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Defect
other than specified, imperfection .
- Pickering Interfaces Inc.
product
PXI Fault Insertion Insertion Switch Modules
Our PXI Fault Insertion Insertion Switch Modules feature a breakout arrangement that allows faults to be attached to the sensor lines, this includes the breaking of a connection or the adding of defect – all of which can simulate connectivity problems in the system.
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Advanced Vision
Automated visual inspection solutions that leverage the advanced imaging performance of Radiant's photometry-based cameras and inspection software to detect subtle, low-contrast defects in complex assemblies and on surfaces.
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Destructive Physical Analysis (DPA)
Is the process of disassembling, testing, and inspecting a component for the purpose of determining conformance with applicable design and process requirements. This process of sample testing is used to ensure that a high reliability component or device is fabricated to the required standards. Destructive Physical Analysis is also used effectively to discover process defects for troublesome production lot problems.
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AOI & SPI, Test Systems
SigmaX SPI
Most defects in the circuit-board assembly are due to the solder paste or the process of printing solder paste. Since the transition to lead-free soldering, a whole new spectrum of problems has emerged in older paste printing and its due processes. Incomplete coalescence of ball grid array (BGA) spheres and solder paste deposits are failure modes that have increased in frequency since the transition to lead-free soldering. The SigmaXs inspection technology is unaffected by varying materials, surface conditions, or colors. The system profiles the board to generate accurate 3D shapes far superior to other brands and technologies.
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Testing for Si Solar Cells Using High Performance CCD
EL Imaging Tester
EL Testing for Si Solar Cells using High Performance CCD. The determination of luminescence (photo emissions) in solar cells is an important characterization tool. Typical solar cells often have defects which limit the efficiency or lifetime of a cell. Many of these defects are visualized with Luminescence Imaging. By using this technique, the manufacturing process can be optimized to produce better cells. Luminescence Imaging takes advantage of the radiative inter-band recombination of excited charge carriers in solar cells. The emitted photons can be captured with a sensitive CCD camera to obtain an image of the distribution of the radiative recombination in the cell. This distribution is determined by the local excitation level, allowing the detection of electrical losses, thus mapping the diffusion length of minority carriers as the emitted light is low intensity and in the near infra-red range, the CCD camera has a high sensitivity wavelength from 900 to 1100 nm with little thermal noise. This CCD camera provides excellent resolution of 1024 x 1024 pixels with a large 1μm pixel size, multi-megahertz readout speed, and robust USB 2.0 connectivity. The EL CCD Camera is the ultimate high-performance CCD camera for electroluminescence and photoluminescence imaging for Photovoltaic (PV) Cells and Modules. This camera combines low noise electronics and optimal sensitivity in NIR.
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Highly Accelerated Life Testing (HALT)
Quickly validate reliability and identify manufacturing defects that could cause product failures in the field with MET’s Highly Accelerated Life Test (HALT)HALT technique uses a combination of accelerated stresses to expose product flaws early in the design and manufacturing stages, which improves product reliability and customer confidence inherent to the design and fabrication process of a new product as well as during the production phase to find manufacturing defects that could cause product failures in the field.
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PXI Fault Insertion Matrix Modules
All of our fault insertion matrices feature a breakout arrangement that allows faults to be attached to the sensor lines via the Y axis. This includes the breaking of a connection or the adding of a series defect – all of which can simulate connectivity problems in the system. The three pin breakout versions allow the connection to be swapped for a “bad” sensor simulation.
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Optical Test And Measurement
Any type of fiber optic interconnection requires its interfaces to be free of dust and scratches in order to reach the lowest transmission loss. Small, handheld and battery powered inspection tools are available from AMS Technologies for inspection of fiber optic connectors in the field as well as high resolution type microscopes suitable for use in a production environment for qualifying the endface preparation. Additional S/W tools can support the user in making a quick decision if a certain defect is acceptable or if the surface fault disqualifies it for further use. Small and lightweight test equipment for measurement of the transmitted power in an optical fiber is needed wherever technicians handle optical fibers. Our product portfolio comprises light sources for various wavelengths, power meters for the visible and infrared and integrated solutions for sources and meters as well as optical time domain reflectometers (OTDR) coupled with visible wavelength light sources for easy fault detection within a fiber optic link.
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Drone Inspection Software
Qii.AI
Qii.AI automates the detection and analysis of defects. It is the only enterprise AI platform that combines drone inspection software with an AI labeling tool, AI-assisted computer vision, and machine learning.
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Reject Station for X-Ray Image Analyser
IV-110I
IV-11OI is a reject station for X-Ray Image Analyser known for having an X-Ray Image Wire Defect Detection and a compact and space-saving dimension.
