Chip
Passive or active components test and their interconnected circuitry in silicon or germanium.
See Also: Integrated Circuit, IC
-
Product
Arduino CAN Shield
IFB-10003-ANP
-
CAN (Controller Area Network) communication has become ubiquitous in industry. It is used in automotive applications (part of OBD and many other datalinks), on-highway trucks (J1939), industrial machinery and instrumentation, and equipment applications (factory automation). This shield is designed to provide a CAN 2.0 front-end interface for 5V Arduino modules (Uno, Mega, etc). The module uses SPI to communicate to the Arduino, and requires an aditional chip select pin. An optional interrupt line to the MCP2515 and two LEDS are also provided. The chip select and interupt lines are selected via zero ohm resistors and have several configuration options for flexibility stacking additional shields. A set of stackable headers is included with this board, not installed. An optional on-board voltage regulator may be used to supply 7.5V to the Arduino's 'Vin' pin (which is regulated to 5V by the Arduino's on-board LDO). The CAN shield regulator supports a wide input range of 9V to 32V. This makes it possible to cleanly build a stand-alone CAN node (remote sensor) without the need for a separate Arduino power supply!
-
Product
X-Ray Inspection System
MX1
-
Manncorp’s new MX1 is a high-performance x-ray inspection system designed for real time imaging of multilayer PCBs and dense metal BGAs, μBGAs, and chip scale packages. Its high voltage (80kV), computer-controlled x-ray tube and 35 μm focal spot provide the power necessary for detection of a variety of defects including bridging, voids, and missing balls. The MX1’s standard camera features continuous zoom magnification from 4X to 50X and variable angle viewing up to 45°, and an upgrade to the x-ray tube can boost magnification to 225X.
-
Product
Electronic Inspection Systems
-
Intego's knowhow even makes it possible to identify challenging defects that may be located under the surface. One system is the inspection of chips by means of lock-in thermography, which visually represents the IR radiation intensity signal of electronics. Special lasers and flash lamps generate a very short heat impulse (10 ms) on the chip, which generates a measurable heat flow. In most cases, a resolution of < 1 μm can be achieved.
-
Product
RTOS
LynxOS
-
The embedded market is exploding with the dawn of the “Internet of Things”. The basic idea being that almost everything will ultimately be connected to the internet and these embedded devices are becoming more complex. This means they need to run more full functioned operating systems, with connectivity and popular human interfaces, require more processing power, including multi-core chips, and are likely to be exposed to the same types of cyber attacks that we are facing in our corporate and personal computers.Lynx Software Technologies addresses these needs with our high performance LynxOS operating systems and tools based on open standards. Our new powerful RTOS security features allow embedded developers to design their systems to be more secure before they are connected to the internet.
-
Product
16G SO-DDR4-3200 1GbX8 1.2V SAM -40~85C
AQD-SD4U16N32-SEW1
-
DDR4 3200Mhz Unbuffered SO-DIMM, 30u" Gold Plating Thickness, Anti-sulfurization resistance. 1.2V power consumption, Samsung original chip, wide temperatures from -40° to 85°C.
-
Product
On-Off Controllers
-
The STM6600 and STM6601 smart push-button on/off controller chips offer protection for battery-operated devices in many ways. These include minimizing the risk of powering up without sufficient battery energy to complete the sequence, which can damage the system. It can also prevent power-up if it detects a fault in the power supply.
-
Product
Advanced SoC Test System
3680
-
The Chroma 3680 is an advanced SoC test system with data rate up to 1Gbps. The Chroma 3680 is capable of conducting parallel tests on multiple chips to meet the digital and analog IC testing requirements, with applications including MCU, digital audio, digital TV, set-top box, DSP, network processor, field programmable gate array (FPGA) and consumer electronics.
-
Product
Ultrasound Pulser ICs And HV Multiplexers
-
ST's Ultrasound Imaging IC Solutions offer a complete range of integrated high-voltage transmitters from quad and octal, to the latest device, the state-of-the art STHV1600 ultrasound pulser IC, to high-voltage multiplexer IC, the STHV64SW, a 64-channel, high voltage analog independent switches. ST’s proprietary BCD6s-SOI and BCD8sSOI process technologies enable the combination of low-voltage CMOS logic, precise analog circuitry, and robust power stages on the same chip, offering unprecedented level of integration.
