Chip
Passive or active components test and their interconnected circuitry in silicon or germanium.
See Also: Integrated Circuit, IC
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Product
Scanning Acoustic Microscope
Pulse2
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This industry-leading scanning acoustic microscope provides a universal inspection tool for packaged semiconductor development, production and failure analysis. With the ability to detect air defects as thin 0.05 micron and spatially resolve defects down to 10 microns, the ECHO is perfect for bump detection, stacked die (3D packaging) inspection, complex flip chip inspection and more traditional plastic packages.
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Product
3U OpenVPX High Density Multifunction I/O Board
68CB6
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The 68CB6 is a Configurable Open Systems Architecture™ (COSA®) 3U OpenVPX™ board that is preconfigured with 10 different “inboard” I/O, measurement and communication functions. This Combination-function Board (CB) provides a full suite of some of the most common & useful function interfaces supporting many different applications. The 68CB6 features a wide but dedicated selection of functions: Standard Functionality Discrete I/O (DT1); Successive Approximation Register (SAR) ±100 V Analog-to-Digital (AD); Isolated High Voltage Analog-to-Digital (ADF); ±10 V Digital-to-Analog (DA); Thermocouple (TC1) or Resistance Temperature Detector (RT1); Full-bridge Strain Gauge (SG1); Transmission/gear box Chip Detection and Fuzz Burn (CD1); LVDT-to-Digital linear (LD6) displacement (position) measurement, AC Reference Source output (AC2); CAN bus communication (CB8). The 68CB6 offers unparalleled programming flexibility, a wide range of operating characteristics, and a unique design that eliminates the need for external intermediate circuit considerations such as pull-up resistors or mechanical configuration jumpers. Inboard functions are software controlled and memory addressed, accessed in similar COSA® modular fashion to maintain seamless common NAI Software Support Kit & API/library structures.
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Product
32GB SO-DDR5-5600 2GX8 1.1V SAM
AQD-SD5V32GN56-SB
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SAM Original Chip, PCB: 30μ gold finger, Anti-sulfuration, On-die ECC for Enhanced RAS, Operating Temperature: 0°C ~ 85°C.
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Product
Mezzanine System
5158
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The 5158 Electrical Conversion Module (ECM) provides eight (8) RS-232 outputs and eight (8) RS-232 inputs. Built around Maxim 1488 & 1489 chips for true RS232 levels and voltage tolerance, all outputs come up in the 1, mark or idle state. Electrically this is a negative output voltage, the start bit is always a 0 or a positive voltage level.
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Product
High Temperature Chip Resistors
ERJ-Hxx Series
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Panasonic Industrial Devices Sales Company of America
Panasonic’s ERJ-Hxx Series Automotive Grade Thick Film Chip Resistors feature a maximum Category Temperature of 175°C and a maximum Rated Operating Temperature of 105°C. The ERJ-Hxx Series is AEC-Q200 compliant, ensuring strict quality control standards are in place to enforce optimal quality and reliability. The ERJ-Hxx Series Resistors offer a small size, higher power Resistor alternative that provides enhanced flexibility of PCB design by reducing solder-joint crack risk. This series is ideal for use in automotive, ICT, general industrial applications, and more.
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Product
Electronic Ballast Production Line Tester
UI2000-OK
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• Eight windows for displaying input characteristics, output characteristics, convenient for comparison and analysis. • Frequency response for testing input current up to 1 MHz, suitable for precise testing of various kind of electronic ballast. • High speed testing, finish testing input and output characteristics within 1 minute. • Portable with built-in chip micro-processor, particular suitable for development and spot production. • Parameters, waves and curves of input, output and startup can be printed. • Communicating with PC, special software provided and both Chinese version and English version available. Run in WINDOWS3.2, WINDOW95 or WINDOWS98, nice interface between people and computer, easy to operate.
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Product
Arduino CAN Shield
IFB-10003-INP
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CAN (Controller Area Network) communication has become ubiquitous in industry. It is used in automotive applications (part of OBD and many other datalinks), on-highway trucks (J1939), industrial machinery and instrumentation, and equipment applications (factory automation). This shield is designed to provide a CAN 2.0 front-end interface for 5V Arduino modules (Uno, Mega, etc). The module uses SPI to communicate to the Arduino, and requires an aditional chip select pin. An optional interrupt line to the MCP2515 and two LEDS are also provided. The chip select and interupt lines are selected via zero ohm resistors and have several configuration options for flexibility stacking additional shields. A set of stackable headers is included with this board, not installed. An optional on-board voltage regulator may be used to supply 7.5V to the Arduino's 'Vin' pin (which is regulated to 5V by the Arduino's on-board LDO). The CAN shield regulator supports a wide input range of 9V to 32V. This makes it possible to cleanly build a stand-alone CAN node (remote sensor) without the need for a separate Arduino power supply!
