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Product
Rugged SODIMM DDR4 2666/3200
SQR-YD4N
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Robust PCB designed with Mounting Hole with Military MIL-810G verified. Extreme Data Transfer rate up to 3200 MT/s, Capacity: up to 32GB. Wide Temperature supported: -40°C ~ 85 °C, Original IC chip (Samsung/Hynix).
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Product
Industrial Grade SODIMM DDR4 3200
SQR-SD4I
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30u” Golden Finger, Wide Temp range: -40oC~85oC. Tier one original chip adopt, lifetime warranty, DRAM Software Monitoring.
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Product
DDR4 Pro 288-Pin DIMM Adapter
INN-8686-18-PRO
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Your best option if you need to test a large volume of memory! The RAMCHECK LX DDR4 Pro 288-pin DIMM Adapter (p/n INN-8686-18-PRO) gives RAMCHECK LX users the power to test 288-pin DDR4 modules, including unbuffered (UDIMM), load-reduced (LR-DIMM) and registered modules (RDIMM), both ECC and non-ECC, that comply with JEDEC standards. It includes the DDR4 Series adapter and DDR4 Pro DIMM test head.
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Product
DDR4 Pro Memory Test Adapter
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This memory test adapter for the RAMCHECK LX includes an extraordinarily rugged test socket for many thousands of insertion/removal cycles.
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Product
DDR4 BGA Interposers, DDR4 DRAM X4/x8 Packages
N2114A
Interposer
The N2114A DDR4 BGA interposers provide signal access to the clock, strobe, data, address and command signals to the DDR4 BGA package for making electrical and timing measurements with an Infiniium oscilloscope. With the DDR4 JEDEC specification defined at the DRAM ballout, the BGA probe adapter provides direct signal access to BGA package for true compliance testing.
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Product
DRAM SO-DIMM DDR4 Memory
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Improve performance up to 50% (compared to SO-DDR3.) with Advantech! We offer industrial grade SO-DDR4 2666/2400/2133 memory with 30μ" gold plating connector (260 pin) featuring 1.2v low operating voltage with faster burst accesses.
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Product
8G DDR4-3200 1GbX8 1.2V SAM -40~85C
AQD-D4U8GN32-SEW
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DDR4 3200Mhz Unbuffered DIMM, 30u" Gold Plating Thickness, Anti-sulfurization resistance. 1.2V power consumption, Samsung original chip, 100% tested for stability, compatibility and performance.
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Product
32G DDR4-3200 2GbX8 1.2V SAM -40~85C
AQD-D4U32N32-SBW
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DDR4 3200Mhz Unbuffered DIMM, 30u" Gold Plating Thickness, Anti-sulfurization resistance. 1.2V power consumption, Samsung original chip, 100% tested for stability, compatibility and performance.
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Product
8G SO-DDR4-3200 1GbX8 1.2V SAM -40~85C
AQD-SD4U8GN32-SEW1
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DDR4 3200Mhz Unbuffered SO-DIMM, 30u" Gold Plating Thickness, Anti-sulfurization resistance, 1.2V power consumption. Samsung original chip, wide temperatures from -40° to 85°C.
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Product
16G SO-DDR4-3200 1GbX8 1.2V SAM -40~85C
AQD-SD4U16N32-SEW
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DDR4 3200Mhz Unbuffered SO-DIMM, 30u" Gold Plating Thickness, Anti-sulfurization resistance, 1.2V power consumption. Samsung original chip, 100% tested for stability, compatibility and performance.
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Product
LGA 3647-P0 Intel® Xeon® Scalable ATX Server Board with 6 DDR4, 5 PCIe x8 or 2 PCIe x16 and 1 PCIe x8, 8 SATA3.0, 6 USB3.0, Dual 10GbE, IPMI
ASMB-815
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- ATX server board with Xeon® Scalable processors- DDR4 2933MHz RDIMM up to 768GB, support Intel Optane DC Persistent Memory- Five PCIe x8 or two PCIe x16 and 1 PCIe x8- Intel® X557-AT2 dual 10GbE ports- Eight SATA3.0 and one M.2 connectors (SATA / PCIe compatible)- 0 ~ 60 °C ambient operating temperature range
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Product
DDR4 Protocol Debug And Analysis Solution
U4972A
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The U4972A DDR4 DRAM bundle provides software applications, probing, and hardware options for DDR4 DRAM debug, compliance validation, and analysis. The U4972A bundle includes systemization of hardware (modules installed into chassis) and software loaded onto the M9537A controller.