-
Product
BGA SMT Adapters
Giga-snaP™
-
Giga-snaP™ 0.75, 0.8, 1.0, and 1.27mm pitch BGA Surface Mount Feet Adapter line of products provide an inexpensive and reliable method for attaching BGA chips to target board. The product line consists of patented female sockets with machined pins epoxy over-molded into an assembly that matches a particular BGA pattern. The epoxy over-molded female BGA socket is soldered to a PCB using standard soldering methods. A corresponding male pin BGA adapter, to which the user attaches their BGA chip, is plugged into the female socket on the board thus interconnecting the chip and the system is ready to go. The SMT adapters have the same solder ball types as the chips they are emulating. These adapters have less than half of the insertion force of competitive adapters, shorter electrical path for highest speed, and can be solder reflowed numerous times. A complete description and drawings of Giga-snaP™ 0.75, 0.8, 1.0, and 1.27mm pitch BGA Surface Mount Feet Adapters can be found at the tables shown below.
-
Product
32GB DDR5-5600 2GX8 1.1V SAM
AQD-D5V32GN56-SB
-
SAM Original Chip, PCB: 30μ gold finger, Anti-sulfuration, On-die ECC for Enhanced RAS, Operating Temperature: 0°C ~ 85°C.
-
Product
100 High Speed Programmer
Commander Accelerator
-
The Commander High Speed Programmer (HSP) is low overhead system designed to test Flash Memories, PLA's and Micro-controllers. The parallel multi-module architecture provides the flexibility to program and test multiple devices. It's full-featured capabilities support chip erasing and programming, sector erasing and programming, sector protect and unprotect, and data verification functions.
-
Product
Chip Rings
-
Panasonic Industrial Devices Sales Company of America
Extremely robust Chip Rings for signal measuring terminals featuring a metal sheet structure for high reliability.
-
Product
32GB ECC SO-DDR5-5600 2GX8 1.1V SAM
AQD-SD5V32GE56-SB
-
SAM Original Chip, Anti-sulfuration, PCB: 30μ gold finger. Independent Power Management IC build-in, ECC function support.
-
Product
Digital Tachometer
KM- 2234BL / KM 2235 B / KM 2241
-
Kusam Electrical Industries Limited
Digital Tachometer uses latest technology for accurate measurements. It has Exclusive one chip of Microcomputer LSI Circuit, It is housed in tough ABS case & has ergonomic design for easy holding in the hand.
-
Product
Battery Management Chip Module
Sentinel
-
The first single system on chip module. Measures cell voltage, cell internal temperature and cell impedance.
-
Product
Radio Module (2x2)
SX-PCEAC2
-
The SX-PCEAC2 is powered by Qualcomm Atheros radio chip, the QCA6174-5, which features 2x2 wave 2 MU-MIMO technology. It is a dual-band 802.11 a/b/g/n/ac module with Bluetooth support which is designed for devices that require wireless connectivity in a small form factor combined with high performance with throughputs reaching up to 867Mbps.
-
Product
4G SO-DDR3-1600 512X8 1.35V SAM -20~85℃
AQD-SD3L4GN16-SGH
-
SAM Original Chip, Industrial Design for Improved Reliability, PCB: 30μ gold finger, Anti-sulfuration, Semi Wide-temp Support -20~85℃.
-
Product
Low Light USB Camera Board (Color)
See3CAM_CU30 - 3.4 MP
-
See3CAM_CU30 is a 3.4 MP UVC-compliant Low Light USB camera board based on AR0330 sensor from ON Semiconductor®. This Low Light Board Camera is backward compatible with USB 2.0 and supports compressed MJPEG formats at frame rates equal to USB 3.0. This sensor enables a superior low light performance. It has a dedicated, high-performance Image Signal Processor chip (ISP) that performs all the Auto functions (Auto White Balance, Auto Exposure control) in addition to complete image signal processing pipeline that provides best-in-class images, videos and the MJPEG compressions.
-
Product
Cryogenic Temperature Sensors
Cernox®
-
Cernox® thin film resistance cryogenic temperature sensors offer significant advantages over comparable bulk or thick film resistance sensors. The smaller package size of these thin film sensors makes them useful in a broader range of experimental mounting schemes, and they are also available in chip form. They are easily mounted in packages designed for excellent heat transfer, yielding a characteristic thermal response time much faster than possible, with bulk devices requiring strain-free mounting. Additionally, Cernox sensors have been proven very stable over repeated thermal cycling and under extended exposure to ionizing radiation.
-
Product
USB-8452, 3.3 MHz I2C, 50 MHz SPI I2C/SPI Interface Device
781964-03
-
The NI USB‑8452 is a master interface for connecting to and communicating with inter-integrated circuit (I2C) and serial peripheral interface (SPI) devices. With plug‑and‑play USB connectivity, the USB‑8452 is a bus-powered, portable solution to communicate with consumer electronics and integrated circuits. It also includes eight general-purpose digital I/O lines for a variety of applications, such as configuring the address of I2C devices, toggling LEDs, or strobing convert and data ready lines common to analog converter chips. You can physically place the USB‑8452 more closely than PCI interfaces to I2C/SPI devices, which reduces I2C bus length and minimizes noise problems. Additionally, the interface provides +5 V and GND to power circuits with no external power supply.
