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SoC
A complete computer "System on a Chip".
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Rugged COM-HPC Server Type Size E Reference Development Platform Based On Ampere® Altra® SoC
Ampere Altra Developer Rugged
The rugged 4U rackmount server platform provides a cloud-native environment for embedded edge development. It can host the SOAFEE (Scalable Open Architecture for Embedded Edge) providing a cloud-native environment for embedded edge development and is compatible with Autoware Foundation's Autoware Open AD Kit. It supports the open source EDKII as bootloader with UEFI, so customers can just download a stock AArch64 (arm64) ISO such as Ubuntu and install it through booting a live ISO directly on the target. The same convenience we have become used to by using x86 / amd64 target systems.
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3D-IC Solution
Consumer demand for increased bandwidth and low power in smaller form factor has forced design teams to pursue design and manufacturing alternatives to single system-on-chip (SoC) approaches. Moving to advanced geometries like 20nm/14nm is a natural progression; however, it has its own cost, yield, manufacturing, and IP reuse challenges.
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TySOM Embedded Prototyping Boards
TySOM™ is a family of embedded system prototyping boards. Depending on the board, one of three FPGAs will be at its heart: a Xilinx Zynq® UltraScale+™, a Xilinx Xilinx Zynq-7000 or a Microchip PolarFire SoC. The boards are compatible, through industry standard interfaces (FMC or BPX), with Aldec’s wide range daughter cards, making Aldec’s TySOM embedded prototyping boards ideal for the rapid development of applications that include automotive (and ADAS, in particular), artificial intelligence (AI), machine learning (ML), embedded vision, embedded-HPC (including edge-processing), IoT, IIoT and industrial automation.
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3U OpenVPX Module
VPX3-ZU1B
Sundance Multiprocessor Technology Ltd.
PanaTeQ’s VPX3-ZU1B is a 3U OpenVPX module based on the Zynq UltraScale+ MultiProcessor SoC device from Xilinx. This upgraded version provides a dual Ethernet 1000BaseT interfaces on the VPX P2 connector.
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Test System
UltraFLEX
The UltraFLEX test system delivers the power and precision you need for complex SoC devices built for mobile applications, networking, storage or high-end processing. Choose UltraFLEX when your device mix and throughput goals demand the highest speed, precision, coverage and site count.
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SOC Battery Tester
This sophisticated battery test equipment allows the battery tester to exercise and explore the battery’s internal profile and produce a true state of charge revealing the batteries true AHR capacity and ability to perform under load.
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USB Solutions
Arasan Chip Systems provides a complete suite of USB-compliant IP including low speed, high speed and super speed USB products. Arasan became a member of the USB-IF standards body in 1996 and delivered its first USB 1.0 IP product in that year. The offering expanded to USB 2.0 products in 2000 and USB 3.0 products in 2009. Arasan's customer base includes many major systems and SoC companies in variety of industries.
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µHELIX® Test Probes
Series S200, S300, S400, and S500
Test Probes for fine-pitch applications: CSP, BGA, SiP, SoC, flex-circuits, micro pcb, sub-mm center-to-center spacing, half mm, quarter mm spacing. Excellent for use in sockets, fixtures, and contactors for semiconductor testing and in coaxial installations.
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UHD Set-Top Box Processors
ST’s set-top box SoCs bring a world of media into your living room. Our UHD portfolio offers high-end solutions for 4K broadcast content as well as supporting internet media and operator-specific applications.
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Qseven V1.2 SoM Evaluation Kit With I.MX287 454 MHz (Industrial) SoC, 128MB Memory, 4GB EMMC, Gigabit Ethernet, Audio, CAN And BSP
Q7M100-100-EVK
*Ultra low power consumption ARM9*High flexibility Qseven v1.2 compliant design*5 UART*2 CAN*24-bit TTL LCD*10/100 Mbps Ethernet*Linux 2.6.35
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Sealed Panel PC
PPC12-427
WINSYSTEMS’ PPC12-427 is a fanless, 12.1-inch panel PC featuring the latest generation Intel Apollo Lake-I SOC processor. Its small size, low power, extended operational temperature, and IP65 rating make it a great fit for harsh environments in the industrial control, transportation, energy, and industrial IoT markets.
