Test Sockets
provide electro mechano connection between DUT and ATE in hand testing applications.
See Also: BGA Test Sockets, Burn-In Sockets
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Test Sockets
BGA/LGA
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There are a lot of options when it comes to bench test sockets. Save yourself and your lab time, money and frustration by working with Ardent for truly customized test socket solutions to meet your needs and do the job with high performance, reliability and quick turnaround that you need and deserve.
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Test Sockets
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Yamaichi Electronics Co., Ltd.
A test socket is the ideal point to test your home’s internal phone wiring for faults. You can also use it to identify any potential faults with the phone line outside. Your test socket is located in your master socket. It is the point between the internal phone wiring in your house and the phone line outside. That means by plugging into your test socket you can bypass all the internal wiring and test your device directly on the phone line.
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Test Sockets
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Smiths Interconnect offers a wide range of spring contacts and design standards for high quality test sockets providing flexibility and fast delivery for optimal cost/performance ratio.
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MultiSite Test sockets and Wafer Level
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multi-site sockets include anything from strip test sockets to test sockets for wafer test to multi-position, singulated devices. The advantages of these sockets can be enormous as test time can be decreased by a factor of ten over conventional one up testing. In most cases, the throughput is only limited by tester capabilities and/or handling capacity.
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Off-Set Kelvin Test Sockets
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This is an innovative and robust contact technology for making Kelvin contact to 0.5mm pitch QFNs. The contact uses a tip that is angled to one side, matched to an orientation that's flat on the tip. Two such contacts placed in opposition will touch the pad within 0.125mm. And because the tip is offset, the probe diameter is a robust 0.39mm and the load board pad pitch remains 0.5mm.
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Test Sockets
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socket design as per customer specificationsquick + easy socket changehigh-performance spring probesdesigned for high frequency up to 16 GHz-55C/-67F to 150C/302F temperature rangemanual/automatic application optionssmall socket footprintone socket base for each insert (3x3 to 9x9 QFN)one-click switch from engineering to production socket modedevice dependent standard socket frame with changeable insertmore than 500,000 compression cyclesKelvin test applicabilitytool-free insert + actuator exchanges0.3 mm minimum lead pitchQFP extender available
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High Performance Chipscale Test Sockets
SC
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Ardent Concepts Test Sockets for ATE test deploy patented SC Contact Sets. This technology is capable of over 2 Million mechanical insertions in production environments and uses easy to replace pins with no complicated assembly procedure. It is designed to be drop-in compatible with 1mm offset and straight through footprints to ease implementation, and RC SC’s simple and robust design is extremely cost effective when compared with existing “roll” type test contactors and sockets. Designed specifically for JEDEC QFN and MLF applications, SC High Performance Test Sockets are available for most handler set-ups and offer exceptional AC performance.
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Test Sockets
MEMS Device
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Patented MEMS Sockets from Ardent Concepts use a unique scrubbing action contact set which is ideal for today’s sensitive MEMS devices, including accelerometers, gyroscopes, MEMS microphones and other specialized devices used in mobile electronics applications
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Test Sockets
QFN/QFP
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For today’s chipscale packages, finding the right socket solution can be challenging. With SC™ sockets from Ardent, you can count on the right design, the best performance, and quick turns for even the most challenging custom designs
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General Final Test
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C.C.P. Contact Probes Co., LTD.
CCP designs and manufactures custom made test sockets.
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Manual Test Press Fixture
750/752 Series
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RTI's manual test presses are compact, portable, all-inclusive, and easy to use. Single lever operation and 100% vertical compression makes the manual test press an ideal solution for PCB, hybrid module, and high pin count device-level testing when complex test requirements cannot be met with a test socket and breakout board alone.
