Chip
Passive or active components test and their interconnected circuitry in silicon or germanium.
See Also: Integrated Circuit, IC
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Chip Inductors
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Our range of various chip inductor products contain the very latest in wire-wound technology and Ceramic or Ferrite Core, thus providing the ultimate in performance demanded by today’s Wireless products. The Inductors provide high Q and SRFs in an industry standard size and footprint.
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Chip Resistor Array
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Panasonic Industrial Devices Sales Company of America
An AEC-Q200 Compliant SeriesPanasonic components specified as AEC-Q200 Compliant are consistently designed into automotive systems. However, today’s Design Engineers are specifying AEC-Q200 components to meet the high-quality standards of devices beyond automotive applications.
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Product
Chip Resistors
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Panasonic Industrial Devices Sales Company of America
Panasonic offers a wide range of Chip Resistors including conventional Thick Film Chip Resistors, Specialized Resistors such as Thin Film, Current Sense, Anti-Sulfur, Anti-Surge and Metal Film Chip Resistors.Panasonic’s standard Thick Film Chip Resistors are offered in cases sizes from 01005 to 2512.
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Product
Metal Alloy Low Resistance Chip Resistor
MR
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*Low Resistance / TCR / Inductance*Excellent long term stability*RoHS compliant and halogen free*Lead free*High precision current sensing and voltage division
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Product
8GB DDR4-3200 1GbX8 1.2V ECC Samsung Chip
AQD-D4U8GE32-SE
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8GB, Speed 3200MHz, 30u" Gold Plating Thickness, Anti-sulfurization resistance, ECC.
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Product
Chip Test Adapter
SOJ EDO/FPM
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Our new addition to the RAMCHECK line provides support for common 20 to 42-pin EDO/FPM DRAM SOJ chips of sizes 256Kx16/18, 1Mx16/18, 8Mx8, 16Mx4, 2Mx8, 4Mx4, 16Mx1, 1Mx4, and 4Mx1.
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Product
16G DDR5-4800 288Pin 2GX8 1.1V Registered Samsung Chip
AQD-D5V16GR48-SB
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Samsung Original Chip, Dual 32-bit Subchannels. Increased Banks and Burst Length, DDR5 4.8GT/s. Same-Bank Refresh, On-die ECC for Enhanced RAS.
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Product
8GB SO-DDR4-3200 1GbX8 1.2V ECC Samsung Chip
AQD-SD4U8GE32-SE
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8GB, Speed 3200MHz, 30u" Gold Plating Thickness, Anti-sulfurization resistance, ECC.
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Product
Automotive System-on-Chip (SoC)
R-Car
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"R-Car" is the nickname for Renesas' system-on-chip (SoC) family for car information systems designed for the next-generation of automotive computing for the age of autonomous vehicles.
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Product
Chip Resistor Networks/Arrays
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Panasonic Industrial Devices Sales Company of America
Panasonic’s Chip Resistor Arrays are offered in cases from 0201 to 0805. The smaller 0201 case sizes are available with flat terminations and all other case sizes are offered with either convex or concave terminations. The EXB Series Resistor Arrays are available in 2, 4, or 8 Resistors per package. These Resistor Arrays allow for an improvement of the placement efficiency. Compliance Standards include: IEC 60115-9, JIS C 5201-9, EIAJ RC-2129, AEC-Q200 and RoHS.Panasonic’s Resistor Networks are available in 8 or 15 bussed Resistors and are recommended for all pull up/down circuits.
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Product
8GB SO-DIMM DDR5-5600 262Pin 1GX16 1.1V Unbuffered Hynix Chip
AQD-SD5V8GN56-HC
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Hynix Original Chip, Increased Banks and Burst Length, DDR5 5.6GT/s. Same-Bank Refresh, On-die ECC for Enhanced RAS.
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Product
16G R-DDR4-3200 1GX8 1.2V Samsung Chip -40~85C
AQD-D4U16R32-SEW
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Registered DIMM, 30u" Gold Plating Thickness, Anti-sulfurization resistance. 1.2V power consumption, Samsung original chip, wide temperatures from -40° to 85°C.
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Product
Capacitors - Binary Chip
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Macom Technology Solutions Holdings Inc.
MACOM’s BOO and BSP Series Capacitors are designed to facilitate bread-boarding or to use where a trimming capability is required. These devices feature the same dielectric layer and bonding surfaces as our 9000 and 9100 Series chip capacitors. By connecting the pads in parallel, the capacitance values are additive, so many combinations are possible.
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Product
16GB DDR4-3200 1GbX8 1.2V ECC Samsung Chip
AQD-D4U16GE32-SE
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16GB, Speed 3200MHz, 30u" Gold Plating Thickness, Anti-sulfurization resistance, ECC.
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Product
Thermal Test Chip
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Thermal Engineering Associates, Inc.
Thermal Test Chips (TTC) are used in many different Applications: Package Thermal Characterization, Heat Source Simulator, Temperature Reference Platform, Transient Analysis, System Thermal Management Design, Thermal Interface Material (TIM) Measurement & Characterization, Heat Sink Measurement & Characterization.