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Product
GO-NR1000 Near-Field Goniophotometer
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Hangzhou Everfine Photo-E-Info Co., LTD
Suitable for LED light source, LED chip, module and other small light source, the principal function includes: spatial light intensity distribution curve, spatial color distribution curve, iso-lux curve, total luminous flux, effective luminous flux, spatial luminance curve, etc.The test data can be saved as IESNA (*.ies), CIBSE (*.cib), EULUMDAT (*.ldt), CIE (*.cie), CEN (*.cen) and other formats, which can be directly used as the input data of international general lighting design software. Spatial luminance data can be imported into near-field lighting generation software to generate light data that can be imported into third parties (TracePro and LightTools).
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Product
8G SO-DDR3-1600 204Pin 512MX8 1.35V ECC Samsung Chip
AQD-SD3L8GE16-SG
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DDR3-1600 ECC SO-DIMM, 204-Pin, 512MX8,Samsung Chip,
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Product
High Performance Netlist Debugging and Netlist Viewing
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GateVision PRO is the third generation of graphical gate-level netlist analyzers and netlist viewers from Concept Engineering. Please check out the Demo Video: Basic Features. Completely rewritten to run on modern 32/64bit platforms, GateVision PRO provides the designer of even the largest chips and SoCs with intuitive design navigation, netlist viewing, waveform viewing, logic cone extraction, interactive logic cone viewing for netlist debugging and design documentation.
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Product
Services
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For over three decades, Teledyne Microwave Solutions has built a strong heritage delivering advanced value added services to the military, space and industry sectors of aerospace. With test capabilities up to 40 GHz, TMS offers chip and wire assembly of products ranging from single die through complex hybrids which can then be submitted to a combination of customer-specified RF and DC testing and environmental screening. TMS offers a complete portfolio of screening and testing services for device sorting, labeling, lead forming and tinning, and tape-and-reel packaging, as well as LAT services on packaged devices or bare-die, including diodes, transistors, and MMICs.
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Product
4G DDR3-1600 240Pin 512MX8 1.35V ECC Samsung Chip
AQD-D3L4GE16-SG
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DDR3-1600 ECC, 240-Pin, Samsung Chip.
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Product
Interface
3508 MMS ECM
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The 3508 Electrical Conversion Module (ECM) provides six (6) RS-232 outputs and ten (10) RS-232 inputs. Built around Maxim 1488 & 1489 chips for true RS232 levels and voltage tolerance, all outputs come up in the 1, mark or idle state. Electrically this is a negative output voltage, the start bit is always a 0 or a positive voltage level.
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Product
Fully Compliant ASi-5 Transceiver ASSP
ASI4U-V5
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The ASI4U-V5 is the industry’s first silicon solution to fulfill the ASi-5 (Actuator-Sensor-Interface version 5) standard for industrial network equipment that enables comprehensive Industry 4.0 applications. The ASI4U-V5 ASSP comes with a completely verified and field-proven firmware that fully implements ASi-5. Hence, integration of ASi-5 into any application is very easy, as the complexity of the fieldbus is hidden by the chip and the firmware.
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Product
MIS Capacitors
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The SemiGen 8000 and 8100 series of MIS Capacitors are available in a wide variety of capacitance ranges and sizes. They are made with prime starting material and consist of an Oxide/Nitride layer that provides low dielectric loss and high standoff voltage. These RF microwave chip capacitor products are available in chip form only.
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Product
Software
SSI-TRES
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Was developed to read and edit Plug and Play Smart Sensors that are compliant to the IEEE 1451.4 Standard. TEDS, or transducer Electronic Data Sheet, is a set of electronic data in a standardized format defined within the IEEE 1451.4 standard. This data specifies what type of sensor is present, describes its interface, and gives technical information such as sensitivity, bridge type , excitation, etc. This information is stored in an EEPROM chip attached to the sensor. By having this chip, the sensor can identify and describe itself to the network and or Smart Load Cell Meter (DPM-3), thereby easing automatic system configuration.
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Product
Capacitors - MNS Series
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Macom Technology Solutions Holdings Inc.
MACOM's chip capacitors are used extensively in commercial and aerospace and defense applications. Our capacitors are designed for long-term reliability and repeatable performance in a variety of hybrid microwave circuit applications operating up through the Ku-band frequency. MACOM’s capacitors have the distinct advantage of higher capacitance per unit area, resulting in smaller chips for a given capacitance.
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Product
Piezo-resistive Accelerometer
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A Piezo-resistive Accelerometer has a stable structure composed on a silicon chip created by the micromachining and semiconductor production technology. A mass and a beam on which a set of the Piezo-resisters are created on the silicon chip. A set of electrical bridged is formed by such Piezo-resistive resisters to generate signals proportional to the applied acceleration.
