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Probe “Socket” Clamps
LCP-S12
A simple and cost-effective option for mounting Small-aperture Probes in the probe plate. A Socket Clamp tool is needed for insertion and removal of the clamp in the probe plate
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Burn-In Test Sockets
The selection of the test socket is critical to the performance of a device during qualification testing where electrical bias and signals are applied. Key factors such as mechanical compatibility, operating temperature, ability to withstand high moisture levels, signal speed and lead inductance/capacitance all need to be taken into account when selecting the best socket for the test application.
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Burn-in and Test Sockets
Loranger International Corporation
Loranger International Corporation designs and manufactures thousands of socket styles for the burn-in and test of semiconductors and electronic components. Some of the socket styles are listed below.
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QFN/QFP35 Sockets
Test sockets are designed for testing today’s high-performance QFN, QFP, DFN and SOIC devices. For development, characterization, at speed burn-in, and low volume production manual testing.
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Burn-In Board Tester
Focus-275
Focus275 is a tester for burn-in board.It can improve reliability of burn-in board by inspecting boards for burn-in test by Focus275 regularlyBoth short open test and component test can be done by sending electric signals for special socket contactor and edge part.
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Test & Burn-In Socket for Devices up to 13mm Square
CSP/MicroBGA
Test & Burn-In Socket. Socket is easily mounted and removed to & from the BIB due to solderless pressure mount compression spring probes which, are accurately located by two molded plastic alignment pins and mounted with four stainless steel screws. Standard molded socket format can accommodate any device package of 13mm or smaller, by using machined (for small quantities) or custom molded (for large quantities) pressure pads and interposers.
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BGA Sockets
Ironwood has the most comprehensive collection of BGA (Ball Grid Array) sockets that can be used for prototype application, silicon validation, system development, thermal characterization, burn-in application, functional production test, etc. BGA socket can be defined as an electromechanical device, which provides removable interface between IC package and system circuit board with minimal effect on signal integrity. BGA sockets for prototype applications, silicon validations, system development applications uses low cost elastomer contact technology.
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LGA Sockets
We’ve taken our QFN expertise and combined it with the versatility and performance of the H-Pin® to leverage an LGA socket platform that serves the demanding requirements of today’s market. Plastronics LGA sockets using the H-Pin provide a high-performance socket that is affordable for all burn-in operations. These LGA sockets meet the power, temperature and signal performance needs of the higher density, larger package outline, and sometimes mix-pitch LGA designs. The LGA platform serves package sizes from as small as 2.0mm X 2.0mm to the industry’s largest standard socket for 60.0mm X 60.0mm packages.
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Stamped Spring Pin Sockets
Ironwood Electronics SBT sockets are small footprint sockets that are compatible with other product lines such as GHz elastomer sockets, Giga-Spring sockets, etc. The socket needs about 2.5mm extra space around the chip than the actual chip size utilizing only very small PCB real estate. A heat sink screw on the top provides the compression force as well as thermal relief and can be customized to dissipate more power. SBT socket uses SBT contact technology for high endurance and wide temperature applications. SBT Contact is a stamped contact with outside spring as well as inside leaf spring that provides a robust solution for Burn-in & Test applications. Solutions are available for 0.3mm to 1.27mm LGA, BGA, QFN, QFP, SOIC and other packages. Contact technology has 3 part system which includes top plunger, bottom plunger and a spring. The Beryllium Copper plungers are stamped and assembled to a stainless steel spring in an automated system to enable fast turnaround time, low cost and zero defects.
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Semiconductor
With ultra-multi pin count and fine pitch, our general-purpose IC socket lineup corresponds to every need. For semiconductor burn-in sockets for thermal acceleration tests, and test sockets for semiconductor electrical testing, we continue to hold a high market share all over the world.
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BIB Loading
FALCON Series
The Falcon Series is an automated BIB loading and unloading machine. It is designed to provide precise high-speed loading of DUTs from Trays/Tube to Burn-in boards and precise high-speed unloading of DUTs from Burn-in boards to Trays/Tube for different device packages. The Falcon Series also has a simple conversion kit which allows end-users to re-configure the equipment for different types of sockets and package combinations.
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Burn-In Test
C.C.P. Contact Probes Co., LTD.
Customized Burn-In Test Sockets for temperatures of up to 180°C.
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Open Top BGA Sockets
Ironwood has the most comprehensive collection of open top BGA and QFN sockets that can be used for qualification application, silicon FIB testing, system development, thermal characterization, burn-in application, etc. IC socket can be defined as an electromechanical device, which provides removable interface between IC package and system circuit board with minimal effect on signal integrity. Typical packages include BGA, LGA, QFN, QFP, WLCSP, etc. Open top allows access to the top side of IC. Below is an example BGA socket that uses low cost elastomer contact technology.
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RF Burn-In Services
Innovative Circuits Engineering, inc
There are many burn-in services that we offer such as HTOL, RFBL, ELFR, LTOL, etc and our focus on quality and customer service when providing burn-in custom solutions is second to none. We work closely with our customers to make sure we provide them with the best possible burn-in regardless of their lot size or pin count. We can also provide you with other electrical stress tests such as THB and HAST, and we can provide you with comprehensive status reports for your tests as they progress whether they be burn-in, THB, HAST or any other test.
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Burn-In Test Fixtures
Burn-in generally involves the extended operation of a product in a temperature-controlled environment. With possible humidity and supply voltage margining - the burn-in process can then be extended to include power stress (levels and on/off cycles) tests, high humidity environmental simulation as well as the classic "four corner test" of high voltage + high temperature, high voltage + low temperature, low voltage + high temperature and low voltage + low temperature.