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Product
RAMCHECK LX DDR4 Memory Tester
INN-8686-DDR4
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The RAMCHECK LX DDR4 quickly and accurately tests and identifies DDR4 DIMMs for servers and desktops, as well as laptop SODIMMs.
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Product
LGA 4189 Intel® 3rd Gen Xeon® Scalable ATX Server Board with 8x DDR4, 3x PCIe x16, 8x SATA 3, 6x USB 3.2 (Gen1), Dual 10GbE, and IPMI
ASMB-816
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- LGA4189 ATX server board with 3rd Gen. Xeon® Scalable processor- DDR4 3200 MHz RDIMM up to 512 GB (8 DIMMs) supports Intel® Optane™ Persistent Memory- Features 3x PCIe x16, 1x PCIe x8, 2x PCIe x4, and 1x PCIe x1- Intel® X550 dual 10GbE ports- Eight SATA 3 and one M.2 connectors (SATA/PCIe compatible)- 0 ~ 60 °C/ 32 ~ 140 °F ambient operating temperature range
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Product
Dual LGA3647-P0 Intel® Xeon® Scalable EATX Server Board with 24 DDR4, 5 PCIe x16 + 1 PCIe x8, 10 SATA3.0, 6 USB3.0, Dual 10GbE, IPMI
ASMB-935
Server Board
- EATX server board with dual Xeon Scalable processors- DDR4 2933 MHz RDIMM up to 3TB, support Intel Optane DC Persistent Memory- Five PCIe x16 (Gen3) and one PCIe x8 (Gen3) for three double-deck cards- Intel® X557-AT2 dual 10GbE ports- Ten SATA3.0 and six USB3.0 ports- One M.2 2280 (SATA / PCIe compatible)- 0 ~ 40 °C ambient operating temperature range
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Product
DDR4 X16, 2-Wing, Small KOV, BGA Interposer For Logic Analyzers
W4636A
Interposer
The W4636A DDR4 x16 – 2 wing BGA interposer for 96 ball DDR4 DRAM is designed for data rates up to and including 2.4 Gb/s. The W4636A probes all ADD/CMD/CNTRL and partial DQ/DQS, and it is designed for minimal KOV for space limited systems under test. The W4636A is the least expensive DDR4 BGA interposer for a logic analyzer.
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Product
DRAM Memory Module
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Choose the perfect memory solution for your application with Advantech! We offer a full range of industrial-grade RAM memory modules, covering all technologies including DDR4, DDR3, DDR2, DDR with diverse features like Unbuffered, Registered, and ECC.
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Product
PCI/104-Express Type 1 Single Board Computer with 6th Gen. Intel® Core™ Processor (formerly codenamed Skylake)
CMx-SLx
Single Board Computer
The CMx-SLx is a PCI/104-Express Type 1 Single Board Computer (SBC) featuring the 64-bit 6th Gen. Intel® Core™ i3 processor (formerly "Skylake-H"), supported by the Intel® CM236 Chipset. The CMx-SLx is specifically designed for customers who need high-level processing and graphics performance in a long product life solution. The CMx-SLx Intel processor supports Intel Hyper-Threading Technology (i3-6102E = 2 cores, 4 threads) and 8 GB of soldered ECC DDR4 memory at 1866/2133 to achieve optimum overall performance.
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Product
Registered DIMM DDR4 3200/2933/2666
SQR-RD4N
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100% Screening Test, Compatible with server platform, Original IC chip adopted, 30u” golden finger.
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Product
BMC Card
SOM-RM10
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ASPEED 7th Gen AST2600 BMC Card, OCP RunBMCv1.5 ASPEED 7th Gen AST2600 Server Management Processor. Up to 2GB DDR4 on-board, 128MB SPI flash on-board, 1GbE LAN for mainly connectivity & VGA 800x600 for easier on-site debug.