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Electronic Inspection Systems
Intego's knowhow even makes it possible to identify challenging defects that may be located under the surface. One system is the inspection of chips by means of lock-in thermography, which visually represents the IR radiation intensity signal of electronics. Special lasers and flash lamps generate a very short heat impulse (10 ms) on the chip, which generates a measurable heat flow. In most cases, a resolution of < 1 μm can be achieved.
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Multi-Layer Analysis for Next Generation PONs
Multi-ONU Emulator
The NG-PON Xpert multi-layer analyzer is a unique, real-time protocol analyzer for XG-PON1, NG-PON2 and XGS-PON networks and products. The Multi-ONU Emulator introduces a new revolutionary approach for comprehensive testing of an OLT. It enhances the testing with repeatable test scenarios and functionalities that cannot be tested in any other way, including the OLT's ability to handle various ONU models and configurations, error and defect conditions, alarms and traffic loads.
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Axis Play Tester
LMS 20.0 | VP 425017
Maschinenbau Haldenwang GmbH & Co. KG.
The LMS 20.0 axis play tester is used to reliably determine defects and wear on steering parts, wheel bearings, suspension and suspension by means of counter-rotating transverse and longitudinal movement of the test plates. The built-in hydraulic drive ensures a powerful and even movement of the test plates. An automatic mode and other different operating modes make the LMS 20.0 easy to use.
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Automated High-Resolution AOI Tool Modular Inspections
LIGHTiX
Next generation macro inspection system (AOI).• All-side wafer inspection: Front, back and edge inspection.• 100% defect images without throughput impact.• Integrated high-end microscope review.• True Color Inspection (TCI) technology.• Advanced CD, 2D/3D, OVL and EBR metrology.• Automatic defect classification• Best in class cost of ownership for high resolution AOI• High-speed patterned wafer inspection• High defect sensitivity• ISO Class 1 certified• Tool – to – tool matching
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Non-contact Ultrasonic Testing System
Yamaha Fine Technologies Co., Ltd.
Contact-free inspection through ultrasonic transmission detecting air bubbles, separation, and foreign materials inside workpieces. With a Yamaha ultrasonic amplifier installed, contact-less inspection in the air is realized. Without damaging or wetting the workpiece, it is possible to inspect the workpiece for packing defects, air bubbles, and even flaw depth.
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Compact Manual Laser Repair System
LRS-2400
LRS-2400 reads the defect data and navigates to the exact location of the defect. With a high power microscope the user can perform tasks as described below.
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Static Code Analysis for Embedded Software
GrammaTech CodeSonar®
CodeSonar is GrammaTech´s flagship static analysis software. Able to analyze both source code and binary code, it is specifically designed for zero-tolerance defect environments. With its advanced static analysis engine, CodeSonar is one of the most effective tools for eliminating the most costly and hard-to-find software defects early in the application development lifecycle. Compared with other tools, CodeSonar identifies twice as many defects that result in system crashes, leaks, data races, memory corruptions and security vulnerabilities.
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Translating process images into significant tool-defect reduction
Trans-Imager
Real-time, tool-specific defectivity data. Now there is a way to monitor defectivity on individual processing tools – automatically – in real-time. Microtronic’s new Trans-Imager software module is able to take high-resolution images directly from your processing equipment and immediately detect and displaymacro wafer defects – transferring all of that information into our powerful and long-proven ProcessGuard software which provides a wealth of defect management and analysis. This new capability is called ProcessGuard Xtensis (PGX) because it extends the power of ProcessGuard software to fab tools that previously had no way to detect defects. This provides an important new stream of defect data.
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Ultrasonic Concrete Testing
This category comprises the range of instruments that use sound or stress waves in order to determine the properties of concrete and other materials non-destructively. The first and most widely used System is our V-Meter, which utilizes the ultrasonic pulse velocity method for evaluating construction materials in the field. Transducers are available for a variety of frequencies from 24 KHz to 500 KHz. This unit has also been modified to suit the special needs of ceramics users and can be found as the Ultrapulse. The PIES, our revolutionary Portable Impact-Echo System, is an advanced instrument for non-destructive detection of flaws and defects in a variety of civil infrastructures ranging from bridges, parking structures and buildings to dams, piles, tunnels, tanks and marine structures.
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Precision Continuous Flow Metering + Dispense System
Graco Dispense Analyzer
A whole new level of precision for drivetrain gasketing. Detect air bubbles and defects you couldn't see before. Track critical measurements, including entrapped air. Quickly and easily find a defect's root cause. Avoid expensive problems by responding sooner. Save millions: Contain warranty claims and recalls. The Graco PCF and Analyzer combination: Your ultimate system for accurate, reliable dispensing. The new Graco Dispense Analyzer is a monitoring system capable of detecting the tiniest air bubble or error during adhesive dispensing. Paired with the Graco Precision Continuous Flow (PCF) system, the Analyzer monitors your dispense in real time, detecting immediately if conditions are off and may potentially compromise your final product. With the ability to respond immediately, you can avoid defects that lead to costly recalls. The Analyzer stores the signature of each dispense, giving you the ability to replay the data, even months or years after the actual dispense. Seeing the data replayed as if in real time, you can more easily pinpoint the root cause of the defect and contain a recall or warranty claim to only those products that were affected.