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Burn-in and Stress Screening Chambers
KDR
Supervise the operation of your product, electronic device, circuit board, or medical device while they are stress screened, burned-in, or temperature cycled inside a Bemco Kardburn or Koldburn glass front chamber. With a huge amount of testing or storage space within instant reach, KD Chambers provide a compact and attractive alternative to a walk-in chamber.
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Memory Burn-In Tester
H5620/H5620ES
As Server and Mobile applications have mainly led the Memory and market has also entered a super cycle that has completely withdrawn from the previous silicon cycle.Memory capacitance will continue to rise as the application of data processing and mobile communication occurs—however, revenue will not grow as ASP goes down. Suppliers need to reduce test costs and increase profits.H5620 contributes to reduction of test cost by integrating the test process of DRAM Burn-in and Core Test. This hybrid memory test solution solves the challenge of reducing test costs while increasing test efficiency in the expanding DRAM market.
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Test Sockets
Non Standard
Chances are good Ardent can help you with that. We can adapt our technology to just about any package, device or module. Small volumes of custom sockets for higher bandwidth applications are a niche all in their own, and our engineering team has many years of experience designing custom sockets for all kinds of applications.
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High Power Burn-In Test
Easily test the reliability of your high power laser devices with the Y2000H burn-in and life-test system. It will quickly identify defective laser devices so you can prevent them reaching your customers. Y2000H's full automation and expandable capacity helps you work through your tests more productively. And its user-friendly software makes testing your devices easier than ever.
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Hot Socket Simulator
Hot Socket Simulator
The new TESCO Hot Socket Simulator gives you the ability to investigate meter failure issues related to hot socket phenomenon. The Simulator is equipped with one 2S meter socket with four jaws, one of which is the heated jaw. The arcing/heating apparatus can be moved to any of the four jaws (jaw 1 is the standard). Additional arcing/heating elements can be provided as an option for multiple hot jaws on the existing socket.
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Test Sockets
Yamaichi Electronics Co., Ltd.
A test socket is the ideal point to test your home’s internal phone wiring for faults. You can also use it to identify any potential faults with the phone line outside. Your test socket is located in your master socket. It is the point between the internal phone wiring in your house and the phone line outside. That means by plugging into your test socket you can bypass all the internal wiring and test your device directly on the phone line.
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GHz Elastomer Sockets
Ironwood’s GHz BGA & QFN/MLF sockets are ideal for prototyping and testing almost any BGA or QFN device application. These ZIF sockets provide excellent signal integrity yet remain cost effective. Innovative elastomer interconnect technology that delivers low signal loss up to >40GHz and supports BGA or QFN/MLF pitches down to 0.3mm was utilized in these sockets. GHz BGA sockets are mechanically mounted over a target system’s BGA lands using mounting and alignment holes at proper locations (page 2 of the individual socket drawing shows recommended PCB layout information). These low-profile sockets are only 2.5 mm per side larger than actual IC packages (industry’s smallest footprint). They support IC devices with body sizes ranging from 55mm down to 1mm. Larger body sizes may require a backing plate. If the backside of the target PCB contains capacitors and resistors, a custom insulation plate with cavities cut for those components can be designed. This insulation plate sandwiches between the backing plate and target PCB.
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Test Sockets & Interposers
Silmat
Innovative technology platforms and multiple product families for BGA, LGA, QFN and CSP packages down to 0.3mm pitch. High frequency bandwidth > 40 GHz..
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Socket Testers
Socket testers are portable devices used for testing the wiring of power outlets. These testers are used widely in home and commercial buildings. UNI-T’s socket testers can speed up the testing process considerably and obtain reliable and accurate information socket status.
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Socket Testers & Adaptors
Our range of socket testers & adaptors allow users to quickly and simple check the wiring of a socket, clearly identifying polarity faults with and audible buzzer continuously sounding if correct.
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Custom Sockets
Plastronics socket designs range from off-the-shelf sockets ready for immediate delivery, semi-custom sockets that utilize universal components and totally custom one-of-a-kind sockets and fixtures.
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Socket Outlet Tester
Using the new Testavit Schuki 1 LCD and 3 LCD, specialists easily check to see if sockets, cable drums or connecting cables are correctly connected in 230 V installations. Due to three LEDs, the connection status can be quickly and clearly determined. In addition, through the finger contact, it can be tested to see whether an impermissible, high contact voltage is applied at the protective earth connection. In addition, using the Testavit Schuki 1 LCD, a 30 mA FI circuit breaker (RCD) can be triggered via a pushbutton.
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System Level Test and Burn-in Solutions
System Level Test (SLT) is a paradigm shift from traditional structural and functional testing. The device is tested in a complete, integrated system to evaluate its compliance against specified requirements. The system approach allows for higher and more cost-effective test coverage especially for multi-function and non-deterministic devices. It also brings new integration and test challenges like: ..Designing test fixtures on Burn-in Boards with system components ...
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Laser Diode Reliability Burn-In / Life-Test System
58602
Chroma 58602 is a high density, precision multi source measurement Unit (SMU) module with temperature control and exchangeable interface developed for burn-in, reliability and life test of optoelectronic components including laser diodes, VCSELs, VCSEL Arrays, silicon Photonics, photo-diodes and other similar components.
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Test Sockets
MEMS Device
Patented MEMS Sockets from Ardent Concepts use a unique scrubbing action contact set which is ideal for today’s sensitive MEMS devices, including accelerometers, gyroscopes, MEMS microphones and other specialized devices used in mobile electronics applications
