Thermal Chucks
control DUT's thermal state. Wafer
See Also: Temperature Forcing Systems, Wafer Probers, Temperature Chucks
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Chamber/Pyroelectric Task
Radiant's Chamber/Pyroelectric Task sets the sample to a series of temperatures by performingGPIB control of an external thermal device. At each temperature it captures the sample’s polarization response and/or small-signalcapacitance. These are combined to calculate the pyroelectric coefficient. The Pyroelectric Task is to be used with a Radiant Test System and a Linkam Stage (-196C to 600C), Thermal Chambers, Hot Chucks, or a Furnace to automatically measure the Pulse Polarization response and Small Signal Capacitance of a Pyroelectric material that is being heated and/or cooled. Radiant's Pyroelectric measurement Task can be added to Vision at additional cost. This measurement suite fully characterizes the pyroelectric charge (polarization) response of the sample under test. The Pyroelectric Task suite controls various thermal controllers such as Quantum Design, Lake Shore, Delta Design, and many others. Detailed Listing of Thermal Controllers Registered in Vision. The Chamber/Pyroelectric Task is quoted upon request.
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On-Wafer Measurements
Accurate DC/CV (and RF) statistical modeling of semiconductor devices requires collecting a significant amount of measured data from different wafers across several temperatures. Keysight Technologies recommends IC-CAP WaferPro as a turn-key DC/CV and RF automated characterization solution to help modeling and device engineers achieve more efficient on-wafer measurements across temperature. This new breakthrough solution is based on IC-CAP modeling software and efficiently controls DC/CV analyzers, network analyzers, probers, switching matrixes, and temperature chucks, as well as the powerful 407x and 408x Series of Keysight parametric testers.
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Thermal Chuck Systems
L-Series
Advanced Temperature Test Systems GmbH
The perfect system for high power applications with an extraordinary performance at a wide temperature range between - 65C and + 300C.Each system contains a high performant liquid-cooling unit.
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Thermal Controlled Chucks & Plates
TOP Cool
Mechanical Devices newest innovation in thermal testing. Each TP system contains a thermal chuck or thermal plate and a self-contained thermal control unit.The TP chuck and platforms is a breakthrough product that introduced the use of refrigerant for active cooling & heating of wafers and other components with no need of chiller, CDA, or consumable and expensive refrigerants such as liquid nitrogen and liquid carbon dioxide. It can be a perfect replacement system in the industry for uncompromising thermal and mechanical performance with a temperature ranging from -60 to +220°C.
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Wafer Chucks
American Probe & Technologies, Inc.
High Performance Chuck for your needs Introducing the American Probe & Technologies’ HC-6000 series of thermal chucks,
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Thermal Chuck Systems
C-Series
Advanced Temperature Test Systems GmbH
Looking for a chuck system that gives you the possibility to cool down to - 60C and up to + 300C. The C-Series represents a product line of air cooled thermal chuck systems for a wide temperature range
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Thermal Chuck Systems
A-Series
Advanced Temperature Test Systems GmbH
The A-Series represents a productline of air cooled thermal chuck systems for a temperature range between -30C up to +400C. The basic product offers an active cooled chuck system without an external chiller for a temperature range between +25C up to +200C at a very competitive price to common Hot Chucks.
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Semi-Automatic Probe Station
P300A
The P300A probe station is the most stable, intuitive, and space efficient 300mm semi-automatic analytical probe station available today. Designed for low current, sub-micron positioning applications, the P300A comes standard with features such as single-point ground, dry/dark environment, and integrated thermal chuck plumbing.
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Wafer Chucks
ARC, in addition to fabricating Wafer Chucks from aluminum, is also known for its ability to work in hard to machine materials such as hardened (50-62 Rockwell) metal alloys, fired ceramics, e.g. SiC and glasses. These materials are often ideal for semiconductor equipment applications due to their ability to hold critical dimensions and tolerances. ARC specializes in surface grinding and lapping these materials to precision flatness and parallelism specifications needed for semiconductor wafer chuck requirements.
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Vacuum Chuck Temperature Controlled Test Stations
These test stations offer the same reliable repeatable measurement capability of our temperature monitored stations with the added dimension of temperature control.
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Standard Probe Station Chucks & Accessories
In this test solutions section of our website we describe the expanding line of Abet PV IV probe stations for the growing variety of solar cell types and sizes being developed around the world. This page describes a line of vacuum chucks and accessories for top/bottom, top/top, and bottom/bottom solar cells from 3 x 3 mm to 300 x 300 mm. Probe stations for multiple device on a single substrate and multifunction probe stations are described further in the sections highlighted to the left of this page.
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Thermal Cabinets
AMETEK Sensors, Test & Calibration
We provide two models of high precision heating and cooling thermal cabinets; the TC540 heating cabinets (40°C to 300°C) and the TC550 heating and cooling thermal cabinets (-70°C to 300°C) used with liquid nitrogen for cooling.
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Thermal Imaging
Omega's thermal imaging products are designed for non-contact temperature measurement with the unique feature to see temperature gradients. Some can capture images and measure multiple spots.
