Chip
Passive or active components test and their interconnected circuitry in silicon or germanium.
See Also: Integrated Circuit, IC
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Low Light USB Camera Board (Color)
See3CAM_CU30 - 3.4 MP
See3CAM_CU30 is a 3.4 MP UVC-compliant Low Light USB camera board based on AR0330 sensor from ON Semiconductor®. This Low Light Board Camera is backward compatible with USB 2.0 and supports compressed MJPEG formats at frame rates equal to USB 3.0. This sensor enables a superior low light performance. It has a dedicated, high-performance Image Signal Processor chip (ISP) that performs all the Auto functions (Auto White Balance, Auto Exposure control) in addition to complete image signal processing pipeline that provides best-in-class images, videos and the MJPEG compressions.
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Metal Alloy Low Resistance Chip Resistor
MR
*Low Resistance / TCR / Inductance*Excellent long term stability*RoHS compliant and halogen free*Lead free*High precision current sensing and voltage division
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ARINC 429 Bus Interfaces
AIM’s > ARINC 429 test, simulation, monitoring and analysis modules use our field proven Common Core hardware design giving you the best performance, best feature set and highest functional integration on the market. The use of SoC (System on Chip) based core designs with multiple processors for real time bus protocol and application support, massive memory and IRIG-B time code encoder/decoder functions are standard. The latest versions also support avionics discrete I/O.
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Automated Optical Inspection
AOI
No complex assembly process is complete without the ability to inspect and characterize the many different components used. ficonTEC’s fully automated INSPECTIONLINE systems acquire high-resolution pictures of the surfaces of interest and performs optical inspection based on the user’s criteria. For example, facet inspection of laser diodes, QC for coatings, surface inspection, top/bottom/side-wall inspection of semiconductor chips, and die sorting are just some of the many inspection tasks performed routinely by ficonTEC’s suite of inspection tools. As for all of ficonTEC’s systems, a modular approach permits the inspection platform to equipped with additional features – automatic tray handling and various feeding philosophies, testing capabilities (e.g. LIV), top/bottom chip inspection, and in-situ labelling.
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Accelerometers - Special Purpose
Analog Devices accelerometers and iSensor® MEMS accelerometer subsystems provide accurate detection while measuring acceleration, tilt, shock, and vibration in performance driven application. Our portfolio leads the industry in power, noise, bandwidth, and temperature specifications, and offers a range of MEMS sensor and signal conditioning integration on chip. Our MEMS-based Circuits from the Lab® reference designs have been built and tested by ADI experts to help you jumpstart your next system design.
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In-Process Wafer Inspection System
7945
Chroma 7945 wafer chip inspection system is an automated inspection system for pre and post diced patterned wafers. Change kits enable switching between various applications by allowing different carriers including metal frame or grip ring.
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DIGITAL TACHOMETER
IBL-DT2235A
International Biological Laboratories
This is a Digital Hand Held Contact type Tachometer and has Micro Computer LSI Chip
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CMOS Cameras
A digital still or video camera that uses a CMOS-based image sensor chip rather than a CCD to record the picture.
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Dry Systems
Chips are made up of many layers stacked on top of one another, and it’s not necessarily the latest and greatest immersion lithography machines that are used to produce these layers. In a given chip, there may be one or two more complicated layers that are made using an EUV lithography machine, but the rest can often be printed using ‘older’ technology such as dry lithography systems. This is certainly more cost-effective for customers, since these older machines are less expensive to purchase and maintain. Read about how dry lithography systems are enabling progress.
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Infrared Moisture Analyzer
LD-LIMA-A10
Infrared Moisture AnalyzerLD-LIMA-A10is an online, fast, continuous measurement and non-contact measurement device with measurement distance range of 20 to 40 cm. It provides automated control and 4 to 20 mA current signal. This IR Moisture Analyzer emits different wavelengths of infrared light (4, 6, 8, 10 beam) to calculate the moisture content of the measured object. Designed with long-life high-speed brushless motor, imported high response infrared sensors, information processing chip FPGA + DSP + ARM9 combination, to attain real time data, improved stability and precision.
