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Air Humidity Meter
Since air humidity is an important factor in many sectors including but not limited to manufacturing, agriculture, construction, restoration, remediation and heating, ventilation and air conditioning (HVAC), PCE also carries a number of air humidity meter devices designed for specific applications such as evaluating heat stress risk in hot work environments like boiler rooms, factories, construction sites and commercial bakeries. To accurately assess heat stress risk, an air humidity meter capable of detecting and classifying temperature in relation to the amount of moisture content in the air is recommended. The global standard description for heat stress is the Wet Bulb Globe Temperature Index (WBGT).
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Pull Out Device
BCL-1
This Pull out device BCL-1 is designed and manufactured according to relevant standard requirements of IEC884-1/ GB2099.1-2008 and other electrical accessories standards, Mainly used to test the needed maximum force when the plug pull out from socket and the minimum force when single stage plug pull out from socket, and to inspect whether the socket can withstand the lateral stress imposed by electric plug into the socket. This device is applied to plugs and sockets which rated voltage no more than 250V and rated current no more than 16A.Specifications: • Weights: 36N*1, 5.4N*1, 5N*2, 4N*1, 2.6N*1; • Standard testing plug: each one for Dipolar 10A, tripolar 10A and 16A • Standard test bolt: Each one for 1.5N and 2N • 1 set of clamping device • 1 set of Weights tray • Lateral stress weights 5N*1 • 1 set of lateral stress bar
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Copper Diffusion TestSystems
Materials Development Corporation
MDC announces the addition of software and hardware for copper diffusion studies to its CSM/Win suite of semiconductor test systems and software. This new CSM/Win feature plays an important part in the development of processes and materials for the next advance in integrated circuit technology that employscopper as a conductor. Special Current-Voltage Bias-Temperature Stress (IV-BTS) software can measure the degradation of insulator quality due to copper diffusion.Multiple test sites can be stressed with a constant voltage while the current through each site is measured and recorded. The Current-Voltage Bias-Temperature Stress test supplements conventional MOS C-V measurements and Triangular Voltage Measurements (TVS) that are also employed in copper diffusion studies.
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Custom Bolt-On Strain Sensors
Our custom bolt-on strain gauge sensors are designed and manufactured to your application, based on your drawings and specifications, including all types of output formats. Ideal for dynamic load monitoring, capable of measuring and monitoring axle stress and weight with high accuracy.Do you have an application for strain gauge measurement that requires a quick and simple installation, repeatedly, in multiple locations? Perhaps you need a sensor with high environmental protection, which removes the necessity for time-consuming cleaning, complicated soldering and messy strain gauge adhesives?
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Stylus Profilometers
Tencor™
KLA Instruments™ Alpha-Step®, Tencor P- and HRP®-series stylus profilometers deliver high-precision, 2D and 3D surface metrology, measuring step height, surface roughness, bow and stress with industry-leading stability and reliability for your R&D and production requirements.
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HALT – Highly Accelerated Life Test
HALT is a process used on electronic assemblies and modules to determine weaknesses and the stress limits of a product by temperature cycling and omni-axial random vibration step stress. Inherent weaknesses in a products design and build are stimulated by applying increasing levels of mechanical stress. Within an accelerated timescale, faults in a product can be realised prior to product release and preventing failures occurring during after-sale user operation, very often during the warranty period.
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Kelvin Test Contactor
ecoAmp
ecoAmp™ Kelvin test contactor has a durable monolithic pin design with low and stable contact resistance. It is a high-power cantilever kelvin contactor with a patented spring and tip design for optimum heat dissipation. This ensures best reliability, long spring life and high yield even under highest current and temperature requirements. Featuring extended Automotive temperature range -60 ̊C to +175 ̊C, capable to stand thermal stress during high-power test. The contact motion is decoupled from the test board.
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Field Simulation Software
QuickField™
QuickField™ is a very efficient Finite Element Analysis package for electromagnetic, thermal, and stress design simulation with coupled multi-field analysis.
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SilverCreek SNMP Tests
Set up in less than five minutes - Windows or LinuxCustomize tests via Wizards, Script Generators, and moreAutomate operation with unambiguous test resultsIntegrate with other test harnesses and test toolsIncludes conformance, compliance, vulnerability, robustness, stress, and performance testingInvestigate failures and quickly resolve them with powerful diagnostic and analysis tools
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ESS Fixture
ESS - Environmental Stress Screening - is not a test. It is a product level screening process. ESS is part of manufacturing process, that verifies the operational parameters and guard bands of a product from an environmental - temperature, shock, vibration - point of view.