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Fuel Display Unit Tester
MS 1125
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Fuel Display Unit Test Bench is a compact table-top test bench with front panel controls, indications, built-in signal simulator and necessary power supply for testing the serviceability of Fuel Display Unit of Helicopter. FTB operates on 230 V AC and supplies 28 V DC power to FDU. FTB is housed in a metallic cabinet FTB interfaces with both 61 Pin connector and 6-pin socket mounted on the rear panel of FDU by means of the cable connected to the unit. FTB is fabricated utilizing off-the-shelf standard industrial/commercial components like rotary switches, toggle switches, press switches, test sockets, fuse holders, potentiometer etc. The Frequency generation circuit is integrated into FTB for the simulation of Fuel probe and flow rate signals. The frequency of the signal can be selected by means of a rotary switch Low amplitude sine wave signal is simulated for testing flow rates. Variable voltage DC power supply with a voltage range of 24 to 29 Volts is provided within FTB to power-up FDU. 5 V DC is provided for the operation of signal generating circuit (PIC Frequency Controller Board). An off-the-shelf Hand held battery operated Digital Multimeter (DMM) procured from the prominent manufacturer (FLUKE) is supplied with FTB for setting up and measurement of various parameters like Resistance, Voltage, Frequency etc.
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Passive Component ATS
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Test and packing speeds from 80ppm to1,800ppmStandard functions - Inductance/quality factor test - Winding resistance test - Polarity testOptional functions - Layer short test - Insulation resistance test - Bias current testCircular vibrating plate design feeds inductors steadily and rapidlyIndex disc design eliminates dropped inductorsFour-wire measurement test socket designAutomatic discharge mechanism when feeding errors occurEach test station has an independent NG (No Good) product collection boxTest without packaging function provided, good products gathered in bulk collection boxExclusive data collection software designed for monitoring product quality in real timeReserved stations for number spraying and automatic optical inspectionSwitchable Chinese/English/Japanese operating interfaceEquipment is fast, stable and safe
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Test Probes
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Petracarbon is a leading supplier and provider of spring contact probes and semiconductor test sockets.
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Universal PLCC ZIF (Zero-Insertion-Force) Test Socket
Series 537
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Universal PLCC ZIF Test Socket Live Bug Type. This Universal PLCC ZIF (zero insertion force) Test Socket will take seven sizes of PLCC footprints with Aries insert plate, Part No. XX-537-20. Data Sheet No. 10012, available seperately.
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Grypper G35 / G40
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*Package-size PCB footprint: Since the PCB footprint of Grypper is identical to the package, only one PCB design is required, enabling a seamless transition from test and validation through production and reducing overall cost of test*Low insertion force: Unique contact design reduces the insertion force required to insert and retain higher-ball-count packages safely and securely within the test socket*Oxide cutting wipe action: The contact design wipes the side of the solder ball during insertion, breaking through solder oxides ensuring a good electrical connection between contact and solder ball*Signal integrity: A short signal path achieves low inductance and low insertion loss, providing a nearly invisible electrical connection*Test socket has solder balls attached: The G40 contacts have solder balls reflowed onto the contacts to ensure reliable solder volume at the PCB to test socket solder interface.
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Package Probe
Test Socket
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Jigs for testing the electrical characteristics of devices in the final testing stage after LSI package assembly.To match the increasingly high functionality of LSIs for communications and networks, such as mobile phones and mobile devices, we provide two types of test sockets: The "J-Contacts" series suited for high-frequency, high-performance devices, and the "BeeContacts" series, spring probes with a unique structure that delivers excellent contact stability.
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Flex Socket Test Module
JT 2127/Flex Socket Test Module
Test Module
The JT 2127/Flex STM memory socket tester is a family of hardware adapters specifically designed for the testing of of PCB-mounted DIMM & SODIMM sockets using a JTAG/boundary-scan controller and supporting software. The testing of memory sockets has always been troublesome for test and production engineers using JTAG/boundary-scan systems. Even when it is possible to create memory writes/reads from a boundary-scan compliant access device on the UUT (Unit Under Test), the initialization process may fail leaving you with little diagnostics information. What’s more it can still be uncertain whether fault lays with the DIMM module itself or the socket. Using the new JT 2127-Flex system from JTAG Technologies you get pin-point diagnostics from a known-good test interface so you can be certain that your socket is soldered correctly.