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Product
1-Ch. 6.4 GHz or 2-Ch. 3.2 GHz A/D, 2-Ch 6.4 GHz D/A Kintex UltraScale - XMC
Model 71141
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- Jade Xilinx Kintex UltraScale FPGA Products and Navigator Design Suite Software Video- Jade Xilinx Kintex UltraScale FPGA Family Brochure- Ideal radar and software radio interface solution- Supports Xilinx Kintex UltraScale FPGAs- Supports VITA-49.2 VITA Radio Transport standard- One-channel mode with 6.4 GHz, 12-bit A/D- Two-channel mode with 3.2 GHz, 12-bit A/Ds- Programmable DDCs (Digital Downconverters)- Two 6.4 GHz, 14-bit D/As- Programmable DUCs (Digital Upconverters)- 5 GB of DDR4 SDRAM- µSync clock/sync bus for multimodule synchronization- PCI Express (Gen. 1, 2 & 3) interface up to x8- VITA 42.0 XMC compatible with switched fabric interfaces- Optional LVDS and gigabit serial connections to the FPGA for custom I/O- Ruggedized and conduction cooled versions available- Synchronize up to four modules with Model 7192 System Synchronization and Distribution Amplifier - PMC/XMC- Synchronize up to twelve modules with Model 9192 System Synchronization and Distribution Amplifier- 1U Rack-mount
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Product
PCIe VU13P UltraScale+TM With Massive Optical I/O
PCI597
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The PCI597 is based on the Xilinx VU13P UltraScale+TM FPGA, which provides over 12,000 DSP slices, 360 Mb of UltraRAM and 3,780K logic cells. The Unit provides active cooling of the FPGA making it appropriate for power-hungry applications or those requiring temperature stability for good performance. The FPGA has interface to DDR4 memory channels (single bank of 64-bit wide, 16 GB). This allows for large buffer sizes to be stored during processing as well as for queuing the data to the host.
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Product
8 Channel A/D & D/A Zynq UltraScale+ RFSoC Gen 3 Processor - SOSA Aligned 3U VPX
Model 5553
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- Supports Xilinx® Zynq® UltraScale+™ RFSoC FPGAs- 16 GB of DDR4 SDRAM- On-board GPS receiver- 10 GigE Interface- 40 GigE Interface- Optional VITA 67.3C optical interface for backplane gigabit serial communication- Dual 100 GigE UDP interface- Compatible with several VITA standards including: VITA 49, VITA 46, VITA 48, VITA 67.3C and VITA 65 (OpenVPX™ System Specification)- Ruggedized and conduction-cooled versions available- Model 8256 3U VPX SOSA Aligned Development Chassis- Model 6003 unique QuartzXM eXpress module enables migration to other form factors- Video: Model 8256 3U VPX SOSA Aligned Development Chassis- Pentek's Quartz Family of Xilinx Zynq UltraScale+ RFSoC FPGA Products Video- Live Signal Acquisition Video: Quartz Model 5950 and Model 6001 RFSoC boards- Pipeline Newsletter: Strategies for Deploying Xilinx's Zync UltraScale+ RFSoC- Synchronize up to eight modules with Model 5903 High-Speed System Synchronization and Distribution Amplifier - 3U VPX- Please refer to the product datasheet for Installed FPGA IP Module details
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Product
LGA 4189 Intel® Xeon® Scalable Proprietary Server Board with 16x DDR4, 4 x PCIe x16, 10 x SATA3, 8 x USB 3.2 (Gen 1), Dual 10GbE, and IPMI
ASMB-976
Server Board
- LGA4189 proprietary server board with 3rd Gen Intel® Xeon® scalable processor- DDR4 3200 MHz RDIMM up to 2TB supports Intel® Optane™ Persistent Memory- 4 x PCIe x16 and 7 x PCIe x8- Intel® X550 dual 10GbE ports- Ten SATA3 and two M.2 connectors (SATA/PCIe compatible)- 0 ~ 40 °C ( 32 ~ 104 °F) ambient operating temperature range
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Product
1-Ch. 6.4 GHz or 2-Ch. 3.2 GHz A/D, 2-Ch 6.4 GHz D/A Kintex UltraScale - 3U VPX
Model 54141A
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- Jade Xilinx Kintex UltraScale FPGA Products and Navigator Design Suite Software Video- Jade Xilinx Kintex UltraScale FPGA Family Brochure- Exceptional dynamic range and analog signal integrity- Xilinx® Kintex® UltraScale™ FPGAs- Compatible with several VITA standards including: VITA 66.5 and VITA 67.3C- Supports VITA 49.2 VITA Radio Transport standard- One-channel mode with 6.4 GHz, 12-bit A/D- Two-channel mode with 3.2 GHz, 12-bit A/Ds- Programmable DDCs (Digital Downconverters)- Two 6.4 GHz, 14-bit D/As- Programmable DUCs (Digital Upconverters)- 5 GB of DDR4 SDRAM- uSync clock/sync bus for multimodule synchronization- PCI Express (Gen. 1, 2 & 3) interface up to x8- Optional LVDS and gigabit serial connections to the FPGA for custom I/O- Ruggedized and conduction-cooled versions available- Navigator® BSP for software development- Navigator® FDK for custom IP development- SPARK® fully-integrated development system
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Product
Analyzer Probes
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The following probes are available for the MA51x0 and MA41x0 series analyzers. These probes are designed for low-voltage and high-speed midbus probing or probing with an interposer. The following JEDEC memory standards are widely used by these probes: DDR5 (JESD79-5), DDR4 (JESD79-4), DDR3 (JESD79-3), LPDDR5 & LPDDR5X (JESD209-5), LPDDR4 & LPDDR4X (JESD209-4), and LPDDR3 (JESD209-3).
