Chucks
Hold DUTs in place.
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High Temperature Chucks
High temperature electrostatic chucks are available for the ranges -60 to +400 deg. C, and for 350 to 600 deg. C. Different materials and constructions are used in these two ranges.
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Wafer Chucks
ARC, in addition to fabricating Wafer Chucks from aluminum, is also known for its ability to work in hard to machine materials such as hardened (50-62 Rockwell) metal alloys, fired ceramics, e.g. SiC and glasses. These materials are often ideal for semiconductor equipment applications due to their ability to hold critical dimensions and tolerances. ARC specializes in surface grinding and lapping these materials to precision flatness and parallelism specifications needed for semiconductor wafer chuck requirements.
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Ambient Temperature Vacuum Wafer Chucks
6" (152mm) Vacuum Wafer Chuck for General Purpose Ambient Temperature testing with a Stainless Steel vacuum wafer surface
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Standard Probe Station Chucks & Accessories
In this test solutions section of our website we describe the expanding line of Abet PV IV probe stations for the growing variety of solar cell types and sizes being developed around the world. This page describes a line of vacuum chucks and accessories for top/bottom, top/top, and bottom/bottom solar cells from 3 x 3 mm to 300 x 300 mm. Probe stations for multiple device on a single substrate and multifunction probe stations are described further in the sections highlighted to the left of this page.
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Metal Foil Chucks
Electrostatic chucks are the most reliable solution for gripping delicate, microfabricated metal foils - even in air. These chucks induce no distortion, are easily cleaned, are amazingly robust, economically priced, and exhibit uniform grip forces over their entire area.
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Pneumatic Non-Shift Wedge Grips
Pneumatic non-shift wedge grips have an open-front design and use one-touch chucking by foot operation to provide simple specimen mounting. These grips are suitable for tensile testing materials such as plastics and metals.
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Voltage Voltmeter
Voltstik
The Voltstik is a distribution voltage voltmeter designed for use on lines and in substations. This meter is employed onto a line by using a hot stick and universal chuck adapter. It is capable of measuring voltage phase to phase, and phase to ground. This high impedance instrument is an excellent choice for solving multiple problems associated with operating a medium voltage system. Its key applications are defined under three groups, safety confirmation of the voltage present, troubleshooting voltage problems, and phasing.
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Wafer Chucks
American Probe & Technologies, Inc.
High Performance Chuck for your needs Introducing the American Probe & Technologies’ HC-6000 series of thermal chucks,
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Pyroelectric and Thermal Testing
The optional Chamber Task measures the Pulse Polarization response and Small Signal Capacitance of a Pyroelectric material that is being heated and/or cooled within a thermal chamber, on a hot chuck or in a furnace. From these measurements the Spontaneous Polarization Pr(q) and the Dielectric Constant er(q) are computed. These are then combined to determine the Electrical Displacement D(q) as a function of the temperature q.
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On-Wafer Measurements
Accurate DC/CV (and RF) statistical modeling of semiconductor devices requires collecting a significant amount of measured data from different wafers across several temperatures. Keysight Technologies recommends IC-CAP WaferPro as a turn-key DC/CV and RF automated characterization solution to help modeling and device engineers achieve more efficient on-wafer measurements across temperature. This new breakthrough solution is based on IC-CAP modeling software and efficiently controls DC/CV analyzers, network analyzers, probers, switching matrixes, and temperature chucks, as well as the powerful 407x and 408x Series of Keysight parametric testers.
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Fully Automatic Rubber Tensile Testing System
Compactly Integrating Functions Required for Quality Control of Rubber Shimadzu Fully-Automatic Tensile Testing System This system provides full automation, from measurement of specimen dimensions, supply to the testing machine, and fixing of chucks to measurement of extension between standard lines and data processing. The system can be used for continuous nighttime testing, which helps save labor costs.
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Electrostatic Chucks
Chucks grip for micropatterning, temperature control, or robotics ...*insulating substrates,*hard disk drive head substrates,*semiconductor wafers,*InP-coated sapphire,*metal foils,*... and many other materials.
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Thermal Chuck Systems
A-Series
Advanced Temperature Test Systems GmbH
The A-Series represents a productline of air cooled thermal chuck systems for a temperature range between -30C up to +400C. The basic product offers an active cooled chuck system without an external chiller for a temperature range between +25C up to +200C at a very competitive price to common Hot Chucks.
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Wafer Back Side Cooling System
GR-300 Series
The GR-300 Series can control gases used to cool the back side of wafers that are fixed in position by an electrostatic chuck system.The stability and accuracy of the GR-300 makes it ideal for controlling the flow of Helium and Argon in wafer cooling systems.
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Probe Station
EPS1000
Reasonable price and compact design. - Sellectable chuck size : 4inch, 6inch, 8inch when ordering probe station. - Hot chuck can be installed. Temp range: RT ~ 300°C - Hot and cool chuck from 0 °C ~ 300 °C can be provided. - Maximum pcs of manipulators can be installed on the base unit of probe
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Tabletop Mask Aligner
Model 200
The OAI Model 200 Mask Aligner is a cost-effective high performance mask Aligner that has been engineered with industry proven components that have made OAI a leader in the photolithography capital equipment industry. The Model 200 is a tableop mask Aligner that requires minimal cleanroom space. It offers an economic alternative for R&D, or limited scale, pilot production. Utilizing an innovative, air bearing / vacuum chuck leveling system, the substrate is leveled quickly and gently, for parallel photo mask alignment and uniform contact across the wafer during contact exposure. The system is capable of one micron resolution and alignment precision.
