Chip
Passive or active components test and their interconnected circuitry in silicon or germanium.
See Also: Integrated Circuit, IC
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Multi-Contact Wedge
The GGB Industries MULTI-CONTACT WEDGE allows for more chip design flexibility because it is custom configured to your circuit. Four Wedges can be used at the same time to probe a complete chip.
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10-CH General Purpose Timer/Counter & 8-CH DIO Module
cPCI-8554
- PICMG 2.0 Rev 3.0- Four 82C54 programmable timer/counter chips- Up to 12-CH 16-bit timer/counter- 1-CH 32-bit cascaded timer based on 8 MHz clock source- Four programmable clock sources for each timer/counter- Programmable de-bounce filters for external clock & external interrupt inputs- 8-CH TTL digital inputs & 8-CH TTL digital outputs- +12 V and +5 V power available on the connector
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Piezo-resistive Accelerometer
A Piezo-resistive Accelerometer has a stable structure composed on a silicon chip created by the micromachining and semiconductor production technology. A mass and a beam on which a set of the Piezo-resisters are created on the silicon chip. A set of electrical bridged is formed by such Piezo-resistive resisters to generate signals proportional to the applied acceleration.
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ESP8266 WiFi With Headers
Feather HUZZAH
Flagship development board from Adafruit, and like its namesake it is thin, light, and lets you fly! We designed Feather to be a new standard for portable microcontroller cores. This is the Assembled Adafruit Feather HUZZAH ESP8266 with headers. At the Feather HUZZAH's heart is an ESP8266 WiFi microcontroller clocked at 80 MHz and at 3.3V logic. This microcontroller contains a Tensilica chip core as well as a full WiFi stack. You can program the microcontroller using the Arduino IDE for an easy-to-run Internet of Things core.
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SparkFun USB To Serial Breakout
FT232RL
This is the SparkFun USB to Serial Breakout for the FT232RL, a small board with a built in USB to serial UART interface. This little breakout is built around the FT232RL IC from FTDI, with an internal oscillator, EEPROM, and a 28-pin SSOP package this is a serious little chip.
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Software
DPM-3
Was developed to read and edit Plug and Play Smart Sensors that are compliant to the IEEE 1451.4 Standard. TEDS, or transducer Electronic Data Sheet, is a set of electronic data in a standardized format defined within the IEEE 1451.4 standard. This data specifies what type of sensor is present, describes its interface, and gives technical information such as sensitivity, bridge type , excitation, etc. This information is stored in an EEPROM chip attached to the sensor. By having this chip, the sensor can identify and describe itself to the network and or Smart Load Cell Meter (DPM-3), thereby easing automatic system configuration.
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High Performance Embedded Development Kit
TySOM EDK
The TySOM™ Embedded Development Kit is for the embedded designers who need a high-performance RTL simulator/debugger for their embedded applications such as IoT, Automotive, Factory automation, UAV and Robotics. The kit includes Riviera-PRO™ Advanced Verification Platform and a TySOM development/prototyping board. TySOM boards come with either a Zynq 7000 chip (FPGA + Dual ARM® Cortex™-A9) or with a Zynq® UltraScale+™ MPSoC device. These boards include memories, and various communication and multimedia interfaces in addition to FMC connectors for peripheral expansion. Reference designs for application such as IoT, ADAS, 4K UltraHD imaging and Robotics and a complete reference design, which contains the SW (Linux) and all the hardware blocks required to support the peripherals on the board, are provided.
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(IoT) Wireless Module
SX-59HLS
The SX-59HLS is an ultra-low power Hosted Dual Band 1x1 802.11a/b/g/n Internet-of-Things (IoT) wireless module based on the Qualcomm QCA4012-2 System-on-Chip (SoC). The SX-59HLS is a first in its class to provide enterprise security for today’s high performing networks.
