Wafer Inspection
Inspection of integrated circuits in wafer form for contaminants, flatness, size, and roughness.
See Also: Wafer, Wafer Thickness, Wafer Failure Analysis, Wafer Edge, Wafer Resistivity, Wafer Mapping, Wafer Probes, Wafer Probers, Wafer Handlers
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Product
Property Inspection Solution
DJI / IMGING
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Advanced DJI drone solutions for the P&C Insurance industry. IMGING™ to conduct full roof and property inspections with incredible detail in as little as ten minutes from start to finish, and they’re getting high-resolution, actionable data they can use to make informed decisions. By combining Insurance-focused workflows and patents-pending autonomous flight control technology, IMGING is making roof inspections safer, quicker, and more consistent. It’s deceptively simple, amazingly powerful, and built specifically for Insurance.
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Product
High Speed Solder Paste Inspection
VisionPro HSi
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The VisionPro HSi offers high speed solder paste inspection. Utilizing the most advanced high resolution staging and sensor technologies, the VisionPro HSi provides the accuracy and reliability needed to compliment your overall screen print process improvement strategy.
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Product
X-Ray Inspection System
TruView™ Cube
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The Perfect Solution for a Powerful Small Form Factor X-ray Inspection System. The all new TruView™ Cube X-Ray Inspection System is a fully motorized radiography system developed to meet the stringent requirements of electronics assembly and component inspection. Ideal for applications where space is premium, the the TruView™ Cube X-Ray sits comfortably on your laboratory bench.
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Product
Solder Past Inspection
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From the innovative Z-Check 3D through to the entry level Z-Check 100 the entire range has been designed to provide accurate pad specific measurement of solder paste deposits, adhesives and component placement. Amongst its other features the Z check software comes with the convenience of a full SPC package as standard.
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Product
Portable gear inspection- and 3D-measuring systems
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ultimate independent measurement - on the production machine or on the shop-floor without rotary table
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Product
Laser Sherography NDT Sensor for Post-Production Quality Control or In-Field Component Inspections
FlawExplorer
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The FlawExplorer is a laser shearography NDT sensor designed to be used for post-production quality control applications or in-field (in-service) component inspections. Depending on the application, the sensor can be configured with thermal or vacuum (partial) excitation systems and may also be automated. It incorporates the very latest in phase-shifting technology delivering accurate and reliable measurement results through clear and sharp imaging with sub-micrometer displacement resolution.
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Product
High-Accuracy Automated Optical Inspection Systems
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Fully-automated and high-accuracy 3D inspection and measurement systems. High-power, long working distance optics and high-resolution digital camera are perfect for high-magnification applications. These are full-color systems capable of high-accuracy measurements, automated defect detection and color verification.
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Product
Automatic Flight Inspection System
AT-920DG
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Airfield Technology is pleased to announce the availability ofa new product, the AT-920DG Automatic Flight InspectionSystem.The new AT-920DG system combines the unique groundbasedinspection capability of our original AT-920 with theproven DGPS positioning system and WinFIS flight inspectionsoftware from our larger, dual equipment AT-930DG system.
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Product
Inline 3D-CT Automated X-ray Inspection Systems (3D-AXI)
3Xi Series
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Saki's 3D-AXI (X-Ray) series adds significant inspection capability. The system utilizes Planar Computed Tomography (PCT) providing high precision CT imaging at high speed.
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Product
X-Ray Inspection System
MXI Ruby XL
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Designed for the largest PCBs, Ruby XL allows 96 x 67 cm (37.9” x 26.4”) areas to be inspected non-destructively, with feature resolution up to 0.5 µm.
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Product
Non-Destructive Resonant Inspection Drop Test Fixture
RAM-DROP
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The Drop Test Fixture, Model RAM-DROP, Resonant Inspection System, allows automated sorting and quality testing of small metal injection molded (MIM), powder injection molded (PIM), additively manufactured, and other small parts by using the Resonant Acoustic Method (NDT-RAM).
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Product
Solder Paste Inspection Machine
3D SPI
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The 6500 series is the measurement equipment provided by Jiezhi Technology for the small pads of solder paste printed on the PCB board. It will cause defects such as sharpness, offset, more tin, and less tin printing during solder paste printing. Causes defects in the later stage of production, this equipment can find problems in advance
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Product
Ambient Temperature Vacuum Wafer Chucks
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6" (152mm) Vacuum Wafer Chuck for General Purpose Ambient Temperature testing with a Stainless Steel vacuum wafer surface
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Product
Thickness and Flaw Inspection
OmniScan SX
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Olympus is proud to introduce the OmniScan® SX, a flaw detector that benefits from more than 20 years of phased array experience and shares the OmniScan DNA. For improved ease of use, the OmniScan SX features a new streamlined software interface displayed on an 8.4 in. (21.3 cm) touch screen. A single-group and non-modular instrument, the OmniScan SX is easy to operate and cost-effective for less demanding applications.