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Linux-based Development Platform For The GridARM™ ΜController
PEAK gridARM Evaluation Board
The ARM7 microcontroller gridARM™ was developed by Grid Connect® as a system on a chip solution (SoC) for the implementation of embedded applications with a focus on industrial communication. The Evaluation Board PEAK-gridARM is a Linux-based development platform for the gridARM™ microcontroller. It has connections for Gigabit Ethernet, high-speed CAN, USB 2.0, RS-232, SPI and I²C. The digital and analog inputs of the evaluation board can be manipulated with buttons and potentiometers. The states of the microcontroller, the supply and the message traffic are displayed via LEDs. A board support package for Linux enables access to the hardware resources of the PEAK-gridARM evaluation board.
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I-Pi SMARC Development Kit Based On Intel® 6th Gen Atom® X6425E Quad-Core SoC
I-Pi SMARC Elkhart Lake
The I-Pi SMARC Elkhart Lake is a SMARC-based edge solution development kit powered by Intel Atom x6425E quad-core SoC with integrated Intel UHD graphics and comprehensive high speed interfaces. Development-focused, this kit also supports the latest version of the Intel® Distribution of OpenVINO™ toolkit, which features more deep-learning models, higher inferencing performance, and fewer code changes, making developing ever simpler.
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Computer-On-Module
SMARC
SMARC form factor is the only computer-on-module form factor that truly is capable of supporting both ARM and x86 designs. With 314-pins on a high speed MXM3 connector, SMARC can fully cover both typical x86 interfaces as well as typical ARM type low level signals. Using ARM SoCs opens the possibility to leverage the product ecosystem of familiar devices such as tablet computers and smart phones. Alternative low power SoCs and CPUs, such as tablet oriented x86 devices and other RISC CPUs may be used as well.
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Hybrid Verification Platform
HES-DVM
HES-DVM™ is a fully automated and scalable hybrid verification environment for SoC and ASIC designs. Utilizing the latest co-emulation standards like SCE-MI or TLM and newest FPGA technology, hardware and software design teams obtain early access to the hardware prototype of the design. Working concurrently with one another they develop and verify high-level code with RTL accuracy and speed-effective SoC emulation or prototyping models reducing test time and a risk of silicon re-spins.
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Xeon D-15xx SoC Processor AMC
AMC754
The AMC754 is a Processor AMC in a single module, mid-size, based on the Intel® 5th generation Xeon 4-core, 8-core or 16-core Processors (Broadwell). The efficient SoC design has low power consumption and integrated PCH technology. The module follows the AMC.1, AMC.2 and the AMC.3 specifications.
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Automatic Phishing Mitigation Module
IronTraps
Phishing Forensics, automatically executed by IronScales servers upon reports of suspicious email, includes analysis of the number and skill ranking of the responders, Multi AV, Sandbox Scan, and other proprietary analyses which determine the mitigation response.Automatic Mitigation Response at the Gateway and Endpoints may consist of enterprise-wide quarantine, disabling of links and attachments, removal of email etc., as pre-configured by the SOC team.Intrusion Signature is generated with each attack to the endpoints and to the SIEM.Optional 1-Click Response An immediate directive triggered manually by the SOC team to the IronScales servers.
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Fanless Embedded System With Intel® Celeron® 2980U/ Core™ I5-4300U/i3-5010U ULT SoC, HDMI/DisplayPort, 2 GbE LANs, 4 USB 3.0, 2 COM And PCIe Mini Card
eBOX560-880-FL
The eBOX560-880-FL, a palm-sized, fanless embedded computing system utilizes high performance Intel® Haswell ULT multi-core SoC. The ultra-compact, ultra-lightweight eBOX560-880-FL adopts an IP40-rated rugged aluminum cold-rolled steel enclosure to withstand vibration of up to 3 Grms (with SSD) and has a unique thermal solution to support the temperature range from -20°C to +50°C (-4°F to +122°F). Supporting 4K2K resolution via HDMI interface, the outstanding embedded box computer is ideal for passenger information system, Kiosk, entry-level gaming, video surveillance, and other automation & embedded applications.
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SoC Tester
UltraFLEXplus
The UltraFLEXplus combines new instrument and software capability with a revolutionary tester infrastructure that provides a step-function improvement in throughput and engineering efficiency – all while leveraging the cumulative test IP developed over the UltraFLEX’s 15 year history .
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SoC Test Systems
Specifically designed for high-throughput and high parallel test capabilities to provide the most cost-effective solution for fabless, IDM and testing houses. With the full functions of test capability, high accuracy, powerful software tools and excellent reliability, 3650-EX is ideal for testing consumer devices, high-performance microcontrollers, analog devices and SoC devices.
