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Chip
Passive or active components test and their interconnected circuitry in silicon or germanium.
See Also: Integrated Circuit, IC
- PalmSens BV
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Integrated Potentiostat and Multiplexer
EmStatMUX8
Based upon the EmStat range, there are two types of multiplexers to suit most types of sensor array work. The MUX8 is the most flexible offering the ability to connect arrays made of up to eight working electrodes in two or three electrode cell types and chips sharing a reference electrode and/or counter electrode. The MUX16 is suitable for sensor arrays or chips with sixteen working electrodes all sharing a RE and/or a CE. Both instruments are suitable for laminated layer corrosion analysis.The potentiostat is controlled and powered by USB and is used with PSTrace allowing for simultaneous sampling of each channel at a rate of 25 ms/channel. Standard packaging includes a shielded cable with connections for a working, a counter and a reference electrode by means of 2 mm banana connectors and mini-crocodile clips, a stripped end, Dsub-37 terminated flat cable and a USB cable. To make connections to chips simpler the Connection Terminal is an optional extra providing clearly marked screw terminals to the electrodes and can be directly joined to the ESMUX via their D-Sub connectors.
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Wafer Level Test
Double sided wafer inspection system is an automatic inspection system for afterdicing wafer chip. It can do double side inspection simultaneously. The appearance defects of wafer chip are clearly conspicuous by using advanced illumination technology. Illumination and camera acquisition mode can be adjusted for various wafer process, like vertical chip or flip chip.
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Material Identification Spectroscopy
ChipCHECK
Gastops specializes in advanced fluid sensing and analysis systems specifically designed and developed for critical equipment condition monitoring applications.ChipCHECK offers the fastest way of making on-site equipment maintenance decisions. It is a field deployable analyzer designed for rapid on-site identification of equipment lube oil. This automated maintenance decision-support tool employs innovative laser spectroscopic technology, which enables on-site analysis of microscopic chip debris. ChipCHECK provides the maintainers with quick, reliable, and conclusive information, including the total number of particles, and the size, shape, and specific alloy classification for each individual particle on the sample.
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SMARC® Short Size Module with Intel Atom® E3900 Series, Pentium™ N4200 or Celeron™ N3350 Processor (codename: Apollo Lake)
LEC-AL
The LEC-AL Computer-On-Module (COM) combines the SMARC® 2.0 standard with the latest Intel Atom® E-Series and Pentium® and Celeron® N-series System-on-Chips (SoCs), providing ideal solutions for low power consumption and high performance requirements. The module provides the high integration, high performance, low power, and ruggedness favored by Internet- of-Things (IoT) applications such as retail transactional clients, digital signage, and in-vehicle infotainment systems. The LEC-AL module utilizes the latest Intel E-series and N-series SoCs, which are based on the Intel 64 Architecture, the new HD Graphics 500/505 engine, and a faster, 4-vector image processing unit. The SoCs are manufactured on Intel's industry-leading, tri-gate 14nm process, improving system performance by supporting more than 4 GB of both virtual and physical memory.
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ScanWorks IJTAG Test
ScanWorks IJTAG Test
The ScanWorks Internal JTAG (IJTAG) tools allow system-on-a-chip (SoC) designers, DFT engineers and validation engineers a new and simpler way to access, control and run any embedded instrument designed into chips. When the IEEE ratifies the IEEE 1687 IJTAG standard in 2013, it will enable easy access to run any functional type of IJTAG instrument. ASSET is the first tool supplier with development tools available today for the early adopters of this important new technology.
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Metal Glazed High Voltage Chip Resistors, Anti-Sulfuration
SMG Series
*Flameproof UL94VO molded package, resistance to sulfuration, heat and humidity.*Special design for automatic surface mounting.*Metal-glaze elements provide high stable performance against environmental conditions and overload.Excellent mechanical strength & electrical stability.*Reducing assembly costs.
