Chucks
Hold DUTs in place.
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Product
ECHO VS System with Image Enhancement
Echo VS
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The ECHO VS system adds our Image Enhancement Suite to the ECHO platform to provide industry-leading image quality and defect identification capabilities. It’s our most accurate ultrasonic NDT equipment for development labs and for production environments that require the highest precision. The Echo system can be fitted with an optional chuck for manual wafer inspection.
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Product
Hot Chucks
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Materials Development Corporation
Probe stations to suit all measurement requirementswhether production, engineering or research. See individual data sheets for more details.
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Product
Vacuum Chuck Temperature Controlled Test Stations
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These test stations offer the same reliable repeatable measurement capability of our temperature monitored stations with the added dimension of temperature control.
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Product
Spring Stiffness Testing Machine
STB Series
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Jinan Testing Equipment IE Corporation
STB Computer Control Spring Stiffness Testing Machine Under Axial and Lateral Load is to measure the displacement stiffness of spring under both axial and lateral load, complying with the standard EN13298 Railway applications - Suspension components - Helical suspension springs, steel. The Spring Stiffness Testing Machine measures both axial and lateral stiffness of spring, displacement for both lateral and axial, both loads, offset angle etc. The Spring Stiffness Testing Machine is an ideal testing equipment for spring of chuck and train.
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Product
C-V Plotters
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Materials Development Corporation
MDC will tailor your CSM/Win Semiconductor Measurement System for your exact requirements. Choose the best capacitance meter, output device, and probe station for your needs. All CSM/Win C-V plotters feature the latest Dell Computers. The computer and capacitance meters are rackmounted in one compact enclosure. When ordered with a hot chuck or probe station, MDC can deliver a turnkey system of unparalleled performance.
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Product
Wafer Back Side Cooling System
GR-300 Series
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The GR-300 Series can control gases used to cool the back side of wafers that are fixed in position by an electrostatic chuck system.The stability and accuracy of the GR-300 makes it ideal for controlling the flow of Helium and Argon in wafer cooling systems.
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Product
Probe Card Analyzers
PB6800
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The ITC line of Probilt, probe card analyzers provide fast, accurate and repeatable test data for all types of probe card technologies. Simple user definable vision parameters allow even the newest and most complex probe tip geometries to be captured and accurately measured. Probilt’s PB6800 large measurement chuck allows probe arrays as big as 300 mm in diameter to be touched down without overhanging the chuck surface.
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Product
Thermal Chuck Systems
C-Series
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Advanced Temperature Test Systems GmbH
Looking for a chuck system that gives you the possibility to cool down to - 60C and up to + 300C. The C-Series represents a product line of air cooled thermal chuck systems for a wide temperature range
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Product
Drill Chuck Grips
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Metal rods, wires, and plates and electronic components can be tensile tested using drill chuck grips. Electronic components are tested by placing the metal legs of the components in the grips, allowing different shaped components to be tested with the same set of grips.