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Product
Wideband Transceiver IC
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Analog Devices wideband transceiver ICs offer a complete, high performance RF and mixed-signal system on a chip. ADI’s ISM transceivers for short range wireless systems and wideband transceivers for wireless applications such as UMTS, LTE, and 3G/4G are highly integrated and deliver best-in-class performance and significant BOM savings.
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Product
4K UHD Fanless Edge Computer
UBX-110K
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The UBX-110K is a 4K UHD fanless edge computer powered by an Intel® N97 or Core™ i3-N305 processor. Built-in an Intel® N97 or Core™ i3-N305 processor, Built-in a TPM 2.0 chip for data encryption enhancement. Supports triple displays to expand the visible range and provide detailed video content. Supports two M.2 2280 SATA SSD expansions.
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Product
OEM CCD Camera
Syncerity BI-NIR Camera
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The TE-cooled back illuminated 2048 x 70 CCD Camera combines affordability, performance and versatility for OEM applications. With peak QE of 84% @ 700nm and 20% at 1050nm, Syncerity BI-NIR offers a relatively broad response and addresses multiple applications. In the near-NIR, this detector is a much lower cost alternative to a deep depleted CCD, with no etaloning. Syncerity’s flexible design allows our OEM-dedicated team to quickly adapt the camera for industrial requirements, ranging from alternate CCD chips to electronics
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Product
16GB DDR5-5600 2GX8 1.1V SAM
AQD-D5V16GN56-SB
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SAM Original Chip, PCB: 30μ gold finger, Anti-sulfuration, On-die ECC for Enhanced RAS, Operating Temperature: 0°C ~ 85°C.
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Product
2000-6000W AC power source
CX-P2KW
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Shenzhen Chuangxin Instruments Co., Ltd.
The AC power source is made by adopting microcomputer processing chip and high power device. It provides a stable pure sine wave and has voltage, over current, over temperature, overload protection. It can output 0-300V adjustable voltage, and 45-70Hz adjustable frequency as well as fixed frequency as 50 Hz or 60 Hz, 100 Hz and 200 Hz and 400 Hz. This AC power source can simulate power grid of different countries, provide a stable voltage, frequency, waveform which can be used to test and age the exprot products and provide kinds of precision tests for laboratory, measuring room, etc.
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Product
Thyristors Application Specific Devices
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A.S.D. (Application Specific Discretes) technology is a vertical integrated power technology using a full planar process. By applying the masking process on both sides of the chip, higher current density is achievable than is possible with epitaxial base or horizontal structures.
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Product
Embedded Development Kit
TySOM
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The TySOM Embedded Development Kit is for the embedded designer who needs a high-performance RTL simulator/debugger for their embedded applications such as IoT, Factory Automation, UAV and Automotive. The kit includes Riviera-PRO Advanced Verification Platform and a Xilinx Zynq development board that contains single Zynq chip (FPGA + Dual ARM Cortex-A9), memories (DDR3, uSD), communication interfaces (miniPCIe, Ethernet, USB, Pmod, JTAG) and multimedia interfaces (HDMI, audio, CMOS camera).
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Product
Wafer Sorter and Inspection
SolarWIS Platform
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Eliminating the opportunity for problematic wafers to enter cell manufacturing lines greatly improves output and yield. ASM AE’s wafer sorter features 3D area inspection capability to inspect wafer thickness, total thickness variation (TTV), saw marks, as well as wafer bow and warpage. SolarWIS also includes modules that can inspect for stain, geometry, micro-cracks, edge chips, resistivity, P or N conductivity and lifetime.
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Product
EUV Lithography
NXE systems
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NXE lithography systems are used in high-volume manufacturing of advanced Logic and Memory chips. The first systems to use ASML’s novel 13.5 nm EUV light source, they print microchip features with a resolution of 13 nm, which is unreachable with deep ultraviolet (DUV) lithography. Chipmakers use our NXE systems to print the highly complex foundation layers of their 7 nm, 5 nm and 3 nm nodes. Read about how EUV lithography went from imagination to reality.
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Product
Emulation Platform
Veloce
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The Veloce® Emulation Platform dramatically reduces risk in the verification of today’s complex SoCs and is a core technology in the Mentor Enterprise Verification Platform™ (EVP). Mentor’s software and application solutions and continual enhancements enable a comprehensive verification environment for IP, chip, and system level verification.
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Product
Rectifier Diodes
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Chip Diodes from Bourns has emerged that offers the capability to provide a silicon diode with minimal packaging overhead. The small signal 0603, 1005 and 1206 Chip Diodes are lead free with Cu/Ni/Au plated terminations while the other packages (SMA, SMB, SMC, 1408, 1607, 2010, 2419, 8L NSOIC, 16L NSOIC, SOT23, SOT23-6, 16L WSOIC) use 100% Tin terminations. All Bourns® diodes are compatible with lead free manufacturing processes, conforming to many industry and government regulations on lead free components.