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Resistors
Panasonic Industrial Devices Sales Company of America
Panasonic offers a broad line of Resistors that include Chip Resistors, Power, High Power, Fuse, EMI Filters, and Arrays and Networks for all applications.Panasonic Resistors have a wide range of features and specifications including conventional Thick Film Chip Resistors or specialized types like Anti-Sulfur, 0201 to 0805 case sized Chip Resistor Arrays, three different types of Power Resistors, Surface Mount and Leaded EMI Filters and one of the smallest Chip Fuses in the industry.
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SparkFun ESP8266 Thing
Dev Board (with Headers)
This is the SparkFun ESP8266 Thing Dev Board --- a development board that has been solely designed around the ESP8266, with an integrated FTDI USB-to-Serial chip. The ESP8266 is a cost-effective and very capable WiFi-enabled microcontroller. Like any microcontroller, it can be programmed to blink LEDs, trigger relays, monitor sensors or automate coffee makers. With an integrated WiFi controller, the ESP8266 is a one-stop shop for almost any internet-connected project. To top it all off, the ESP8266 is incredibly easy to use; firmware can be developed in Arduino and uploaded over a simple serial interface. The ESP8266 Thing Development Board breaks out all of the module’s pins with pre-soldered headers, and the USB-to-serial converter means you don’t need any peripheral components to program the chip. Just plug in a USB cable, download the Arduino board definitions, and start IoT-ing.
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BGA SMT Adapters
Giga-snaP™
Giga-snaP™ 0.75, 0.8, 1.0, and 1.27mm pitch BGA Surface Mount Feet Adapter line of products provide an inexpensive and reliable method for attaching BGA chips to target board. The product line consists of patented female sockets with machined pins epoxy over-molded into an assembly that matches a particular BGA pattern. The epoxy over-molded female BGA socket is soldered to a PCB using standard soldering methods. A corresponding male pin BGA adapter, to which the user attaches their BGA chip, is plugged into the female socket on the board thus interconnecting the chip and the system is ready to go. The SMT adapters have the same solder ball types as the chips they are emulating. These adapters have less than half of the insertion force of competitive adapters, shorter electrical path for highest speed, and can be solder reflowed numerous times. A complete description and drawings of Giga-snaP™ 0.75, 0.8, 1.0, and 1.27mm pitch BGA Surface Mount Feet Adapters can be found at the tables shown below.
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Precision Curve Tracer
CurveMasterTM
The CurveMasterTM delivers new price/performance efficiency to curve tracing and Failure Analysis. Curve trace has been a standard feature in our full-power chip tester for years, so the CurveMasterTM is built with today’s components and technology. With all new high-accuracy DC Parametrics, you’ll enjoy the most powerful curve tracer you have ever used.
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Receivers
Macom Technology Solutions Holdings Inc.
MACOM's receivers are widely used in point-to-point radio, aerospace and defense, and other broadband communications applications. Operating between the 4.5 - 45 GHz frequency range, our receivers feature an integrated LNA, mixer and LO buffer amplifier onto a single chip. Available in lead-free QFN or SMD packages, our receivers boast excellent noise figure and conversion gain performance.
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Scanning Acoustic Microscope
Pulse2
This industry-leading scanning acoustic microscope provides a universal inspection tool for packaged semiconductor development, production and failure analysis. With the ability to detect air defects as thin 0.05 micron and spatially resolve defects down to 10 microns, the ECHO is perfect for bump detection, stacked die (3D packaging) inspection, complex flip chip inspection and more traditional plastic packages.
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Laser Diode
Is a Polarization Maintaining CWDM Coaxial DFB-LD for CWDM analog communication, CATV return-path, laboratory instrument, and R&D applications. This cost-effective, high reliability DFB laser chip has a selectable wavelength with range between 1270 nm to 1610 nm. The versatile DFB-CWDM also features a built-in InGaAsP monitor photodiode, built-in optical isolator and 4-pin coaxial- pigtailed package, single mode coupling, and an FC/APC connector. Contact Optilab for more information.