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Product
First Article Inspection Machine
Optima III FAI
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Landrex Technologies Co., Ltd.
First Article Inspection Machine
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Product
Automated Optical Inspection
AV871 Series
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The AV871 Series of AOI solutions from ASC International builds upon the industry leading AV862 Series with the addition of a larger platform to manage oversized boards. Accepting boards as large as 22" x 26", the AV871 Series meets the needs of those companies requiring large board capacity.
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Product
3D Inspection Software
Metrolog X4
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Metrolog X4 architecture is designed not only to benefit from current computer and OS technologies (Windows 64-bit, and multiprocessor PCs) that significantly increase the performances and throughput of your Metrology software, but is also aimed at simplifying your day-to-day measurement work. Metrolog X4 is a perfect Point Cloud software able to analyze large data size. High Performances in Point Cloud analysis: Large Data file import (CAD files, Point clouds, ...)
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Product
Inspection Cameras
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The inspection camera opens a new view into the insides of machines and systems; whether an endoscope, thermal imaging camera or infrared thermometer - an inspection camera is the ideal instrument for monitoring and maintenance.Due to the flexible control of the endoscope or the visual display of potential damage areas in machines or systems, weaknesses and points of failure can be detected and therefore be prevented. The inspection camera make this possible without the need for complex disassembly.The inspection camera is used by electricians, safety experts, expert witnesses, mechatronics, and mechanics. The inspection camera is also used for apprenticeships and in-service training. An inspection camera can be applied internally as well as at school or at universities for demonstration purposes. With their help, inspections in the industrial sector can be organized considerably faster, more targeted and more cost-efficient. An inspection camera is an important companion in the course of everyday work.
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Product
Inspect a Large Range of Part Geometries
ECHOMAC® PA Composite Tester
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ensures complete inspection of the part. The system is scalable, allowing the flexibility of adding channels as needed to handle a large range of part geometries. Meets or exceeds USA, European and other international specifications in aerospace and automotive industries. MAC can supply mechanics designed to meet customer requirements ranging from inline bubbler systems to stand alone immersion tanks with part placement.
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Product
Fully Automatic 4 Point Probe System for Silicon Wafer
WS-8800
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*Measurement of resistivity, thickness, conductivity(P/N) and temperature*Tester self-test function, wide measuring range*Thickness, measurement position and temperature correction function for silicon resistivity*Number of cassette station can be changed by customers request*Host (CIM) communication and SMIF or FOUP compatible
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Product
Bond Inspection
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Increasingly thin wires, finer pitches, as well as more applications of thick wire for higher capacities are among the current trends in wire bonding. At the same time, the requirements for robust and defect-free bonds are increasing, for example in assistance systems in the automotive sector and in RF modules in the 5G mobile communications network. This makes reliable inspections extremely important.
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Product
Solar Wafer Transfer Tool
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Dou Yee Enterprises (S) Pte Ltd
Dou Yee Enterprises Solar Wafer Transfer Tool
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Product
Packaged Food X-ray Inspection System
EPX100
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Our revolutionary new x-ray system is so advanced it will not only improve your product safety and meet regulatory compliance but also will optimize and streamline your product inspection.
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Product
Video Inspection Station
VIS300
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Video Inspection Stations are available with?or without on-screen measurement capabilities?and offer?an excellent way to evaluate or test small works or items in?difficult to access locations.? As todays electronic and mechanical systems keep getting smaller, it becomes impossible to test or measure these products with traditional methods. For many applications, from development to production testing, video based inspection can help maintain quality control. Many of these systems are used in labs for development or used in production for testing production samples.
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Product
Inspection Microscope
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This compact, lightweight and ergonomic Inspection Microscope is specifically designed for inspecting ferrule and fibre end faces in the field or the laboratory. The microscope provides dual-illumination, both coaxial and oblique; to produce the highest-quality image detail and superior view of fibre end face cleanliness and core condition.
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Product
High-speed 3D Solder Inspection Machine
YSi-SP
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a high-speed 3D solder paste inspection machine that enables high-speed high-accuracy inspections based on our “1-head solution” concept for using a single type of head to handle various inspections. It is used to inspect the printing quality (volume, height, area, misalignment) of solder paste after it has been printed onto PCBs. Available April '18.
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Product
Inline Wafer Testing
IL-800
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Pre-process elimination of low-quality wafers using measured lifetime, trapping, and resistivity. Process control and optimization at dopant diffusion and nitride deposition steps.
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Product
Measuring And Inspection Systems For Rubber And Tires
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The rubber processing industry, as well as the tire production process is supported by Micro-Epsilon with a range of systems for inspection, monitoring and control of miscellaneous processes.





