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Thermal Shock Chambers
We provide a large selection of thermal shock chambers to accommodate various types of product testing. Thermal Shock Chambers perform tailored environmental stress screening of component and board electronic assemblies. Our unique chamber design transfers product between two extreme temperature-controlled chambers, passing equal volumes of high velocity conditioned air over the product and resulting in rapid product temperature changes. The induced thermal stresses can reveal hidden manufacturing defects in electronic sub-assemblies and other components by the expansion and contraction of critical parts.
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PXI Fault Insertion / Signal Insertion Switch Modules
Pickering's PXI Fault Insertion / Signal Insertion Switch Modules feature a breakout arrangement that allows faults to be attached to the sensor lines, this includes the breaking of a connection or the adding of defect all of which can simulate connectivity problems in the system. Two switching topologies are available: *Single signal paths with series switches and switches to connect to one or more fault buses*Pairs of signals with series switches, shorting switches between the signal pairs and switches to connect either signal to an external fault input.
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Power Steering Tester in Storage Case
34650
Gives fast, accurate power steering analysis. Test for defects in power steering pumps, gears and lines. Large heavy duty gage reads from 0-2,000 PSI and 0-140 BAR. Use to rule out power steering problems before expensive suspension or steering linkage problem is attacked. Includes 13 adapters. Supplied with instructions in a durable, plastic molded storage case.
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DC Magnetic Flux Leakage Testing
ROTOMAT / TRANSOMAT Product Family
Foerster Instruments, Incorporated
With the new generation ROTOMAT DA and TRANSOMAT DA flux leakage test systems FOERSTER is setting new standards in continuous quality assurance of ferromagnetic steel tubes. The test systems enable the reliable detection of natural and oblique defects, regardless of their angle or length, in addition to standardized longitudinal and transversal defects. The miniaturization of sensors together with highly integrated electronic components dramatically increases the number of channels. This makes a more precise and finer scan of the surface possible, giving a more complete set of information regarding detected defects. The newly introduced C-Scan visualizes these defects in high-definition and real-time, resulting in a completely new evaluation of the tubes to meet rising quality requirements.
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Metallurgical Testing Services
BMP Testing and Calibration Services Inc.
Metallurgical testing is a crucial part of metal processing and manufacturing and is used in almost every industry — aerospace, shipbuilding, steel, construction, and many others. It involves the use of a wide range of techniques and equipment to identify the material type, potential defects, and processing errors.
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Static Analysis
SAST
Coverity® is a fast, accurate, and highly scalable static analysis (SAST) solution that helps development and security teams address security and quality defects early in the software development life cycle (SDLC), track and manage risks across the application portfolio, and ensure compliance with security and coding standards.
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Automated Optical Inspection (AOI)
Automated optical inspection (AOI) is an automated visual inspection of printed circuit board (PCB) (or LCD, transistor) manufacture where a camera autonomously scans the device under test for both catastrophic failure (e.g. missing component) and quality defects (e.g. fillet size or shape or component skew). It is commonly used in the manufacturing process because it is a non-contact test method.
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Defect Inspection Systems
Candela® defect inspection systems detect and classify a wide range of critical defects on compound semiconductor substrates (GaN, GaAs, InP, sapphire, SiC, etc.) and hard disk drives, with high sensitivity at production throughputs.
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In-Sight Vision System
D900
The In-Sight D900 is a smart camera powered by In-Sight ViDi software designed specifically to run deep learning applications. This embedded solution helps factory automation customers easily solve challenging industrial OCR, assembly verification, and random defect detection applications anywhere on the line that have gone uninspected because they are often too difficult to program with traditional, rule-based machine vision tools.
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X-Ray Inspection
X-ray inspection systems are used wherever defects need to be detected by non-destructive means. The spectrum of use is broad and ranges from quality controls for complex assemblies, to the testing of materials for cracks and air inclusions, to foreign matter inclusions and shape deviations. The trend toward miniaturization, higher packing densities, and the relocation of components to the interior of the assembly require precise X-ray inspections that detect hidden defects quickly and reliably. X-ray systems from Viscom are used for the inspection of series assemblies as well as sampling and prototype controls. They take care of typical inspection tasks in concealed areas such as void controls, THT filling level measurements, and HIP inspections. At the same time, the systems reliably determine defect features such as coplanarity and polarity – at high inspection speeds and in a cost-effective way.