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Product
8-Channel A/D & D/A Zynq UltraScale+ RFSoC Gen 3 Processor - 3U VPX
Model 5953
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- Supports Xilinx Zynq UltraScale+ RFSoC FPGAs- 16 GB of DDR4 SDRAM- On-board GPS receiver- PCI Express (Gen. 1, 2 and 3) interface up to x8- LVDS connections to the Zynq UltraScale+ FPGA for custom I/O- Optional VITA-66.4 optical interface for backplane gigabit serial communication- Dual 100 GigE UDP interface- Compatible with several VITA standards including: VITA-46, VITA-48, VITA-66.4, VITA-57.4 and VITA-65 (OpenVPX™ System Specification)- Ruggedized and conduction-cooled versions available- Model 8257 1-Slot 3U VPX Development Chassis for Quartz Products- Model 4801 Carrier Design Kit for designing custom carrier for the Model 6003 QuartzXM- Model 6003 unique QuartzXM eXpress module enables migration to other form factorsPentek's Quartz Family of Xilinx Zynq UltraScale+ RFSoC FPGA Products VideoLive Signal Acquisition Video: Quartz Model 5950 and Model 6001 RFSoC boardsPipeline Newsletter: Strategies for Deploying Xilinx's Zync UltraScale+ RFSoCSynchronize up to eight modules with Model 5903 High-Speed System Synchronization and Distribution Amplifier - 3U VPXPlease refer to the product datasheet for Installed FPGA IP Module details
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Product
Micro-ATX Motherboard 8th/9th Gen Intel® Xeon® E3 Processor LGA1151
AIMB-586
Motherboard
Supports Intel® 8th/ 9th Gen Xeon/ Core™ i7/i5/i3 processor with Q370/C246/H310 chipsetFour U-DIMM sockets support up to 128GB DDR4 2400/2666 MHz SDRAMSupports HDMI2.0a(option),2 DP++,eDP/LVDS(option) displaySupports Intel AMT 12.0 and Intel vPro competentSupports PCIE Gen3, 4 USB3.1, 10 x USB2.0/USB 3.0, upto 4 x SATAIII and quad GbE LAN, M.2(M-key),M.2(E-key)Supports Software RAID 0, 1, 5, 10, TPM 1.2/2.0 (optional)Supports SUSI, WISE-DeviceOn and Edge AI Suite.
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Product
[Yocto/Android] 21.5" Touch Panel Computer With ARM Cortex™-A53 Processor
TPC-121W
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arm SystemReady IR certifiedNXP® ARM® Cortex™-A53 i.MX 8M Mini quad-core processor16:9 LCD with multi-touch P-CAP and true-flat IP66-rated front panelUp to 4 GB DDR4 RAM and 16 GB eMMC storage onboard1 mb FRAM backup memory for unexpected power interruptions2 x Serial port with 120Ω termination resistor that one supports the CAN 2.0B protocol and offers a programmable bit rate of up to 1 Mb/secEmbedded browser and for rapid Web App developmentSupports Linux Yocto and AndroidCompatible with VESA and panel mounting
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Product
8G SO-DDR4-3200 1GbX8 1.2V SAM -40~85C
AQD-SD4U8GN32-SEW
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DDR4 3200Mhz Unbuffered SO-DIMM, 30u" Gold Plating Thickness, Anti-sulfurization resistance. 1.2V power consumption, Samsung original chip, 100% tested for stability, compatibility and performance.