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Module Spectrum
nRF5340 Series
Raytac nRF5340 module spectrum covers MDBT53-1M, MDBT53-P1M and MDBT53-U1M series with Chip Antenna, PCB Antenna and u.FL connector for External Antenna option for selection.
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RF Signal Generators
The G6 VSG from Transcom Instruments is a Vector Signal Generator that operates from 10 MHz to 6 GHz. It can simulate GSM, EDGE, CDMA, TD-SCDMA, WCDMA, CDMA2000, TD-LTE, FDD-LTE, NB-IoT, and LoRa base station signals for production and calibration of UE, chips. The signal generator has a dynamic range (power range) from -100 to 10 dBm and an in-built automatic gain control function. It is available in a module that measures 180 x 50 x 290 mm and is ideal for educational practices, wireless monitoring, mobile communication, aerospace and national defense industry in terms of research, manufacturing, testing and measurement, and electronic countermeasure.
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Synchro to Digital-Resolver to Digital Converters
MRDC
Computer Conversions Corporation
Computer Conversions’ MRDC64-3 is a miniature single chip solution for providing a complete 1 x 64 speed resolver interface into any demanding industrial or military application.
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Services
For over three decades, Teledyne Microwave Solutions has built a strong heritage delivering advanced value added services to the military, space and industry sectors of aerospace. With test capabilities up to 40 GHz, TMS offers chip and wire assembly of products ranging from single die through complex hybrids which can then be submitted to a combination of customer-specified RF and DC testing and environmental screening. TMS offers a complete portfolio of screening and testing services for device sorting, labeling, lead forming and tinning, and tape-and-reel packaging, as well as LAT services on packaged devices or bare-die, including diodes, transistors, and MMICs.
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Data Loggers
Data loggers are electronic devices which automatically monitor and record environmental parameters over time, allowing conditions to be measured, documented, analysed and validated. The data logger contains a sensor to receive the information and a computer chip to store it.
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RF/Microwave Assembly Capability
Teledyne Labtech offers a comprehensive build-to-print microwave module and microwave components manufacturing service. This includes MMIC placement, Au wire bonding, SMT assembly and test.Our microwave MIC production facility is housed in a class 10,000 clean room that accommodates manual chip placement and semi-automatic wire bond assembly. Dedicated microwave components manufacturing is undertaken within production cells established to meet specific customer or product requirements.
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Intelligent Power Switches
ST offers a series of intelligent power switches (IPS) for high-side and low-side configurations. These devices integrate the control section (logic interface, drivers, diagnostic and protection features) and the power stage on the same chip, with benefits in terms of compactness, increased system reliability and cost effectiveness.
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IF/RF Receivers
IF and RF Receivers are designed for communications infrastructure applications. Wide input bandwidth and high sample rates allow digitizing close to the antenna. Various receiver architectures, such as zero-IF, IF sampling to direct RF receivers, are supported and available on chip post digital signal processing can be used to offset demands in the FPGA or digital ASIC and ease analog filtering.
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Linux-based Development Platform For The GridARM™ ΜController
PEAK gridARM Evaluation Board
The ARM7 microcontroller gridARM™ was developed by Grid Connect® as a system on a chip solution (SoC) for the implementation of embedded applications with a focus on industrial communication. The Evaluation Board PEAK-gridARM is a Linux-based development platform for the gridARM™ microcontroller. It has connections for Gigabit Ethernet, high-speed CAN, USB 2.0, RS-232, SPI and I²C. The digital and analog inputs of the evaluation board can be manipulated with buttons and potentiometers. The states of the microcontroller, the supply and the message traffic are displayed via LEDs. A board support package for Linux enables access to the hardware resources of the PEAK-gridARM evaluation board.
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QSeven
ROM-7420
ROM-7420 Qseven Module integrates an ARM Cortex-A9 NXP i.MX6 series ultra low power SoC and I/O solution chips with Linux. NXP i.MX6 supports 2D, 3D graphicsacceleration, full HD 1080P video decoding and an HD 1080p video encoding hardware engine.
