC to PCI Express Adapter w/ TSI384
6083
The Technobox, Inc 6083 4-lane and 8638 1-lane carrier card allows use of a PMC in a PCI Express edge card slot. The product features an IDT TSI384 bridge IC used in transparent mode with a PCI express primary side and a PCI/PCI-X secondary side.
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Isolation Amplifier Digital Output
This coupler is an optically coupled isolation amplifier that uses an IC with a high-accuracy sigma-delta A/D converter and a GaAIAs light-emitting diode with high-speed response and high luminance efficiency on the input side, and an IC with a digital signal (MDAT, MCLK) output function on the output side. This coupler is designed specifically for high common mode transient immunity (CMTI) and high linearity (nonlinearity) applications, making it ideal for current sensing in motor drives.
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Extra-low Receiving Transmission Platform
9982, 9984
Hangzhou Huatai Optic Tech. Co., Ltd.
Huatai 9982(two outputs) optical receiver adopts advanced GaAs HBT ic technology, and makes the noisy power very low. When the receiving power reaches -6dBm, the system CNR is still above 50dB. 9984 four outputs extra-low receiving optical receiver, its end output port adopts 2 pieces power. Double modules that can supply 4 ways RF output.
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Compact Semiconductor ATE
QST286
Qmax Test Technologies Pvt. Ltd.
The Qmax Model QST286 is a compact small foot print, sophisticated automatic semiconductor tester. Its state-of-the-art hardware design which is freely configurable to user's application requirements and software features makes it ideal for high throughput production testing of wide range of low pin count medium power ICs as listed below but not limited to Optocouplers, Isolators, LEDs, Photo diodes, Photo transistors, Photo sensors, Photo detectors , Analog Mux , Relays and more.
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Universal Programmer Superpro 6100N
Until now,Support 401 IC manufacturer, 103004 pcs devices and keeps growing.Features:Supports 87454 types of devices from 305 IC manufacturers (by 3/15/2013) and keeps growing.Supports EPROM、Paged EPROM、Parallel and Serial EEPROM、FPGA、PROM、FLASH(NOR & NAND)、BPROM、NVRAM、SPLD、CPLD、EPLD、Firmware HUB、Microcontroller、MCU；Supports devices with Vcc as low as 1.2V. Socket Adaptors available for DIP、SDIP、PLCC、JLCC、PGA、LGA、SOIC、SOJ、SOT、QFP、TQFP、PQFP、VQFP、MQFP、LQFP、TSOP、SOP、TSOPII、PSOP、SSOP、TSSOP、SON、EBGA、FBGA、FTBGA、VFBGA、μBGA、CSP、SCSP、QFN、HVQFN etc.High programming speed.Built with 144 universal pin-drivers. Universal adaptors are available for varies packages up to 144 pins. Quick new device support. Popular NAND FLASH Platform supported including Samsung (XSR1.0/1.6), QualComm, HYNIX（HIFFS）, MTK(Solution V1.1), ICERA (v1.0/2.0), ST （7162、7141等）, AMLOGIC(IF2/0), REALTEK, PICOCHIP, DataLight ( Flash FX Pro), Marvell(310/303/920/935…), BroadCom, ZTE, Intel (CE4100)，UBI, LEADCORE(L1809OG), MSATR etc. Customer-specific NAND solution available.PC hosted mode and stand-alone dual modes. Under PC hosted mode the programmer is controlled by a PC via USB2.0 (high speed) to program a chip. Under stand-alone mode the programmer is controlled via a 6-KEY keypad and a 20 character by 4 line LCD display. A CF card is used to store the project files.User can operate multiple units to construct a concurrent multiprogramming system thank for the stand-alone mode. IC manufacturer approved programming algorithms are used for high reliability.Testing functions for logic devices.Advanced and powerful software functions.Production mode starts chip operation at the moment the chip is inserted in the socket properly.Project function simplifies processes such as device selection, file loading, device configuration setting, program option, and batch file setting into one touch step.Password can be set for project files and production volume controlBatch command combines device operations like program, verify, security into a single command at any sequence.Dynamic buffer makes it possible that each chip is programmed with different data file. Applications including serial number, MAC address etc.Log file is useful for quality tracking.Many safety mechanisms are built including self-diagnosis, wrong chip placement detection, poor-pin-contacting detection, ID checking, over-current and over-voltage protection etc.Windows XP/Vista/Win7/ Win8/Win10 compatibility.
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Wafer Test
Based on the reliability test, CSE conducts the test of the IC chip through electrical signals to the semiconductor wafer. We provide various Test Solutions according to the needs of designers/manufacturers. by sorting out good and bad products.