-
Product
IR Sensor
-
The sensor measures a very useful 0.17 mm in thickness and is made of plastic. Essentially it is a piece of robust plastic that can be used “bare” – without protective housing, such as a metal casing commonly used by other producers. The sensor it is less than 0.2 mm. thin and it is made using plastic membrane. This configuration makes the sensor so robust it can be used “bare” – without protective housing such as a metal container. Due to the fact thatSince the sensor chip can be used applied bare, means it can be used in a totally new ways, which can re-defines todays the current view on application design and reduces the cost of the entire system, and not just the sensor-element as such.
-
Product
Low Concentration Type HF/HCl/NH3 Concentration Monitor
HF-960M
-
The HF-960M uses sensors that offer outstanding corrosion resistance for high-precision, high-speed measurement of low concentrations of hydrofluoric acid, hydrochloric acid and ammonia, and is thus perfect for single-bath and wafer cleaning. The HF-960M is also an environmentally-friendly product that uses lead-free solder for mounting chips on the PCB.
-
Product
Optical Spectrum Analyzers
-
Thorlabs' Optical Spectrum Analyzers (OSAs) perform highly accurate spectral measurements. Compatible with fiber-coupled and free-space light sources, these compact benchtop instruments suit a wide variety of applications, such as analyzing the spectrum of a telecom signal, resolving the Fabry-Perot modes of a gain chip, and identifying gas absorption lines.
-
Product
Thermal Test Vehicles
TTV
-
Thermal Engineering Associates, Inc.
Using the TTC-1002 Thermal Test Chip as a basis, TEA offers TTVs in flip-chip, bare die, BGA packages for a variety of thermal simulation, reliability, qualification, heat sink characterization, and TIM characterization activities. Selective unused balls are sequentially connected together for daisy-chain applications.
-
Product
32G DDR4-3200 2GbX8 1.2V SAM -40~85C
AQD-D4U32N32-SBW
-
DDR4 3200Mhz Unbuffered DIMM, 30u" Gold Plating Thickness, Anti-sulfurization resistance. 1.2V power consumption, Samsung original chip, 100% tested for stability, compatibility and performance.
-
Product
Molded Interconnect Subtrate
-
A substrate interposes between an IC chip and a motherboard to enable the IC chip to communicate with the motherboard effectively. Typically, the IC chip is attached onto the substrate and assembled into an IC package before connecting to the motherboard. It is an essential part of the IC package and is responsible for a successful packaging process. Also, it plays an important role in making the IC chip to become a real product and a real solution for end customers. In the past years, semiconductor technologies were highly driven by PC applications which follow Moore’s law in technology migration. In recent years, the emergence of mobile applications increasingly, become the main driver in the semiconductor industry. These mobile applications requires a new kind of substrate that have ability for making IC packages with smaller form factor, thin profile, better thermal, mechanical and electrical performance.
-
Product
SMARC® Short Size Module with Intel® Pentium™ and Celeron™ Processor N3000 Series SoC (codename: Braswell)
LEC-BW
-
The LEC-BW Computer-On-Module (COM) combines the SMARC® 1.1 standard with the Intel® Pentium® and Celeron® N-series System-on-Chip (SoC), providing an ideal solution for low power consumption and high performance requirements. The module provides the high integration, high performance, low power, and ruggedness favored by Internet-of-Things (IoT) applications such as retail transactional clients, digital signage, and in-vehicle infotainment systems.
-
Product
6U VME 1/10/40 GbE Switch
ComEth4070e
-
The ComEth 4070e is a cutting-edge 6U Layer 2/3 Ethernet switch for VME64x systems. Powered by the newest Marvell highly integrated system-on-chip (SoC) with programmable packet processors.
-
Product
802.11b/g/n Radio/Baseband (SiP)
SX-SDPGN
-
The Silex SX-SDPGN (Qualcomm Atheros AR6103) is a third generation wireless LAN solution, featuring 802.11n. Based on the game-changing AR6003 Wireless LAN chip, the SX-SDPGN brings 802.11n throughput, range and power eficiency to portable devices including patient monitors, printers, handheld terminals and more.
-
Product
16GB DDR4-3200 1GbX8 1.2V Samsung Chip
AQD-D4U16GN32-SE
-
16GB, Speed 3200MHz, 30u" Gold Plating Thickness, Anti-sulfurization resistance, Unbuffered.
