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Probe Cards
semiconductor bond pad and signal terminals interchangeable electro-mechano Interface to tester.
See Also: Cards, Extender Cards, POST Cards, Test Cards, Probe Card Interfaces, Wafer, Test Probes
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Probe Cards
U-Probe for Multi-die Test of Memory IC. Vertical-Probe Needle Type Probe card suitable for multi-die test of devices with peripheral pads. ertical-Probe Spring Type. Probe card suitable for area array pad test. 64DUTs Multi-Die. Probe Card for RF devices. Fine Pitch.
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Probe Cards
Minitile™ with Advanced Cantilever™ technology and WedgeTile™
Each probe is designed for wide temperature ranges and so the probe expansion characteristics are closely matched to the wafer’s expansion characteristics. This allows the user to take a fast measurement while a system is in a settling or thermal stabilization mode and helps compensate for wafer expansion.
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Probe Cards
These cards are compatible with WLCSP and can be customized according to pin positions. They can be used for a pitch of up to 180 μm. We are developing a product for a pitch of 150 μm, to be compatible with narrower pitches.
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Cantilever Probe Cards
Cantilever Probe Cards are based on the approved epoxy ring design. The probe-needles are precisely arranged the required pattern to ensure proper contact on the pads.
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Cryogenic 4K Probe Cards
Over the last 20 years the Celadon Engineering team has developed an expertise in cryogenic materials which has resulted in a solid reputation in the industry for producing extremely stable cryogenic on-wafer probe cards as well as DUT probing solutions. These Cryogenic probe cards have all the benefits of Celadon’s Crash Resistant™ probe technology but with the ability to probe as cold as humanly possible. Celadon’s cryogenic solutions vary from standard VersaTile™ footprints which interface to positioners to innovate custom PCB based designs to allow for flexibility when testing at these very cold temperatures. Lakeshore cryogenic wire is used in standard DC solutions for high density cable-out designs to support high pin count applications. During the development process, Celadon works closely with the cryogenic prober vendor to ensure the integrated solution is optimized for current and future testing needs.
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Mems-Based Probe Cards
MEMSFlex
Nidec SV Probe proprietary MEMSFlex™ Probes are a perfect complement to our probe card technologies, ideal for many advanced testing applications including Flip Chip, WLCSP, Solder Bump, CuPillar and Pad. Featuring a fine 3D MEMS coil spring and electro-formed Ni-pipe, these probes are manufactured using a continuous, automated, manufacturing process, we can support a wide array of custom pin pitches within a short cycle. Other features include:
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Probe Cards
PICOPROBE® PROBE CARDS by GGB Industries, Inc., allows for more chip design flexibility because each probe card is custom configured to your circuit for testing wafers on either manual or automatic probe stations. Probe cards with complex layouts consisting of numerous DC contacts and multiple microwave probes with operating frequencies of 40, 50, 67, or 110 GHz can be custom fabricated quickly and inexpensively.
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Probe Cards
LCD Driver
LCD Driver devices are utilized in some of the most popular high definition tech products such as LCD televisions, high functioning smart phones and tablets.
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Vertical Probe Cards
B3
The patent-pending B3™ structure requires a minimum number of parts and can handle up to 300 probes. This vertical technology can provide: • Increased Uptime • Extended Probe Lifetime • Reduced Maintenance • Lower Cost of TestThe B3™ is an ideal solution for testing small pads and the low force probes minimize scrub. Planarity also remains stable over time increasing probe card life. Contact your sales representative to learn more about our B3™ probe cards.
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Metrology Systems
VIEW offers a full line of optical metrology systems for wafer, photomask, slider, MEMS, semiconductor package, HDD suspension, probe card, and micro-component process measurements.
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Cantilever Probe Cards
Venture
Nidec SV Probe’s VentureTM line of cantilever probe cards represents the finest epoxy technology on the market and are perfect for logic testing. The Venture line includes an extensive array of cantilever cards, single to multi-die for a variety of test systems. Other capabilities include: • 3K Points • Pad Pitches as Tight as 35µm • Up to 32 DUTsContact your Nidec SV Probe sales representative to determine which VentureTM product is right for your testing application.
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FCB Probe Card
The FCB Probe Card is the most mature technology of buckling beam probe card. It is aimed to achieve the semiconductor ship manufacture time-to-market (TTM) and cost of test (COT) demand. FCB is a proven solution for a variety of semiconductor production tests from early engineering pilot-runs to high volume manufacturing (HVM). FCB is ready for device requiring high signal integrity probing (SI) and/or power integrity probing (PI). Applications include cutting-edge SiPs/SoCs, WLP, graphic processors, micro processor, industrial microcontrollers, and more. FCB guarantees the world’s best overall cost-of-ownership (COO) for various DUT applications.
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Generic Probe Cards, PIB's, and Loadboards
Test Spectrum can provide generic Probe Cards, Probe Interface Boards (PIB), and loadboards. Choose from existing configurations already designed, or a generic test board for your specific tester configuration can be designed quickly.Teradyne J750 Probe Card and PIB; Teradyne Integra Flex PIB; Teradyne Ultra Flex PIB; Teradyne Catalyst PIB; Credence Quartet PIB (Probe Interface Board); Advantest 93K 1024 PIB
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Complete Power Quality Analysis System
PK4564
PK4564 complete Power Quality Analysis System includes PS4550 Power Quality Analyzer with extended memory, AC charger, Quick-Start manual, deluxe voltage leads, four eFX6000 flexible current probes, SD memory card, CAS3 hard-shell carrying case, PSM-A Software, and 1-year deluxe warranty.
