Wafer Resistivity
See Also: Wafer, Wafer Thickness, Wafer Failure Analysis, Wafer Edge, Wafer Mapping, Wafer Probes, Wafer Probers, Wafer Inspection, Four Point Probes
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Product
Semiconductor Metrology Systems
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MTI Instruments'' semiconductor wafer metrology tools consist of a complete line of wafer measurement systems for virtually any material including Silicon wafer (Si), Gallium Arsenide wafer (GaAs), Germanium wafer (Ge) and Indium Phosphide wafer (InP). From manual to semi-automated wafer inspection systems, the Proforma line of wafer metrology inspection tools is ideal for wafer thickness, wafer bow, wafer warp, resistivity, site and global flatness measurement. Our proprietary push/pull capacitance probes provide outstanding accuracy throughout their large measurement range, allowing measurement of highly warped wafers and stacked wafers. MTII''s solar metrology tools include off line manual systems for wafer thickness and Total Thickness Variation (TTV), as well as, in-process measurement systems capable of measuring wafer thickness, TTV and wafer bow at the speed of 5 wafers/second.
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Product
Hand Held Probe Type Eddy Current Sheet Resistance/resistivity Measurement Instrument
EC-80P (Portable)
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*Auto-measurement start by probe head contacting to sample*3 measurement modes for wafer resistivity, bulk resistivity and sheet resistance*Easy set up to measurement condition by JOG dial*5 types of model for each measuring range*Resistivity probe can be changed by sample’s resistivity range
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Product
High Resistance Measurement Universal Adapter
N1414A
High Resistance Measurement Adapter
N1414A High Resistance Measurement Universal Adapter is used to simplify the connection for high resistance measurements by B2980A series electrometer.
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Product
Resistivity Cell For N1413 (50 Mm Electrodes)
N1424A
Resistivity Cell
The N1424A is designed to operate specifically with the B2985B/87B Electrometer/High Resistance Meter. It is used to measure surface or volume resistance/resistivity of insulation materials. The N1413A High Resistance Meter Fixture Adapter is required to connect the N1424A to the B2985B/87B.
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Product
Resistivity Cell For N1413 (26/50 Mm Electrodes)
N1424B
Resistivity Cell
The N1424B is designed to operate specifically with the B2985B/87B Electrometer/High Resistance Meter. It is used to measure surface or volume resistance/resistivity of insulation materials. The N1413A High Resistance Meter Fixture Adapter is required to connect the N1424B to the B2985B/87B.
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Product
Contactless Wafer Gauge for Resistivity, Thickness
MX 60x
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The MX60x series measure Resistivity or Sheet Resistance of silicon and other materials.
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Product
Wafer Test
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WinWay’s commitment to technology, quality and service ensures our interface solutions go above and beyond to exceed your expectations. Our products and services have a proven track record of delivering customer success in semiconductor testing. The Company offers comprehensive test interface solutions ranging from wafer-level test, package-level test to thermal management.
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Product
4-Probe Resistivity and Resistance Tester
HS-MPRT-5
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t used for measuring resistivity of silicon rods and wafers, and sheet resistance of diffused layers, epitaxial layers, LTO conductive films and conductive rubbers, etc.
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Product
Wafer & Die Inspection
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SemiProbe wafer inspection system (WIS) examines, locates and identifies defects created during wafer manufacturing, probing, bumping, dicing or general handling. This provides microelectronic device manufacturers with accurate, timely quality assurance and process information. The WIS has single sided and double sided wafer mapping capabilities and can improve efficiency, reduce manufacturing costs, increase yields and shorten time to market.
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Product
Inline Wafer Testing
IL-800
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Pre-process elimination of low-quality wafers using measured lifetime, trapping, and resistivity. Process control and optimization at dopant diffusion and nitride deposition steps.
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Product
Wafer Inspection Products
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Sonix provides manual and automated wafer inspection and metrology systems for wafers ranging from 100mm to 300mm, with extensive analysis capabilities at both the wafer and device level. These industry-leading automated wafer inspection systems are used by the world’s top manufacturers to ensure quality from development through production.
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Product
Wafer Bonder
AML
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Wafer bonding has found many applications in the field of MST, MEMS and micro engineering. These include the fabrication of pressure sensors, accelerometers, micro-pumps and other fluid handling devices. The process is also used for first-order packaging of silicon microstructures to isolate package-induced stresses. The OAI AML Wafer Bonder facilitates both the alignment and bonding to be performed in-situ, in a high vacuum chamber. For anodic bonding the wafers are loaded cold and heated in the process chamber. For high accuracy alignment the wafers are aligned and brought into contact only after the process temperature has been reached, thus avoiding differential thermal expansion effects which can compromise alignment. The AML Wafer Bonder is excellent for anodic bonding, silicon direct and thermal compression bonding applications. These features enable the bonder to be used with virtually any processing tool.
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Product
Stand Alone Wafer Sorter
MicroSORT
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The Microtronic MicroSORT semiconductor wafer sorter is designed to maximize throughput while minimizing wafer handling in a user-friendly operating environment. This stand-alone semiconductor wafer sorter enables sophisticated semiconductor wafer sorter routines for up to 4 wafer-cassette platforms. MicroSORT semiconductor wafer sorter reads OCR scribes from the top, bottom, or simultaneously, allowing for enhanced semiconductor wafer tracking and sorting. The MicroSORT semiconductor wafer sorter’s basic functions include the ability to move, compress, randomize, find, align, verify, and split semiconductor wafer lots. With our virtual tweezer mode, an operator can click on wafer icons to move wafers between cassettes, read semiconductor wafers, and swap wafer positions.