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Thermal Anemometers
Thermal Anemometers for the measurement of air velocity. Devices are also known as Hot Wire Anemometers, and the instruments can come with telescopic as well as articulated 90° angled probes.
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Thermal FETs
Pin-compatible with standard Power MOSFET packages and built-in over temperature protection function for body, lighting and heater applications, as well as powertrain applications and 24V battery system applications.
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Thermal camera
An efficient way to prevent faults in circuits or facilities by locating hot spots, as well as in veterinary medicine or location of living beings.
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Thermal Flow Splitter
FS-3000
FS-3000 combines HORIBA STEC’s mass flow controller (MFC) and MuCube (Master controller). By controlling MFC from MuCube equipped with the HORIBA STEC’s proprietary control algorithm, FS-3000 achieves stable splitting control.
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Thermal Transport
The thermal transport probe measures thermal conductivity and thermoelectric power (defined by the Seeback Coefficient). Electrical and thermal contacts are made to opposite ends of the sample allowing for customisation to suit the sample requirements of the user.
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Thermal Voltage Converter
1395D
The 1395D series of TVC's, have Dual Thermal Element technology. The 1395D offers double the output voltage (typically 14 mV instead of 7 mV). This higher output voltage means better resolution and increased accuracy. It can be used to measure AC Voltages between 20 Hz and 100 MHz and it can serve as a primary AC voltage standard and/or standard for calibration of AC calibrators and voltmeters.
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Drill Chuck Grips
Metal rods, wires, and plates and electronic components can be tensile tested using drill chuck grips. Electronic components are tested by placing the metal legs of the components in the grips, allowing different shaped components to be tested with the same set of grips.
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Fixed-Mount Thermal Camera
FLIR A50/A70 Image Streaming
FLIR A50 and A70 Thermal Image Streaming Cameras are the right choice for users who want camera control capabilities and image streaming over Ethernet, as well as flexibility to perform analytics and raw data collection on thermal characteristics using preferred software applications. With options for Wi-Fi, an integrated visual camera, compressed radiometric image streaming, and ONVIF S compatibility, these small and lightweight fixed-focus automation cameras will optimize process control and quality assurance to improve yield, product quality, through-put time, and lower costs.
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Thermal Platforms
Thermal Platforms are perfect for using conductive transfer to test components hot and cold, they work best for parts with a low or flat physical profile. They transfer heat outstandingly for programmed or very rapid heating and cooling transition times (that’s why they’re called hot plates or cold plates as well), and have a precise temperature control every time from cryogenic temperatures to extremely hot
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Thermal Load Boards
Thermal Engineering Associates, Inc.
A Thermal Load Board (TLB) is used to simulate an application printed circuit assembly (PCA) either before all the heat-producing components are available for mounting on the application PCA or if the heat-producing components require complex electronic circuitry to create heat within the components. The TLB is typically designed to be as mechanically and thermally equivalent to the application PCA and usually offers a way to vary the power dissipation of the elements that simulate the heat-producing components.
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Thermal Imaging Camera
Zhejiang ULIRvisionTechnology Co., LTD
A thermal imaging camera is a device that uses infrared and thermal imaging technology to convert the image of the temperature distribution of the target object into a visible image through detecting the infrared radiation of the target object and applying signal processing and photoelectric conversion. The thermal imaging camera accurately quantifies the actual detected heat and images of the entire object in real-time in the form of a surface, thus accurately identifying the suspected fault area that is heating. The operator initially judges the fever condition and the fault location through the image color and hotspot tracking display function displayed on the screen of the thermal imaging detector, and strictly analyzes it, thereby embodying high efficiency and high accuracy in confirming the problem.
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Thermal Profiling System
lt is impossible to have dependable production without quality management. The expectation is growing and customers requirements must be addressed. In most of the industries, proper monitoring of temperature with time plays an important role in the quality of products. Whether it can be painted/powder coating industries, oven manufactures, automobile industries, and many more.
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Thermal Image Plates
No longer are the firebricks and smoldering paper "tools of the trade" for researchers working with CO2 lasers. Now it''s possible to see IR laser beams in real time and with high resolution using a Thermal Image Plate from Macken Instruments. The characteristics of this instrument enable it to solve a wide range of problems. For example:
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Thermal cameras
SKF Condition Monitoring Center
Using an SKF Thermal Camera is a proactive way to help you detect problems before they occur, increasing uptime and improving safety. They allow you to be able to visualise potential problems, invisible to the naked eye, by presenting a picture of the heat distribution of an asset. The thermal image, presented on a large LCD screen, shows you where the temperature is either too hot or too cold allowing you to pinpoint potential problems fast.
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Thermal Analysis Instruments
Typically measure heat flow, weight loss, dimension change, or mechanical properties as a function of temperature.
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Thermal Dispersion Level Switches
ABB's Thermal Dispersion products can be used for flow, level or temperature detection. One switch can be field configured to detect one of these three process conditions.
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Thermal Conductivity & Diffusivity Meters
Thermal conductivity, thermal diffusivity and specific heat capacity define a material’s ability to store and transfer heat. The precise and accurate measurement of these properties is critical for any process or material, which experiences a large or fast temperature gradient, or for which the tolerance for temperature change is exacting.