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Cryogenic Applications
Over the last 20 years the Celadon Engineering team has developed an expertise in cryogenic materials which has resulted in a solid reputation in the industry for producing extremely stable cryogenic on-wafer probe card as well as DUT probing solutions. These custom cryogenic probe card solutions are widely used to test Space, Military, Medical and Quantum Computing products. Celadon’s cryogenic solutions vary from standard VersaTile™ footprints which interface to positioners to innovative custom PCB based designs to allow for flexibility when testing at these very cold temperatures. Lakeshore cryogenic wire is used in standard DC solutions for high density cableout designs to support high pin count applications. During the development process, Celadon works closely with the cryogenic prober vendor to ensure the integrated solution is optimized for current and future testing needs.
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Advanced Probe Card / V type
VC Series
Japan Electronic Materials Corp.
*Vertical contact Probe Card*No limitation by Pad layout*Large probe area (Suitable for 200mm wafer 1-shot)*Small scrub mark*Suitable for High/Low Temperature Test
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Low-leakage Switch Matrix Family
Conducting all the parametric measurements necessary for the numerous test structures on a semiconductor wafer can be a time-consuming and expensive process. With the cost of end-user devices continuing to drop, even laboratory characterization environments must reduce the cost of test. Until now engineers and scientists working on current and future semiconductor process technologies were faced with a difficult choice: either use a semiconductor parameter analyzer with positioners on a wafer prober, which limits the ability to perform automated test, or use a switching matrix and probe card, which reduced the analyzer's measurement resolution. Utilizing a switching matrix with a semi-automatic or fully-automatic wafer prober enables characterization tests to be automated, eliminating the need to have an operator manually reposition the probes each time a new module needs to be tested. This reduces both test time and cost. Due to the many price/performance points available, Keysight's switching matrix solutions provide the flexibility to choose exactly what your testing needs require, without overspending.
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Production Wafer Level Burn-in
TV19 VersaTile™ probe cards are designed with Celadon’s patented ceramic technology for superior electrical performance, yet is highly modular due to it’s 28mm x 28mm chassis. Micro-adjustments can be made in seconds with an allen wrench and a microscope. Easily align VersaTile cards for different wafer layouts using a 4.5” compatible 1×3 , 200mm, or 300mm VersAdjust plate.
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Metrology
SV TCL also has the capability to emulate the testing environment with our probe card analyzers including newly installed direct dock analyzers in the United States, Taiwan and Vietnam. SV TCL is dedicated to continuous product improvement so that we can provide our customers the latest and most innovative test solutions.
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Probe Card PCB's
DTS offers both generic and custom PCBs blanks for probe cards. Probe card PCBs are available for all tester platforms and can be configured for any vertical technology, epoxy cantilever and legacy blade cards. DTS probe card blanks are made to precise specifications required for all probing technologies and are available in high speed and high temperature materials. All probe card PCBs employ a balanced layering construction to maintain tight flatness specifications and minimize warping, allowing good probe planarity. Gold plating on all surface metals facilitates easy soldering and minimizes probe resistance. DTS is continually adding new probe card blanks to its library!
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Probe Card Analyzers
PB3600
The PB3600 provides the latest techniques in testing and maintaining probe cards. Designed through joint development with many of the world’s largest semiconductor and probe card manufacturers, ITC has produced an ergonomic analyzer with the greatest measurement resolution, highest throughput, most flexibility and still made it easy to use.
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Probe Card
Tile-on-Card™
Celadon’s uniquely robust and repairable patented probe-in-ceramic crash resistant probe cards reduce maintenance headaches while increasing tester utilization. Celadon’s TOC™ probe cards are known for achieving 10 million+ touch downs before rebuild on test floors worldwide.
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CMOS Image Sensor
CIS
CMOS Image Sensors (CIS) allow multiple camera functions in mobile devices, automobiles and security systems. Nidec SV Probe provides both standard and advanced versions of our CIS cards employing a wide variety of materials ensuring a durable cost-saving solution that can meet the fine pitch and multi-dut challenges of these devices. Other features and benefits include: • Proprietary AC™ Alloy Probes • Reduced Damage Under the Pad • High Frequency Capability • Better Alignment StabilityOur advanced CIS card, the Multiplexer™, is offered specifically for high density and high parallel applications. The Multiplexer™ is built with cantilever needles held into place on one side and shorter AC™ probes on the other which leads to a more stable electrical characterization over other CIS probe card options.Contact your Nidec SV Probe Representative so we can help you find the right CIS product for your testing needs.
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LED Probes for testing
Advanced Probing Systems, Inc.
Probe Needles are used for the fabrication of most probe cards, however there exist applications for which these materials may not be appropriate, e.g., hubrid device and gold pad probing.
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Probe Card Analyzers
PB6800
The ITC line of Probilt, probe card analyzers provide fast, accurate and repeatable test data for all types of probe card technologies. Simple user definable vision parameters allow even the newest and most complex probe tip geometries to be captured and accurately measured. Probilt’s PB6800 large measurement chuck allows probe arrays as big as 300 mm in diameter to be touched down without overhanging the chuck surface.
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Wafer Testing
Trio Vertical
SV TCL's TrioTM is a reliable solution for advanced wafer testing challenges, specifically full array and parallel probing. We offer a complete line of vertical probe card products, each designed for your unique application.
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Probe Card
T40™ Series
Ultra low noise and fast settling modeling and characterization tests are made possible by Celadon’s patented ceramic probe cards.
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High-Speed Trimming System
LSR-3230
* no fixture or probe cards on top side * 2, 4, and 6 wire test capability * touch screen operation * high performance DC electrical tester * high throughput - low running cost
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Motherboards
ITC currently manufactures over 100 different motherboard types, including interfaces to all major brands and types of testers. Additionally, ITC has the ability to quickly design and manufacture motherboards for any new tester interface including custom probe cards.