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Chip Resistor Networks/Arrays
Panasonic Industrial Devices Sales Company of America
Panasonic’s Chip Resistor Arrays are offered in cases from 0201 to 0805. The smaller 0201 case sizes are available with flat terminations and all other case sizes are offered with either convex or concave terminations. The EXB Series Resistor Arrays are available in 2, 4, or 8 Resistors per package. These Resistor Arrays allow for an improvement of the placement efficiency. Compliance Standards include: IEC 60115-9, JIS C 5201-9, EIAJ RC-2129, AEC-Q200 and RoHS.Panasonic’s Resistor Networks are available in 8 or 15 bussed Resistors and are recommended for all pull up/down circuits.
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ARM LPC2364 Board
MS 1541
- 128KB On chip Flash- 16*2 line LCD Module interface- Two CAN channel at 1MPBS- Ethernet interface which supports 10/100 MBPS- Full Modem RS232 interface- RS485 interface- RTC (Real Time Clock)- 2048 bits serial EEPROM with data protect and sequential read.- 24 ULN outputs of 12V level.- Eight 110V DC inputs interface.- Six digital inputs interface- Four on board keys interface- Power delay circuit for external use- ON board inspection circuit
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Attenuators
The 01311 attenuator chip series is designed to achieve precision and tight flatness with an attenuation accuracy of ± 0.2 dB on our 1-10 dB pads and ± 0.3 dB on our 11-20 dB pads. SemiGen tests 100% of all attenuator chips prior to shipment to verify that they meet specifications.
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PC/104 Single Board Computer with Vortex86DX3 System-on-Chip
CM1-86DX3
The CoreModule CM1-86DX3 is a PC/104 board with DMP Vortex86-DX3 single chip solution and has a very good performance to power ratio. The board comprises all peripherals needed for an embedded PC on a small 3.775" by 4.050" printed circuit board. The CM1-86DX3 integrates a powerful yet efficient DMP Vortex86DX3 with graphic controller and audio controller together with an additional GBit Ethernet controller to form a complete PC, with all the standard peripherals already onboard. Two Ethernet ports (1x GBit and 1x 100MBit), four RS232/RS422/RS485 serial ports, two USB 2.0 host controller to handle the communication with external devices. There are PS/2 connectors for keyboard and mouse. A first generation SATA interface allows the connection of hard disk or CD drive. CFast is also available. System expansion can easily be realized over the PC/104 bus connectors.
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SigmaDSP Audio Processors
SigmaDSP® processors are fully programmable, single chip audio DSPs that are easily configurable through the SigmaStudio™ graphical development tool, and are ideal for automotive and portable audio products. SigmaDSP chips are available with integrated sample rate converters, A/D converters, D/A converters, and output amplifiers.
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EUV Lithography
NXE systems
NXE lithography systems are used in high-volume manufacturing of advanced Logic and Memory chips. The first systems to use ASML’s novel 13.5 nm EUV light source, they print microchip features with a resolution of 13 nm, which is unreachable with deep ultraviolet (DUV) lithography. Chipmakers use our NXE systems to print the highly complex foundation layers of their 7 nm, 5 nm and 3 nm nodes. Read about how EUV lithography went from imagination to reality.
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Netlist Analyzer
GateVision
GateVision PRO is the third generation of graphical netlist analyzers from Concept Engineering. Completely rewritten to run on modern 32/64bit platforms, GateVision PRO provides the designer of even the largest chips with intuitive design navigation, schematic viewing, logic cone extraction and interactive logic cone viewing for debug support and design documentation.
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3D Measurement
PSD-Array
The PSD array consists of 16 parallel one-dimensional PSD elements on the same chip. By utilizing the triangulation technique the reflection of a laser line or multiple laser spots onto the PSD array will provide information about the contour of the illuminated object. The possibility for simultaneous readout of the 16 elements together with the fast response of each element makes the PSD array suitable for applications like high speed 3D contour measurements and measurements of parallel, moving objects such as cantilevers.