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High Voltage Tester For Hair Dryer & Hair Straightner
Every electrical apparatus or machine consists of two distinct sections - one which carries the electricity, and other which is isolated (insulated) from the electric currents. The former may be called the `Live' side whiles the latter `Earth’ side. A person near about the apparatus or handling it can safely touch the Earth side, but not the live side, for obvious reasons. To ensure that the isolation of the two sections is effected properly, the apparatus is tested by subjecting it to a Voltage much higher than the normal working Voltage. If the insulation is good, it stands the test without breakdown otherwise high electrical stress punctures the insulation at its weakest spot foretelling a later calamity to unwary user. Government Department- when buying electrical equipments- and all reputable manufacturers test every piece of equipment by this test called HIGH VOLTAGE TEST. It weeds out poorly insulate apparatus.
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Biased and Unbiased HAST Testing
Considered within the semiconductor industry as the fast and effective alternative to Temperature Humidity Bias testing (THB), Highly-Accelerated Temperature and Humidity Stress Test (HAST) is a critical part of the device package Qualification process and is used to evaluate the reliability of non-hermetic packaged devices in humid environments.
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High Capacity, Mechanically Refrigerated Temperature Chambers
FHC Series
The Bemco FHC Series of high capacity, mechanically refrigerated temperature chambers are designed for rapid temperature cycling, environmental stress screening (ESS), and for handling large thermal loads. Available in both Wide Range, (-73 C to 177 C or -100 F to +350 F) and Narrow Range (-35 C to + 177 C or -31 F to + 350 F) these systems include very large, efficient, and modern cooling and heating systems to allow rapid temperature transitions.
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Composite Salt Spray Test Chamber
Guangdong Test EQ Equipment co., Ltd.
- Multi-Environment Simulation: Replicates accelerated corrosion in marine, industrial, or road salt conditions with cyclic temperature/humidity stress.- Advanced Control: 7-inch HMI touchscreen with 100+ pre-set programs, real-time graphs, and remote monitoring via Wi-Fi/Ethernet.- Durability: FRP (fiber-reinforced plastic) housing, titanium alloy heaters, and quartz heating tubes for resistance to acidic/alkali corrosion.- Eco-Friendly Design: Closed-loop filtration system (recycles 70% of spray solution) and R290/R513A refrigerants (low GWP).- Safety & Maintenance: Leak detection, over-temperature cutoffs, and self-cleaning nozzles to minimize downtime.
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Electrical Creep and Rupture Testing Machine
ECR Series
Jinan Testing Equipment IE Corporation
This series of computer control electronic creep and rupture testing machine is newly designed with full-digital measuring control system to meet the standards of GB/T2039, GB//T20120, EN ISO 204-2009 and ASTM E139 etc. The electronic creep and rupture testing system can perform not simply creep. stress-rupture test and stress relaxation test on metals under room or high temperatures, but also low cycling test & creep fatigue test. The electronic creep and rupture testing machine is widely used for quality control in factories, material research in R&D department and teaching in universities,
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kSA MOS
Measure and provide feedback for curvature, stress, reflectivity and growth rate to improve production processes and increase profitability with the kSA MOS.
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Flammability Test System
COMP0804CAP
Active flammability test system according to IEC 60384-14 Ed4. For testing X & Ycapacitors up to 1uF. The test system includes control of the nominal AC supply via an integrated variac up to 1800V. Impulse amplitudes are programmable up to 8kV which covers all requirements. X1 capacitors are stressed up to 4kV, X2 and Y4 capacitors up to 2.5kV and Y2 capacitors up to 5kV.
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Environmental Testing
Environmental Testing is the evaluation of a product in conditions which simulate the physical environments that may harm or adversely affect the products performance. Environmental testing can play an important role throughout a product's development cycle to ensure that the materials and manufacturing processes can survive the stresses of the environment in which the product is likely to operate. These environments may include high and low temperatures as well as quickly changing temperatures. Also, temperature humidity environments may also be a factor. Environments with an added media such as dust, ice and freezing rain may also have an adverse effect on products. Listed below are some of Global Testing Services Environmental Testing capabilities
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Mechanical Creep and Rupture Testing Machine
MRC Series
Jinan Testing Equipment IE Corporation
MRC series mechanical creep and rupture testing machine with single-lever structure is designed for long-term creep and stress rupture test applications. The series mechanical creep and rupture testing system is mainly for the metallic materials under room or elevated temperature according to GB/T2039, GB/T 20120, EN ISO 204-2009 and ASTM E139. The creep and rupture testing machine can also maintain constant loads for extended periods of time. Through the mechanical advantage of the lever arm loading system, constant loads can be maintained with a high degree of accuracy for long duration. This creep and rupture tester uses dead weights without continuous operation and the dependency of a mechanically powered drive. The creep and rupture testing system is an ideal equipment for metallurgy manufacturer, research institute, colleges and other relevant factories and mines.