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PROBE CARD
the electrical characteristics of the individual CHIPs in WAFER that have been completed through the FAB stage during the semiconductor fabrication process
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Automated Programmer Superpro Sb05
※ Four Pick & Place nozzles, Eight socket pressing actuators and 2 tape feeders※ High throughput up to 2400UPH※ Embeded with eight ultra-high speed programmers SuperPro / 7500, each with up to 4 sockets, totally 32 sockets. Throughput 60 times higher than SuperPro / SB01 for eMMC devices※ Supports over 80,000 devices from over 300 IC manufacturers※ Supports tray, tape and tube input and output. Supports laser and ink marking※ Short change-over time※ Intelligent s/w cuts learning curve and setup time, makes task management an easy job※ Compact sizeHigh throughput：4 nozzles, 8 independent socket pressing actuators and 2 tape feeders. Up to 2400 UPH for devices with programming time less than 50 sec. Throughput 0.6 to 60 times higher than SuperPro/SB01, especially higher for large capacity devices like eMMC, NAND /NOR FLASH,SPI FLASH. Suitable for both small and large capacity devices. Prog. Time (S) 50 60 120 180 240 300 UPH (unit per hours) 1600 1600 840 560 420 336 Accurate positioning：Equipped with high performance servo system, precise CCD cameras and vision algorithm for device alignment and sockets / pick & place spots positioning.High performance programmers： 8 ultra-high speed universal gang programmers SuperPro/7500 resident. Each with up to 4 sockets, totally up to 32 sockets in the system. Supports up to 100,000 devices from over 300 IC manufacturers and growing.Varied I/O devices：Supports tray, tape and tube input and output. Supports laser and ink marking. Supports packing conversion and can work as a packing conversion machine alone.Short change-over time：I/O devices and socket adaptor are easy to be changed when programming task need to be changed. Socket positioning can be performed automatically. Projects can be loaded automatically with barcode scanning.Powerful and intelligent software：Setup data saved for next operation, log file and statistic reports for quality and yield traceability, flexible sockets prohibition strategy promises high yield rate for unattended operation, graphical user interface cuts learning curve, prevents chip over-lapping by socket checking before chip placing.Remote Control：Remote project loading, quality monitoring, volume control, file security.
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Hot Electron Bolometer (HEB) Mixers/ Receivers In Terahertz Range
Insight Product Company offers Hot Electron Bolometer (HEB) mixers, receivers, and chips made from NbN or NbTiN thin film. The HEB mixers can operate at frequencies of up to several terahertz.
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Digital I/O Card
PCIe-DIO-48JPLS
The PCIe-DIO-48JPS is a 48 channel PCI Express (PCIe) card designed for use in a variety of digital I/O applications. It uses the high speed PCI Express bus to transfer digital data to and from the card. The digital I/O is compatible with 8255 PPI chips making it easy to program. This also allows for simple and trouble-free migration from other ACCES PCI digital I/O cards.
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Probe Series
CAPELLA Series
MPI Photonics Automation is the industry leading provider of turnkey test solutions for the LED / Mini LED manufacturing industry. With more than 10,000 MPI probers installed worldwide, the CAPELLA series of probers have a proven track record of superior performance and reliability. The CAPELLA series probers support electrical and optical characterization of all LED product types (Vertical chip, Lateral chip, Flip-chip) from wafer to packaged die level. Whether you need a high-performance, cost-effective or specialty prober system, MPI PA has the most comprehensive range of LED wafer/chip probers to meet your exacting requirements.
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Mechanical Stress Card Testing
Wheels are transversely positioned with micromechanical stopsPressure exercised on the card's chip and microcircuitryThe card is free to deform in the Z axisThe stress is controlled by an accurate, precise force sensorProgrammable number of cycles
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Low Concentration Type HF/HCl/NH3 Concentration Monitor
HF-960M
The HF-960M uses sensors that offer outstanding corrosion resistance for high-precision, high-speed measurement of low concentrations of hydrofluoric acid, hydrochloric acid and ammonia, and is thus perfect for single-bath and wafer cleaning. The HF-960M is also an environmentally-friendly product that uses lead-free solder for mounting chips on the PCB.
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WLCSP Probe Heads
Smiths Interconnect offers Wafer Level Chip Scale Package (WLCSP) Probe Heads utilizing spring probe technology which provide high parallelism in test, superior signal integrity and high speed / RF testing capability.
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Anti-Sulfurated Thick Film Type Resistors, Precision Type
ERJ-U2R/ERJ-U3R/ERJ-U6R Series
Panasonic Industrial Devices Sales Company of America
High Precision And High Resistance To Sulfurization In One Resistor!Panasonic's ERJ-U2R, ERJ-U3R, ERJ-U6R (ERJ-U*R Series) offers high precision and also provides anti-sulfurization characteristics that avoid an open circuit caused by a sulfide disconnection. High resistance to sulfurization is achieved through the use of an anti-sulfurated electrode structure and material in the manufacture of ERJ-U*R Series Resistors. AEC-Q200 Compliance and IEC 60115-8, JIS C 5201-8 and JEITA RC-2134C Reference Standards for the entire ERJ-U*R Series of High Precision, Thick Film Chip Resistors from Panasonic ensures optimal quality and reliability.