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Product
Resistance Measurement
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Precision resistance measurement equipment for a range of applications. Specialist units measure down to fractions of a micro-ohm with high accuracy.
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Product
Bare Wafer Inspection System
LS-6700
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Hitachi High-Technologies Corp.
High sensitivity (50nm:Bare). High accuracy for COP/CMP discrimination (85%). High throughput (80 wph @300mm).High positioning accuracy (+/-30m). Wafer Size 300mm / 200mm.
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In-Process Wafer Inspection System
7945
System
Chroma 7945 wafer chip inspection system is an automated inspection system for pre and post diced patterned wafers. Change kits enable switching between various applications by allowing different carriers including metal frame or grip ring.
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Product
Earth Resistance & Resistivity Meter
MRU-200
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MRU-200 is the only meter in the market which uses all measurement methods.Possible measurements:- earth resistance measurment with 2-pole, 3-pole,4-pole method,- impulse earth resistance measurement, two kinds of measuring impulse 4/10s, 10/350s,- earth resistance measurement without disconnecting measured earths (using clamp),
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Product
Resistivity Meters
SSR-MP-ATS
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Integrated Geo Instruments & Services Private Limited
The instrument design incorporates several innovative features and advanced techniques of digital circuitry to make it a reliable Geophysical tool providing high quality data useful for mineral and groundwater exploration and any other Geophysical applications. The SSR-MP-ATS sends the entire current into the ground without wasting power for constant current generation thus increasing the signal strength to probe deeper layers.
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Product
Wafer Chucks
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American Probe & Technologies, Inc.
High Performance Chuck for your needs Introducing the American Probe & Technologies’ HC-6000 series of thermal chucks,
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Product
Wafer ESD Tester lineup
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Hanwa Electronic Ind. Co.,Ltd.
◆Correspond to 300mm Wafer. This tester can measure LED or the large sizes Wafer, such as a system LSI. And Zap of HBM/MM can be performed. The Automatic destructive judging by V/I measurement can also be performed after Zap.◆Waveform guarantee in Zap needles. HED-W5100D carries out the calibration before shipment in the place of Zap needles. Therefore, Correlation of the Result of a Package Device becomes clear easily.◆Correspondence to Standards This Tester corresponds to the Standard of JEITA, ESDA, and JEDEC. A Zap unit adopts the plug-in system and also has the waveform of Customer's requests.◆Connection with TLP This Tester is the best for TLP Testing with deep relation of ESD. The protection circuit of a device with an ESD problem is investigated.
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Product
Non-contact Sheet Resistance /resistivity Measurement Instrument
EC-80
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*Easy operation and compact design*Auto-measurement start by inserting a wafer under the probe*Easy set up to measurement condition by JOG dial*5 types of model for each measuring range
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Product
Wafer Test
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Based on the reliability test, CSE conducts the test of the IC chip through electrical signals to the semiconductor wafer. We provide various Test Solutions according to the needs of designers/manufacturers. by sorting out good and bad products.
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Product
Wafer Internal Inspection System
INSPECTRA® IR Series
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An infrared internal defect inspection system has been added to the INSPECTRA® series.It is now possible to inspection with both infrared and visual light in one system.
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Product
MultiSite Test sockets and Wafer Level
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multi-site sockets include anything from strip test sockets to test sockets for wafer test to multi-position, singulated devices. The advantages of these sockets can be enormous as test time can be decreased by a factor of ten over conventional one up testing. In most cases, the throughput is only limited by tester capabilities and/or handling capacity.
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Wafer Prober
Prexa MS
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The latest fully automated 300mm wafer prober for memory devices. Featuring high rigidity and exceptional thermal control, the system enables full-wafer contact testing.
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Resistance Wire Bonding
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Electronic Systems of Wisconsin, Inc.
ESW's Resistance Wire Bonding System comes equipped with the latest features the market has to offer. Our system is capable of bonding armatures, stators or coils. The on-screen display in our bonder makes it easy to read, track, and record your bonding data. If desired, ESW offers complete electrical testing of the part prior to the bonding sequence as well. This ensures only good parts that have been electrically tested are processed through bonding. It is our duty to make sure you never have to worry about losing important information again. Our Sales and Engineering staff will work closely with you to make sure that a bonding systems will meet your needs. See the slideshow below to see some of our Resistance Wire Bonding Testers.
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Product
WAFER MVM-SEM
E3300 Family
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The E3310 is a WAFER MVM-SEM* for next generation wafers, supporting 1Xnm node process development and volume production at the 22nm node and beyond. With its high-speed carrier system employing a dual arm vacuum robot, and low-vibration platform to improve measurement accuracy, the E3310 delivers high throughput and performance for wafer measurements. Its multi detector configuration and unique 3D measurement algorithm also enable stable, high-accuracy measurement of 3D transistor technologies such as FinFET. The E3310 makes a significant contribution to reducing process development turnaround time and improves productivity for next-generation devices.
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Sheet Resistance Measurement
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The Filmetrics® R54-series and R50-series sheet resistance measurement instruments have been developed based on over 45 years of KLA sheet resistance measurement innovation. The R50 measures metal layer thickness, sheet resistance and sheet conductance. The R54-series adds a light-tight enclosure, along with 300mm support, to provide metal thickness measurement solutions for semiconductor and compound semiconductor manufacturing.
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Product
Resistive Current Tester
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Weshine Electric Manufacturing Co., Ltd
Long Distance Digital Zinc Oxide Arrester Resistive Current Safety Testing Set