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Micro probes 1 MHz up to 1 GHz
MFA 02 set
The two in the set included micro probes are used to measure low-frequency magnetic fields up to 1 GHz, e.g. at signal conductors (150µm), SMD componets (0603-0201) or IC pins. The MFA micro probes are guided by hand. An amplifier stage is integrated into the probe head. The amplifier stage (9V, 100mA) is powered via the BT 706 Bias tee. It has an impedance of 50 Ohm. The micro probes are connected via the Bias tee to a spectrum analyzer or an oscilloscope. The MFA 02 set delivery of Langer EMV-Technik GmbH includes correction lines. With the help of the correction lines the probe output voltage is converted either into the respective magnetic field or to the current which is running through the conductor.
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OBD Chips
STNxxxx OBD-II to UART Interpreter ICs are developed by our in-house engineering team at OBD Solutions. STNxxxx chips combine ELM327 compatibility with advanced hardware at an unbeatable price. We utilize STN11xx technology in all of our OBDLink scan tools.
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Mezzanine System
3560
ECM P/N 3560 provides four independent I2C channels. For ease of development a PCA9564 interface IC converts parallel data to I2C serial communication. Additionally an LTC1694 I2C accelerator IC decreases the rise time of the passively pulled up I2C bus allowing for greater capacitive loading or higher bus speeds. Each channel is comprised of SCL, SDA and two Grounds.
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LED drivers
ST offers a large portfolio of energy-efficient DC/DC powered LED driver ICs for general lighting, display LED backlighting, automotive exterior and interior lighting, RGB and monochromatic LED drivers for signage and traffic signals.
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Stepper Motor Drivers
ST's portfolio of STSPIN stepper motor drivers spans from relatively simple ICs with current control and phase generation to more complex solutions.
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Voltage Protection ICs
ST’s voltage protection devices prevent external overvoltage (or undervoltage) peaks from damaging circuitry. They are commonly implemented on the power charging patch of portable devices to prevent USB or AC charger power failure. ST’s devices offer the advantage of very precise voltage thresholds, so that the protection is activated accurately, and without fail.
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SparkFun Transceiver Breakout
NRF24L01+
This module uses the newest 2.4GHz transceiver from Nordic Semiconductor, the nRF24L01+. This transceiver IC operates in the 2.4GHz band and has many new features! Take all the coolness of the nRF2401A and add some extra pipelines, buffers, and an auto-retransmit feature - very nice!
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High Current IC Test
C.C.P. Contact Probes Co., LTD.
Our patented probe design allows very high currents of up to 5 Amps
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Radio Receivers
ST is a leading provider of broadcast audio solutions for automotive infotainment systems, offering a complete portfolio of AM/FM, terrestrial and satellite digital broadcast and multi-standard receiver ICs designed to deliver world-class performance and features. By designing with ST, you’ll benefit from the most innovative technologies, a full commitment to automotive “culture”, and a solid system know-how to build scalable solutions, from entry-level car radios to multi-antenna designs.
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Packaging Manufacturing
KLA’s extensive portfolio of packaging solutions accelerates the manufacturing process for outsourced semiconductor assembly and test (OSAT) providers, device manufacturers and foundries for a wide range of packaging applications. Innovations in advanced packaging, such as 2.5D/3D IC integration using through silicon vias (TSVs), wafer-level chip scale packaging (WLCSP), fan-out wafer-level packaging (FOWLP) and heterogeneous integration as well as a wide range of IC substrates create new and evolving process requirements. KLA offers systems for packaging inspection, metrology, die sorting and data analytics focused on meeting quality standards and increasing yield before and after singulation. SPTS provides a broad range of etch and deposition process solutions for advanced packaging applications. Orbotech offers a portfolio of technologies that includes automated optical inspection (AOI), automated optical shaping (AOS), direct imaging (DI), UV laser drilling, inkjet/additive printing and software solutions to ensure manufacture of the highest quality of IC substrates.
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Amplifiers And Linear ICs
For the simplest to the most complex designs, our extensive portfolio of amplifiers and comparators enables you to develop low-risk solutions with minimal risk of a forced redesign. These devices are also backed by our client-driven obsolescence practice of continuing to supply a product for as long as possible and while demand for the product exists.
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Chip Manufacturing
KLA’s advanced process control and process enabling solutions support integrated circuit manufacturing. Using KLA’s comprehensive portfolio of defect inspection, review, metrology, patterning simulation, in situ process monitoring and data analytics systems, IC manufacturers can manage yield and reliability throughout the chip fabrication process - from research and development to final volume production. SPTS provides deposition process solutions for insulating materials and conducting metals that cover a range of chip manufacturing process steps. IC manufacturers use KLA's array of products and solutions to help accelerate their development and production ramp cycles, to achieve higher semiconductor die yield and improved IC quality, and to improve overall profitability in the IC manufacturing process.