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Microcontrollers (MCUs)
8-bit
An innovative 8-bit chip design provides a fully-integrated experience. Silicon Labs' 8-bit MCUs are ideal for IoT applications and beyond, delivering the industry's fastest speeds and lowest power.
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O2/N2 Analyzers
GNL-2100 Series
Shanghai ChangAi Electronic Science & Technology Co.,Ltd
GNL-2100 analyzer is the online intelligent measurement instrument, which adopting advanced ion current oxygen sensor with single chip technology. N2%=100%-O2%. It has been widely used in the fields of nitrogen separation from air, fertilizer, petrochemicals and biological fermentation.
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IPM Drive
IPM drive photocouplers (optocouplers) are optically coupled isolators containing a GaAlAs LED on the input side and a photo diode and signal processing circuit on the output side in a single chip. This coupler is a high common mode transient immunity (CMR), high CTR type whose pulse width changes according to the operating temperature, making it ideal for driving IPMs (intelligent power modules).
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SoC Test Systems
SoC (System on Chip) devices integrate multiple different functions into a single chip. Our SoC test systems can test all the integrated circuits in SoC devices, including logic, analog, RF, DC and imagers by flexible configuration of the cards/modules used in the test system.
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Electrical Property Measurement
Materials Analysis Technology Inc.
This technology is used to identify the electrical characteristics, such as resistance, capacitance and inductance, of semiconductor devices. Characteristics measured from fail and normal chips could provide important clues for further failure analysis.
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System Level Test
SLT
As technology nodes continue to evolve and with a more aggressive time to market to bring devices to their end applications, full test coverage of such chips is possible only with System Level Testing.
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Thermal Test Vehicles
TTV
Thermal Engineering Associates, Inc.
Using the TTC-1002 Thermal Test Chip as a basis, TEA offers TTVs in flip-chip, bare die, BGA packages for a variety of thermal simulation, reliability, qualification, heat sink characterization, and TIM characterization activities. Selective unused balls are sequentially connected together for daisy-chain applications.
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SF6 Density Meter Tester
JHMD-1
Xiamen Jiahua Electrical Technology Co.,Ltd
JHMD-1 is a smart tester. By using high accuracy core units, pressure sensor, A/D, D/A transducer, 32 bit ARM MCU and TI company’s high speed signal chip, it can automatically calibrate the density relay, measure pressure at signal activity temperature, convert pressure from any temperature to 20℃ standard pressure, print test data and save for review. It identifies the fault during the test. The whole procedure is under automatically operation, JHMD-1 is a high accurate, high stable, reliable tester.
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Chip-Type Attenuators
Panasonic Industrial Devices Sales Company of America
Chip-Type Attenuators for high-frequency signal attenuation, level adjustment or matching improvement.
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Chip Test Adapter
SOJ EDO/FPM
Our new addition to the RAMCHECK line provides support for common 20 to 42-pin EDO/FPM DRAM SOJ chips of sizes 256Kx16/18, 1Mx16/18, 8Mx8, 16Mx4, 2Mx8, 4Mx4, 16Mx1, 1Mx4, and 4Mx1.
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Intelligent Stirrer
Model 901
Intelligent chip design. Ability to set and store the stirring rate. Ability to switch between two kinds of stirring speed after pressing “PRM” button.Options of AC and DC. Applied in the field or in the incubator. MoreIntelligent chip design. Ability to set and store the stirring rate. Ability to switch between two kinds of stirring speed after pressing “PRM” button.Range: 0 to 2300 R/M (no load)Nice appearance, transparent coping designused with AC or DC, and a battery low voltage alarmused in lab, in incubator and brought outdoorsEquipped with strut and electrode holder, it can be used as agitating arc-spark standIP54 dustproof and splash proof.
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VS Tool Suite for Virtual Scan Synthesis and ATPG
VirtualScan
VirtualScan is SynTest's solution to combat increase in test data volume and test cycle volume. With VirtualScan (VS) an extremely large number of short scan chains within the SOC can be virtually accessed from outside the chip with a limited number of pins assigned as scan pins.
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Fully Compliant ASi-5 Transceiver ASSP
ASI4U-V5
The ASI4U-V5 is the industry’s first silicon solution to fulfill the ASi-5 (Actuator-Sensor-Interface version 5) standard for industrial network equipment that enables comprehensive Industry 4.0 applications. The ASI4U-V5 ASSP comes with a completely verified and field-proven firmware that fully implements ASi-5. Hence, integration of ASi-5 into any application is very easy, as the complexity of the fieldbus is hidden by the chip and the firmware.