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Isolated Relay I/O Card
mPCIe-IIRO-8
The mPCIe-IIRO-8 consists of a type F1 PCI Express Mini Card (mPCIe) interface board that connects to a Mobile-ITX-sized, DB-37M Isolation Module via an included 9” cable. That module is designed to be easily panel-mounted in any application environment. It uses the high speed PCI Express bus to transfer digital data to and from the card. The digital I/O is compatible with 8255 PPI chips making it easy to program.
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ALD Applications
Atomic Layer Deposition (ALD) has the potential to optimize product design across a wide array of applications from making silicon chips run faster, to increasing the efficiency of solar panels, to improving the safety of medical implants.
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Intelligent Stirrer
Model 901
Intelligent chip design. Ability to set and store the stirring rate. Ability to switch between two kinds of stirring speed after pressing “PRM” button.Options of AC and DC. Applied in the field or in the incubator. MoreIntelligent chip design. Ability to set and store the stirring rate. Ability to switch between two kinds of stirring speed after pressing “PRM” button.Range: 0 to 2300 R/M (no load)Nice appearance, transparent coping designused with AC or DC, and a battery low voltage alarmused in lab, in incubator and brought outdoorsEquipped with strut and electrode holder, it can be used as agitating arc-spark standIP54 dustproof and splash proof.
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Digital Oscilloscope
MSO8000
The MSO8000 series digital oscilloscope is a mid- to high-end mixed-signal digital oscilloscope based on RIGOL's proprietary intellectual property ASIC chip and UltraVision II technology platform.
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Multilayer PCB
ultilayer circuit boards were essential in the advancement of modern computing. The multilayer PCB basic construction and fabrication are similar to micro chip fabrication on a macro size. The range of material combinations is extensive from basic epoxy glass to exotic ceramic fills. Multilayer can be built on ceramic, copper, and aluminum. Blind and buried vias are commonly produced, along with pad on via technology.
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Low Constant Temperature Trough
DRK6691
Shandong Drick Instruments Co., Ltd.
Drk6691 small low constant temperature trough is a special product designed for small Abbe refractometer, supporting the use of. It has many advantages such as constant speed, constant temperature, small volume, low noise and convenient operation and so on , so it is a higher price products. This product adopts the technology of the one chip computer, PID selftuning regulation technology;adopts imported platinum resistance temperature (Pt100), so it has high precision of temperature control and temperature fluctuation is small; adopts the semiconductor refrigeration technology, so that it consists of advantages of fast refrigeration, no noise.
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Sealed Linear Encoders
Sealed linear encoders feature optimal protection from dust, chips, and splash water. They are especially ideal for use in manually operated machine tools and also in numerically controlled machine tools.
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Electrical Receiver Conformance Test Application for IEEE 802.3bs/cd
M8091BSCB
IEEE 802.3bs receiver test application for 200GAUI-4 and 400GAUI-8, covering chip-to-module, chip-to-chip, backplane, and copper cable interconnects.
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Fourier Transform Optical Spectrum Analyzer, 600 - 1700 nm
OSA202C
Thorlabs' Optical Spectrum Analyzers (OSAs) perform highly accurate spectral measurements. Compatible with fiber-coupled and free-space light sources, these compact benchtop instruments suit a wide variety of applications, such as analyzing the spectrum of a telecom signal, resolving the Fabry-Perot modes of a gain chip, and identifying gas absorption lines. Many commonly available OSAs use grating-based monochromators, which have slow acquisition times due to the need to mechanically scan the grating and average out noise at each wavelength. Thorlabs' OSAs acquire the spectrum via a Fourier transform using a scanning Michelson interferometer in a push/pull configuration. This approach dramatically improves the acquisition time, enables a high-precision wavelength meter mode with 7 significant figures and ±1 part-per-million accuracy, and allows the included software to provide robust statistical analysis of the acquired spectra, as explained in the Design tab.
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Thin Film/Metal Film Chip SMD Chip Resistors
Panasonic Industrial Devices Sales Company of America
Panasonic’s industry leading Thin-Film Chip Resistors features include high reliability at high temperature and high humidity as well as high accuracy, low current noise and excellent linearity. Panasonic’s High Precision Thin Film Resistors are designed for robust applications where long life is crucial in markets such as automotive, appliance or industrial. These Resistors boast a high accuracy of up to 10ppm, 0.05% making them one of the best-in-class Resistors on the market today. Panasonic Thin-Film Resistors are available in case sizes down to 0201. Compliant standards include: IEC 60115-8, JIS C 5201-8, and EIAJ RC-2133B. These Resistors are AEC-Q200 Certified.