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COM Express Compact Size Type 6 Module With Intel Atom® Or Intel® Celeron® Processor SoC (Formerly Codename: Bay Trail)
cExpress-BT
The cExpress-BT is a COM ExpressR COM.0 R2.1 Type 6 module supporting the Intel Atom® processor E3800 Series and Intel® Celeron® N2900/J1900 processor SoC (codename: Bay Trail). The cExpress-BT is specifically designed for customers who need high-level processing and graphics performance with low power consumption in a long product life solution.
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Semiconductor Testers
Designing and manufacturing scalable Automated Test Equipment (ATE) targeted at testing SOC, MCU, RF PA/FEM, Sensors/MEMS and Power and Analog devices
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Universal PMICs
PowerArchitect™ design and configuration software speeds development and significantly reduces overall time-to-market compared to legacy analog power solutions. An I²C interface and multiple GPIO pins ensure easy system integration. Configurable warning and fault levels, fault behavior and power up and down sequencing ensure any load can be properly powered and protected. The power system design can be completed with confidence long before the final revision of the SoC or ASIC is available.
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Intel Xeon D-15xx Processor, AMC
AMC763
The AMC763 is a Processor AMC in a single module, mid-size, based on the Intel® 5th generation Xeon 4-core, 8-core or 16-core Processors (Broadwell). The efficient SoC design has low power consumption and integrated PCH technology. The module follows the AMC.1, AMC.2 and the AMC.3 specifications.
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SoC Test Systems
SoC (System on Chip) devices integrate multiple different functions into a single chip. Our SoC test systems can test all the integrated circuits in SoC devices, including logic, analog, RF, DC and imagers by flexible configuration of the cards/modules used in the test system.
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Rugged PC Compatible
SYS-427X
WINSYSTEMS’ SYS-427X is a rugged, fanless industrial computer with the Intel® Apollo Lake-I SOC quad-core processor. Its compact size, low power, and extended operational temperature make it a great fit for rugged embedded systems in the industrial control, transportation, energy, and IIoT markets. In addition to the standard system configuration, three optional configurations are available, adding WiFi 6, CAN Bus, or both.
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PCI Express IP
Rambus silicon-proven, high-performance PCI Express® (PCIe®) 6.0, 5.0, 4.0 and earlier generation digital controllers are optimized for use in SoCs, ASICs and FPGAs. These market-leading solutions for high-performance interfaces address AI/ML, data center and edge applications.
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SMARC® Short Size Module with Intel Atom® E3900 Series, Pentium™ N4200 or Celeron™ N3350 Processor (codename: Apollo Lake)
LEC-AL
The LEC-AL Computer-On-Module (COM) combines the SMARC® 2.0 standard with the latest Intel Atom® E-Series and Pentium® and Celeron® N-series System-on-Chips (SoCs), providing ideal solutions for low power consumption and high performance requirements. The module provides the high integration, high performance, low power, and ruggedness favored by Internet- of-Things (IoT) applications such as retail transactional clients, digital signage, and in-vehicle infotainment systems. The LEC-AL module utilizes the latest Intel E-series and N-series SoCs, which are based on the Intel 64 Architecture, the new HD Graphics 500/505 engine, and a faster, 4-vector image processing unit. The SoCs are manufactured on Intel's industry-leading, tri-gate 14nm process, improving system performance by supporting more than 4 GB of both virtual and physical memory.
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Test Handler
HA1200
The new HA1200 handler can be linked with a tester to utilize our unique active thermal control technology for testing singulated and/or partially assembled dies. This technology enables testing of powerful high-end SoCs with 100% test coverage. This helps reduce yield loss at final test, thus reducing losses of final multi-die assembled products.
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COM Express Basic Size Type 7 Module with Intel® Xeon® D SoC and 4 SODIMMs
Express-BD74
- 4 SO-DIMMs, up to 128GB dual channel DDR4 at 1866/2133/2400MHz ECC (dependent on SoC SKU)- Intel® Xeon® D SoC (up to 16 cores)- Two 10G Ethernet and NC-SI support- Up to 32 PCIe lanes (24x Gen3, 8x Gen2)- GbE, two SATA 6 Gb/s, four USB 3.0/2.0- Supports Smart Embedded Management Agent (SEMA®) functions