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PathWave IC-CAP PSP Model Extraction Package
W7021E
The W7021E PathWave IC-CAP PSP Model Extraction Package provides measurement and extraction procedures for PSP, a CMC industry-standard model advanced surface potential model for MOSFET devices.
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IC-3171, 1.9 GHz Intel Celeron Dual-Core Processor, 4-GigE Port, 2-USB 3.0 Port Industrial Controller
784964-01
The IC‑3171 is a high-performance, fanless industrial controller for developers who require a high level of processing power and connectivity for automation and control applications in extreme environments. The IC‑3171 provides connectivity for communication and synchronization to EtherCAT and Ethernet CompactRIO chassis, EtherCAT motion drives, GigE Vision and USB3 Vision cameras, and other automation equipment. In addition, this controller has onboard isolated, TTL, and differential digital I/O, so it can perform synchronization and control tasks without additional tethered I/O.
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IC-3120, 1.91 GHz Intel Atom Quad-Core Processor, 2-GigE Port Industrial Controller
784959-01
The IC‑3120 is a compact and rugged industrial controller that withstands the harsh environments common in automation, supervisory control, distributed control, and industrial embedded OEM applications. The IC‑3120 offers two Gigabit Ethernet ports with Power over Ethernet (PoE) technology, FPGA-based I/O capabilities, and network connectivity for distributed control applications. The advanced features include the ability to synchronize image inspection results with industrial I/O and configure hardware-timed network triggers to trigger camera acquisition, motion control, or data acquisition. You can use the advanced FPGA personality that is shipped with the system or customize the FPGA functionality using the LabVIEW FPGA Module.
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Hail Impact Tester
HIT
Hailstorms can cause severe damage to modules and collectors. Our test stand enables you to carry out tests according to international standards. The hail impact test stand uses an air-pressurized launcher that shoots ice balls representing hailstones of a predetermined size at the module or collector mounted on the support frame.
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TTL/I2C/SPI Expansion Kit
OP-SB85L
OP-SB85L is the interface expansion kit that has a port to measure TTL / CMOS signal level communications, and the one to measure the voltage of high-speed analog input. The port for TTL / CMOS supports the measurement of TTL / CMOS level communications that power supply system is from 1.8V to 5V. It is suitable for monitoring the communication between the LSI and the interface IC on the printed circuit board by directly probing into the lines. It supports the protocol of not only UART and HDLC but also I2C and SPI on monitoring and simulating.
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Embedded Serial Triggering and Analysis for InfiniiVision DSOX1000 Series Oscilloscopes
DSOX1EMBD
The IC, SPI, and UART/RS-232 serial decode option for InfiniiVision 1000 X-Series oscilloscopes (DSO models) displays responsive, time-aligned, on-screen decode of Inter-Integrated Circuit (IC), 3-wire Serial Peripheral Interface (SPI), and UART/RS232 serial communication buses. Because it is hardware-based, this option provides the fastest throughput solution for triggering on and analyzing IC, SPI and UART/RS-232 serial buses found in a wide variety of embedded designs.
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Micro probes 1 MHz up to 6 GHz
MFA 01 set
The micro probes are used to measure magnetic fields and they have a high resolution. They measure magnetic fields up to 6 GHz, e.g. at signal conductors (150µm), SMD components (0603-0201) or IC pins. The MFA micro probes are guided by hand. An amplifier stage is integrated into the probe head. The amplifier stage (9V, 100mA) is powered via the Bias tee BT 706. It has an impedance of 50 Ohm. The micro probes are connected via the Bias tee BT 706 to a spectrum analyzer or an oscilloscope. Langer EMV-Technik GmbH includes correction lines in the delivery. With the help of the correction lines the probe output voltage is converted either into the respective magnetic field or to the current which is running through the conductor.
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40~860 MHz Trunk Hybrid Amplifier
AS 1616
Hybrid Amplifiers used in Trunk and branch lines specially designed to serve the needs of cable systems with very Long Trunk Cables. They are in Aluminium Housing providing maximum heat dissipation and have RFI Shielding. They incorporate superior quality Hybrid IC Module to obtain excellent features.- Frequency Range: 40 ~ 860 MHz- Mains cum Power Pass- Output Level: 102 dBµV- Level Flatness: ±0.75 dB- 32 dB Gain (40 dB Optional)- Optimum for Trunk Distribution- Superior Quality Hybrid IC Module- Hybrid IC Protected- Voltage Selection LED - for Easy Selection
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SparkFun Transceiver Breakout
MAX3232
The 'must have' IC for TTL/CMOS projects finally has its own breakout board! This is the RS232 converter IC that is capable of running at 3V and communicating with 5V logic.