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Product
8G SO-DDR3-1600 204Pin 512MX8 1.35V Unbuffered Samsung Chip
AQD-SD3L8GN16-SG1
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DDR3 1600Mhz Unbuffered SO-DIMM, 30μ" gold plating thickness, 1.35V power consumption, Samsung original chip.
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Product
32G DDR5-4800 288Pin 2GX8 1.1V Unbuffered Samsung Chip
AQD-D5V32GN48-SB
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Samsung Original Chip, Increased Banks and Burst Length. DDR5 4.8GT/s, Same-Bank Refresh, On-die ECC for Enhanced RAS.
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Product
8GB DDR4-3200 1GbX8 1.2V Samsung Chip
AQD-D4U8GN32-SE
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8GB, DDR 4 3200MHz, 30u" Gold Plating Thickness, Anti-sulfurization resistance, Unbuffered.
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Product
Chip Manufacturing
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KLA’s advanced process control and process enabling solutions support integrated circuit manufacturing. Using KLA’s comprehensive portfolio of defect inspection, review, metrology, patterning simulation, in situ process monitoring and data analytics systems, IC manufacturers can manage yield and reliability throughout the chip fabrication process - from research and development to final volume production. SPTS provides deposition process solutions for insulating materials and conducting metals that cover a range of chip manufacturing process steps. IC manufacturers use KLA's array of products and solutions to help accelerate their development and production ramp cycles, to achieve higher semiconductor die yield and improved IC quality, and to improve overall profitability in the IC manufacturing process.
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Product
16G DDR5-4800 288Pin 2GX8 1.1V Unbuffered Samsung Chip
AQD-D5V16GN48-SB
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Samsung Original Chip, Increased Banks and Burst Length. DDR5 4.8GT/s, Same-Bank Refresh, On-die ECC for Enhanced RAS.
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Product
Chip Inspection System
GEN3000T
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GEN3000T is an inspection system that performs automatic inspection of individual semiconductor chips.This revolutionary chip surface inspection system was achieved by combining the chip handling technology cultivated by Toray with the inspection algorithm used in the "INSPECTRA®" wafer defect inspection system.
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Product
Anti-Surge High Power Thick Film Chip Resistors
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Panasonic Industrial Devices Sales Company of America
Anti-Surge High Power Thick Film Chip Resistors by Panasonic
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Product
6 Chip Detection and Burn Channels
CD1
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The CD1 provides 6 Chip Detect and Fuzz Burn interface(s). A Chip Detector (CD) is a magnetic-electrical device that provides a reliable method of detecting impending failure of bearings and gears.
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Product
Wafer Chip Inspection System
7940
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Chroma 7940 wafer chip inspection system is an automated inspection system for postdiced wafer chip inspection.
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Product
Chip Tester
TL2000
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ficonTEC’s series of testing machines is focused on automated electro-optical characterization ofsemiconductor chips. The ficonTEC TL2000 is a fully automated test and inspection system for unmountedlaser diode bars, single chips and chips on submounts.
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Product
PC/104 Single Board Computer with Vortex86DX3 System-on-Chip
CM1-86DX3
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The CoreModule CM1-86DX3 is a PC/104 board with DMP Vortex86-DX3 single chip solution and has a very good performance to power ratio. The board comprises all peripherals needed for an embedded PC on a small 3.775" by 4.050" printed circuit board. The CM1-86DX3 integrates a powerful yet efficient DMP Vortex86DX3 with graphic controller and audio controller together with an additional GBit Ethernet controller to form a complete PC, with all the standard peripherals already onboard. Two Ethernet ports (1x GBit and 1x 100MBit), four RS232/RS422/RS485 serial ports, two USB 2.0 host controller to handle the communication with external devices. There are PS/2 connectors for keyboard and mouse. A first generation SATA interface allows the connection of hard disk or CD drive. CFast is also available. System expansion can easily be realized over the PC/104 bus connectors.
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Product
32GB SO-DDR4-3200 2GbX8 1.2V ECC Samsung Chip
AQD-SD4U32GE32-SB
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32GB, Speed 3200MHz, 30u" Gold Plating Thickness, Anti-sulfurization resistance, ECC.
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Product
Thin Film Chip Resistors, High Voltage Type
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Panasonic Industrial Devices Sales Company of America
Thin Film Chip Resistors, High Voltage Type by Panasonic
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Product
4G DDR3-1600 240Pin 512MX8 1.35V Unbuffered Samsung Chip
AQD-D3L4GN16-SG1
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DDR3 1600Mhz Unbuffered DIMM, 30μ" gold plating thickness, 1.35V power consumption, Samsung original chip.
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Product
Metal Foil Llow Resistance Chip Resistor
MFR (Metal foil)
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*Low Resistance / TCR / EMF 9only FOR MnCu) / Inductance*Excellent long term stability*RoHS compliant and halogen free.*Lead free.* High precision current sensing and voltage division.