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Automotive System-on-Chip (SoC)
R-Car
"R-Car" is the nickname for Renesas' system-on-chip (SoC) family for car information systems designed for the next-generation of automotive computing for the age of autonomous vehicles.
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COM Express Basic Size Type 7 Module with Intel Atom® C3000 SoC
Express-DN7
The Express-DN7 is a COM Express® COM.0 R3.0 Basic Size Type 7 module supporting the 64-bit Intel Atom® C3000 processor (formerly “Denverton-NS”) system-on-chip (SoC). 16 CPU cores with 31W TDP and integrated 10G Ethernet make the Express-DN7 especially suited for customers who need excellent computing performance with low power consumption, such as edge computing applications, in a long product life solution.
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Video Signal Generator
MSPG-4233MT
MSPG-4233NT is basically supporting the Teletext and Closed Caption as multi broadcast for the D-TV(NTSC, PAL), as well as V-Chip(Violence Chip) function to block the violence and sex etc. bad program to protect a person under age through the regulation grade.
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Vibrator Control System
FORCE-III
The Force 3 Vibrator Control System is the newest generation of vibrator control system. It is designed to control individual vibes, or synchronize entire fleets of trucks. Using GPS, or VHF/UHF radio, for its time base the Force 3 both starts the Vibrator and controls its sweep with unparalleled precision and accuracy.The Force 3 is equipped with the latest ADC chips for better sweep resolution, increased computing power for faster response, GPS for precise source location, 8 Gbytes of internal memory for integrated VSS and PSS data storage, and integrated Wi-Fi for easy data offloading.
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Scanning Acoustic Microscope
Pulse2
This industry-leading scanning acoustic microscope provides a universal inspection tool for packaged semiconductor development, production and failure analysis. With the ability to detect air defects as thin 0.05 micron and spatially resolve defects down to 10 microns, the ECHO is perfect for bump detection, stacked die (3D packaging) inspection, complex flip chip inspection and more traditional plastic packages.
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COM Express Compact Size Type 6 Module Intel Atom® E3900 series, Pentium®, and Celeron® SoC (formerly Apollo Lake)
cExpress-AL
The cExpress-AL is a COM Express® COM.0 R3.0 Type 6 module supporting the Intel Atom® processor, Intel® Pentium® processor and Intel® Celeron® processor system-on-chip (SoC). The cExpress-AL is specifically designed for customers who need optimized processing and graphics performance with low power consumption in a long product life solution.
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Impulse Voltage Generator
GDCY
The impulse voltage generator is mainly used to the field of impulse voltage tests by lightning impulse voltage full wave, lightning impulse voltage chipped wave and operate impulse voltage wave for such test products as electrical instrument.
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ETX Module with Intel Atom® Processor E3800 Series SoC (formerly codename: Bay Trail)
ETX-BT
The ETX-BT is based on the latest Intel Atom® processor E3800 SoC series, adopting the latest 22nm process technology with 3-D Tri-Gate transistors featuring significant improvements in computational performance and energy efficiency. The E3800 SOC series integrates processor and GPU cores and all I/O on a single chip. Processor performance is scalable from a single-core Intel Atom® processor E3815 at 1.4GHz to a quad-core Intel Atom® processor E3845 at 1.9GHz. Two quad-core Intel® Celeron® processors, based on the same microarchitecture, are also available.
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SDIO Wi-Fi Module
SX-SDMAC
This Wi-Fi SDIO module is a low-power, single-stream solution with 802.11a/b/g/n/ac support based on the QCA9377 System-on-Chip from Qualcomm Atheros. This module supports Wave 2 MU-MIMO (Client), which increases the overall WLAN system performance by 3X compared to 11n. The module’s small form factor, rich features, and low power make it perfect for portable devices.
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RF/Microwave Assembly Capability
Teledyne Labtech offers a comprehensive build-to-print microwave module and microwave components manufacturing service. This includes MMIC placement, Au wire bonding, SMT assembly and test.Our microwave MIC production facility is housed in a class 10,000 clean room that accommodates manual chip placement and semi-automatic wire bond assembly. Dedicated microwave components manufacturing is undertaken within production cells established to meet specific customer or product requirements.