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Solar Panel Testing Chamber
ZPH Series
CSZ's solar panel testing chambers aid in qualifying that modules can withstand the thermal stress caused by repeated changes in high and low temperatures along with exposure to high humidity. Unique air flow design and distribution ensures precise air flow required for solar panel testing.
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Polarization Tester
Polarization Tester is used to measure the stress value of optical glass, glass products and other optical materials, and is widely used in pharmaceutical companies, glass products factories and laboratories.
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Accelerated Life Test Systems
Test systems for accelerated life testing and product burn-in utilize Intepro’s electronic loads that are ideal where high power bulk loading is required. Characterization applications within Telecommunication and Aerospace sectors benefit from Intepro’s environmental stress screening (ESS)/Burn-in solutions
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Circuit Breaker Testing Equipment
HISAC Ultima
HISAC Ultima – new generation Circuit Breaker Dynamic Test Set from SCOPE …. The ultimate solution for testing Circuit Breakers of all types. HISAC Ultima is the most complete analyser for checking the dynamic performance of CBs in live EHV switchyards upto 765 kV. HISAC Ultima can carry out Dynamic Contact Resistance Measurement on SIX breaks of THREE poles in one operation thereby significantly reducing stress on CB & testing downtime.
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IEC60065 Fig11 Australia UL Plug Socket Tester Socket Outlet Torque Tester
CX-CTN
Shenzhen Chuangxin Instruments Co., Ltd.
The plug torque tester conforms to the standard of IEC60065 figure 11. It is used for checking whether the mechanical stress which occurs when the Direct Plug-in Equipment with plug pin normally insert into the socket is in the required range.
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Stress Test Software
PassMark BurnInTest
PassMark BurnInTest? is a software tool that allows all the major sub-systems of a computer to be simultaneously stress tested for endurance, reliability and stability.
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Static Load Cells (5 N to 300 kN)
2530 Series
The Instron 2530 Series static load cells are precision force transducers engineered for versatile use in tension, compression, cyclic, and reverse stress testing, delivering accurate measurements down to 1/500th of their capacity. Individually temperature-compensated and calibrated, they support automatic recognition and electronic calibration, and are built to international force-measurement standards (ASTM E4, ISO 7500-1 class 0.5, and JIS B7721, B7733). With overload protection (150 % of rating without damage, 300 % without mechanical failure), the 2530 family offers consistent, repeatable performance across a wide force range (5 N to 300 kN).2530 Series load cells with capacities of 5 N to 100 N are for use with 3300, 3400, 5900, and 6800 Series testing systems.2530 Series Load cells with capacities of 500 N to 300 kN are for use with 3300 and 3400 Series testing systems.
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RF Burn-In Services
Innovative Circuits Engineering, inc
There are many burn-in services that we offer such as HTOL, RFBL, ELFR, LTOL, etc and our focus on quality and customer service when providing burn-in custom solutions is second to none. We work closely with our customers to make sure we provide them with the best possible burn-in regardless of their lot size or pin count. We can also provide you with other electrical stress tests such as THB and HAST, and we can provide you with comprehensive status reports for your tests as they progress whether they be burn-in, THB, HAST or any other test.
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Non-Destructive Testing (NDT)
Marposs complements its geometric measurement solutions with solutions for non-destructive testing using eddy current technology.The testing options can be divided in three large groups:Material integrity test, to check for the presence of defects (cracks, porosity, blow holes, inclusions) on the surface and in the layer just below the surface.Material properties test, to check if the thermal cycles (hardening, hardening and tempering, annealing, stress relieving, etc.) have been performed correctly. Material identification checks are done to sort parts with the same geometry but made with different materials.Thread inspection to check if the treading has been carried out and its quality.In addition to the non-destructive checks performed with the eddy currents, we have developed a durometer for the conventional measurement of surface hardness, according to the Rockwell scale (HRC or HRA); which uses a diamond penetrator to measure the hardness of the sample being tested.
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Spring/Non-Spring-Loaded Thermocouple
8PT25
The AMETEK 8PT25 Spring/Non-Spring-Loaded Thermocouples for Frame 6, 7 and 9 applications have been designed, fully tested and qualified to meet OEM specifications. Power Instruments’ expertise in solving creep, stress rupture, corrosion, EMF drift and other problems affecting sensor performance has resulted in a robust line of single and dual element thermocouple designs. This thermocouple is immersed directly into the turbine fluid to monitor temperature while in operation.
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Multisite Probe Card
T300 ButtonTile™
The Celadon T300™ probe cards are designed for long-term, multi-site, high-density wafer level reliability or burn-in tests up to 400°C. In today’s economic environment, conventional reliability data is needed quickly while eliminating the cost, electrical stress, and delay of parts packaging while maintaining a wafer performance map.