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Film Frame Test Handler
4170-IH
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High throughput ・High withstand load, and high thrust table ・Expansion of the strip attachment area ：260(L) X 300(W) [Withinφ300mm for WLCSP]・LOT control by barcode/2D code reader ・Easy device type exchange only test socket and display screen setting・Auto-cleaning function unit is installed to clean the socket at any desired timing.・8/12 inches ring conversion ・S2/S8 regulation compliance・SEMI G85 compliance・SECS/GEM compliance
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Quick-Release Universal ZIF
Series X57X
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Quick-Release Universal Zero Insertion Force Dip Test Socket. Aries Universal Test Socket accepts devices on .300 to .600 [7.62 to 15.24] centers. Swing quick-release handle down to open contacts and insert device. Release and handle automatically returns as contacts close onto device leads.
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Burn-In Test Sockets
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The selection of the test socket is critical to the performance of a device during qualification testing where electrical bias and signals are applied. Key factors such as mechanical compatibility, operating temperature, ability to withstand high moisture levels, signal speed and lead inductance/capacitance all need to be taken into account when selecting the best socket for the test application.
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Test Sockets
Non Standard
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Chances are good Ardent can help you with that. We can adapt our technology to just about any package, device or module. Small volumes of custom sockets for higher bandwidth applications are a niche all in their own, and our engineering team has many years of experience designing custom sockets for all kinds of applications.
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Test Sockets & Interposers
Silmat
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Innovative technology platforms and multiple product families for BGA, LGA, QFN and CSP packages down to 0.3mm pitch. High frequency bandwidth > 40 GHz..
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Semiconductor
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With ultra-multi pin count and fine pitch, our general-purpose IC socket lineup corresponds to every need. For semiconductor burn-in sockets for thermal acceleration tests, and test sockets for semiconductor electrical testing, we continue to hold a high market share all over the world.
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Test & Burn-In Socket for Devices up to 13mm Square
CSP/MicroBGA
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Test & Burn-In Socket. Socket is easily mounted and removed to & from the BIB due to solderless pressure mount compression spring probes which, are accurately located by two molded plastic alignment pins and mounted with four stainless steel screws. Standard molded socket format can accommodate any device package of 13mm or smaller, by using machined (for small quantities) or custom molded (for large quantities) pressure pads and interposers.
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Fixture Design
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TestEdge offers quick, cost effective test fixture design services for low-speed, full-speed, and high-speed devices. Based on our experience in developing high performance test fixtures for a wide variety of devices, test sockets, and tester platforms, we provide a premium quality test and engineering validation environment for everything from high power (40W) to high pin count to high speed ECL to high speed SerDes (3.25Gb) devices.
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Test Contactor/WLCSP Probe Head
ACE
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ACE™ test sockets offer optimal RF performance for fine pitch FBGA, QFN and wafer-level packages for Power Amplifiers, RF switches and mobile communications. Supporting pitches down to 0.4 mm, ACE features an innovative design that provides superior performance, improved yields and power efficiency.ACE probe heads deliver exceptional electrical performance, both DC and RF. Manufactured from HyperCore™ base material, a proprietary material of Cohu’s Everett Charles Technologies, ACE probes have the electrical properties of BeCu with the non-oxidizing properties of a precious metal. The short signal path, sharp tips, and large contact area between plungers provide high current conductance and reliable contact with less force.
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Universal ZIF (Zero-Insertion-Force) DIP Test Socket
Series X55X
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Universal Zero Insertion Force DIP Test Socket. All pin count sockets go into PCB with either .300 or .600 [7.62 to 15.24] centers. Sockets can be soldered into PCBs or plugged into any socket. Socket fits into Aries or any competitive test socket receptacle.