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PV-IV Solutions
We offer a broad range of PV IV Measurement systems for measuring solar cells from 3 mm to 300 x 300 mm. The wide range of solar simulators, vacuum chuck test stations, and electronic loads make it impossible to list “standard solutions” Most systems are put together for individual customer needs based on cell type and contact geometry of the devices being tested. Over the last several years we have designed and manufactured a wide range test solutions for many different types of cells and contact geometries. In most cases a customized solution is no more than a slight customization of a standard platform that has been previously designed.
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Coordinate Measuring Machines
ScopeCheck® V
Precise measurement of cylindrical workpieces (tools, shafts etc.) using application-specific sensors in a production environmentHeavy duty granite base with CNC air bearing rotary axisIntegrated vertical rotary axis for rapid measurement of diameters, planes, holes, and cutting and clearance angles with optical and tactile sensorsAll industry standard tool holders and chuck systems are available on the rotary axisUnique design allows easy integration of additional sensors for increased flexibilityProtected enclosure for measurement on the production floor
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Drill Chuck Grips
Metal rods, wires, and plates and electronic components can be tensile tested using drill chuck grips. Electronic components are tested by placing the metal legs of the components in the grips, allowing different shaped components to be tested with the same set of grips.
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TLP Probe Arm Kit
TPA-95
High Power Pulse Instruments GmbH
*Flexible pulse force, pulse sense combined TLP probe arm kit based on TPA-95L and TPA-95R*Compatible with typical standard micropositioner mechanical interfaces*4.7 kΩ pulse sense voltage divider, which results in a voltage transfer ratio of (4700 + 50)/50 = 95 : 1 into 50 Ω*Variable probe pitch configuration*1 m flexible 50 Ω cables with SMA connector for pulse sense*0.1 m flexible 50 Ω cables with SMA connector for pulse force*Tungsten probe tips*Can be used for chuck backside grounded TLP measurements
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ECHO VS System with Image Enhancement
Echo VS
The ECHO VS system adds our Image Enhancement Suite to the ECHO platform to provide industry-leading image quality and defect identification capabilities. It’s our most accurate ultrasonic NDT equipment for development labs and for production environments that require the highest precision. The Echo system can be fitted with an optional chuck for manual wafer inspection.
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Probe Station
ETCP1000
Installation of “Hot and cool chuck” - Sellectable chuck size : 4inch, 6inch. - Temperature variation : -193°C ~ 300°C (80K ~ 573K) - Additional requirements : Vacuum chamber, LN2 tank(Bombei), microscope, CCD camera, manipulators. - EPS500 is standard model in ETCP1000 probe station.
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Probe Card Analyzers
PB6800
The ITC line of Probilt, probe card analyzers provide fast, accurate and repeatable test data for all types of probe card technologies. Simple user definable vision parameters allow even the newest and most complex probe tip geometries to be captured and accurately measured. Probilt’s PB6800 large measurement chuck allows probe arrays as big as 300 mm in diameter to be touched down without overhanging the chuck surface.
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Spring Stiffness Testing Machine
STB Series
Jinan Testing Equipment IE Corporation
STB Computer Control Spring Stiffness Testing Machine Under Axial and Lateral Load is to measure the displacement stiffness of spring under both axial and lateral load, complying with the standard EN13298 Railway applications - Suspension components - Helical suspension springs, steel. The Spring Stiffness Testing Machine measures both axial and lateral stiffness of spring, displacement for both lateral and axial, both loads, offset angle etc. The Spring Stiffness Testing Machine is an ideal testing equipment for spring of chuck and train.
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High Voltage Power Supplies
DR5 Series
The DR5 system comprises: DR5A host controller; and DR5V high-voltage chuck power supply with adaptive grip and release.
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Hot Chucks
Materials Development Corporation
Probe stations to suit all measurement requirementswhether production, engineering or research. See individual data sheets for more details.
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Thermal Controlled Chucks & Plates
TOP Cool
Mechanical Devices newest innovation in thermal testing. Each TP system contains a thermal chuck or thermal plate and a self-contained thermal control unit.The TP chuck and platforms is a breakthrough product that introduced the use of refrigerant for active cooling & heating of wafers and other components with no need of chiller, CDA, or consumable and expensive refrigerants such as liquid nitrogen and liquid carbon dioxide. It can be a perfect replacement system in the industry for uncompromising thermal and mechanical performance with a temperature ranging from -60 to +220°C.
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Thermal Chuck Systems
L-Series
Advanced Temperature Test Systems GmbH
The perfect system for high power applications with an extraordinary performance at a wide temperature range between - 65C and + 300C.Each system contains a high performant liquid-cooling unit.
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Heavy Duty RV Tire Pressure Gauge
DURABLE BUILD: Superior quality steel and components are protected by a rugged rubber guard; Tough, anti-slip grip holds up to any job; Built tough to measure from 0-230 PSI with accurate readingSPECIALIZED CHUCK: Extended chuck tip to form a great seal with no air leakage; Dual-head air chuck painlessly reaches all your vehicles' valves from any angle; Durable rubber hose and an extended head chuck make it easier to get a good fit on awkward valves
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Tabletop Front & Backside Mask Aligner
Model 200IR
The OAI Model 200IR Mask Aligner is a tabletop system that requires minimal clean room space. It is a cost-effective alternative for R&D or limited scale, pilot production. Utilizing an innovative, air bearing / vacuum chuck leveling system, the substrate is leveled quickly and gently, for parallel photo mask alignment and uniform contact across the wafer during contact exposure. The Model 200IR Mask Aligner is capable of one micron resolution and alignment precision. It has an alignment module which features mask insert sets and quick-change wafer chucks that enable the use of a variety of substrates and masks without requiring tools for reconfiguration. The alignment module incorporates micrometers for X, Y, and z-axis.
