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Wafer
thin crystalline material sliced from ingot.
See Also: Wafer Thickness, Wafer Failure Analysis, Wafer Edge, Wafer Resistivity, Wafer Mapping, Wafer Probes, Wafer Probers, Wafer Inspection, Probe Cards
- Scientific Test, Inc.
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Automated Discrete Semiconductor Tester (ATE)
5000E
Same Proven Technology as all 5000 Series Testers. High Speed Single Test Measure. Capable of Testing Multiple and Mixed Devices. 1KV Standard, 2KV Optional. 1NA to 50A Standard, 100A Optional. 0.1NA Resolution. Complete Self Test. Auto-Calibration. RDSON to 0.1MOHM Resolution. Windows Application Software. Optional Scanner. Optional Wafer Mapping. Optional Curve Trace. MOSFET, IGBT, J-FETTriac, SCR, Sidac, Diac, Quadrac, STS, SBS Transistor, Diode, Opto, Zener Regulator, MOV, Relay. UNDER $23,000.00
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Wafer Demounting And Cleaning Machines
Demounting and cleaning to high throughput fully automatic ingot after cutting in the slicing machine and wire saw.
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Flexible Test And Scan Solution For FFC Devices
Ismeca NY32W
32-position turret test and scan platform for semiconductors on film-frame wafer media, providing the highest inspection yield for WLCSP and Bare Dies. Integrating innovative hardware and software technologies such as intelligent features that enable extended autonomous operation and productivity.
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Wafer Bonder
AML
Wafer bonding has found many applications in the field of MST, MEMS and micro engineering. These include the fabrication of pressure sensors, accelerometers, micro-pumps and other fluid handling devices. The process is also used for first-order packaging of silicon microstructures to isolate package-induced stresses. The OAI AML Wafer Bonder facilitates both the alignment and bonding to be performed in-situ, in a high vacuum chamber. For anodic bonding the wafers are loaded cold and heated in the process chamber. For high accuracy alignment the wafers are aligned and brought into contact only after the process temperature has been reached, thus avoiding differential thermal expansion effects which can compromise alignment. The AML Wafer Bonder is excellent for anodic bonding, silicon direct and thermal compression bonding applications. These features enable the bonder to be used with virtually any processing tool.
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Automated Semiconductor Wafer Optical Inspection and Metrology
SITEview Software
Microtronic SITEview Software is designed from the end-user operator’s perspective and is easy to use, fully featured, and modular. Applications include visual wafer inspection, OCR sorting, wafer defect review, second optical inspection, image storage and retrieval, laser marking, microscope interface, and GEM/SECS II communication and seamlessly integrates with EAGLEview, MicroINSPECT and MicroSORT.
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Automation Equipment
Through its SMART and COMPACT automated equipments, RECIF Technologies proposes a complete offer for wafers/substrates atmospheric handling, and provide IC manufacturers with innovative and configurable solutions responding to wafers and frames handling requirements.
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Absolute Contamination Standards (ACS)
The Absolute Contamination Standard (ACS) is used to calibrate instruments which size and detect particles on the surface of bare silicon wafers. Use ACS to characterize particles, before particles characterize products.
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Photonics Test Solutions
Chroma offers precision instruments such as laser drivers, photodetector monitoring, and temperature controllers. These lab class instruments are often intefrated into production solutions for wafer probe test, burn-in and device or module characterization with inspection, metrology, robotics, Industry 4.0 and more.
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LED Tester For Chip And Wafer
Electrical Testing: Forward：VF,DVF,VFDReverse：VZ,IROptical Testing: can test LOP in cd/mcd/W/mW/lm... from different optical componentsWavelength λp,λd,λc,hw,purity,(x,y),CCT,CRIFour-wire measurement and contact resistance in case of deviation.Auto polarity identification and preheat function.Compatible mechanical interface.Optional ESD static test system or polycrystalline test system
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Tabletop Front & Backside Mask Aligner
Model 200IR
The OAI Model 200IR Mask Aligner is a tabletop system that requires minimal clean room space. It is a cost-effective alternative for R&D or limited scale, pilot production. Utilizing an innovative, air bearing / vacuum chuck leveling system, the substrate is leveled quickly and gently, for parallel photo mask alignment and uniform contact across the wafer during contact exposure. The Model 200IR Mask Aligner is capable of one micron resolution and alignment precision. It has an alignment module which features mask insert sets and quick-change wafer chucks that enable the use of a variety of substrates and masks without requiring tools for reconfiguration. The alignment module incorporates micrometers for X, Y, and z-axis.
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Wafer Probers
Full Automatic Wafer Prober. Semi Automatic Wafer Prober. High Current Probe Block. 6-inch Manual Prober. 8-inch Manual Prober. 12-inch Manual Prober.
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Memory Test System
T5830/T5830ES
Highly flexible tester which has all of the capabilities needed to perform wafer sorting and final testing of price-sensitive flash memories
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Inspection Systems
EVG's metrology solutions for wafer inspection and measurement are optimized for lithography and all types of bonding applications. Customers can choose between integration of the metrology technology within fully-automated equipment, or stand-alone metrology systems serving multiple process steps. EVG's metrology solutions are optimized to maximize our customers' production yields, featuring:
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Manual Semiconductor Metrology System
Front USB port enables easy storage of measurements and other data to flash drivesMTI Instruments’ Proprietary Capacitance Circuitry for Outstanding Accuracy and DependabilityNon-contact measurements76-300 mm diameter wafer rangeOptional wafer measurement ringsWafer stops for exact centeringEthernet interfaceFull remote control software (Windows compatible)Optional calibration wafers
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300mm Single Touchdown Burn-in and Test System
FOX-15
Up to 15 wafers at a time Known Good Die solution Lowers production cost
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Silicon & Compound Wafers
Compound semiconductors are undergoing a major expansion addressing many new applications and using various materials such as SiC, GaN, GaAs and others, to improve the performance of new devices in several segments such as Power and Face Recognition.
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Wafer Back Side Cooling System
GR-300 Series
The GR-300 Series can control gases used to cool the back side of wafers that are fixed in position by an electrostatic chuck system.The stability and accuracy of the GR-300 makes it ideal for controlling the flow of Helium and Argon in wafer cooling systems.
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Advanced Metrology System
NGS 3500L
This top performance system is designed for applications where high-speed defect detection and precision measurements on wafers and other parts are required. It is well suited for use as a dedicated production tool or as a versatile processdevelopment system. It features a powerful set of automated as well as semi-automatic optical/ video tools optimized for high accuracy, production throughput, and ease of use.
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WaferPro Express On-Wafer Measurement Program Software
WaferPro Express software performs automated wafer-level measurements of semiconductor devices such as transistors and circuit components. It provides turnkey drivers and test routines for a variety of instruments and wafer probers. Its new user interface makes it easy to setup and run complex wafer-level test plans, while powerful customization capabilities are enabled by the new Python programming environment.
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High Throughput Wafer Sorter
SortMax300 HT™
Genmark’s SortMax300 HT™ is capable of achieving the highest wafer per hour throughput requirements while operating under strict reliability and cleanliness specifications. Based on modular design it can support configurations up to 8 FOUP/FOSB stations. Highest throughput capacity is a result of expanded technological features including uniquely designed dual end-effector wafer transfer mechanisms based on Genmark’s proven GREX dual arm robot series.
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Electrostatic chucks
Semiconductor substrates such as Si wafers or masks for the next generation of extreme ultraviolet lithography (EUVL) are handled in a vacuum. For nm structures and exact overlay, the reproducibility of the substrate evenness is a crucial factor, as unevenness results in structural distortions. Particles are problematic and heat input as well as thermal expansion must be taken into account.
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MPI Manual Probe Systems
MPI Advanced Semiconductor Test
manual probe systems are open, easy to use and cost effective yet highly accurate. These systems are designed for precision analysis of substrates and wafers up to 150, 200 and 300mm.
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Thermal Controlled Chucks & Plates
TOP Cool
Mechanical Devices newest innovation in thermal testing. Each TP system contains a thermal chuck or thermal plate and a self-contained thermal control unit.The TP chuck and platforms is a breakthrough product that introduced the use of refrigerant for active cooling & heating of wafers and other components with no need of chiller, CDA, or consumable and expensive refrigerants such as liquid nitrogen and liquid carbon dioxide. It can be a perfect replacement system in the industry for uncompromising thermal and mechanical performance with a temperature ranging from -60 to +220°C.
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Integrated Couplers/ Harmonic Mixers
These waveguide bandwidth integrated coupler/mixers are designed to allow phase locking or signal monitoring of compact millimeter wave systems. RF inputs and outputs are on opposite sides of a thin wafer to obtain minimum insertion length. These devices use silicon Schottky barrier beam-lead diodes on a rugged stripline circuit. Nominal coupling value is 10 dB. For coupling values greater than 10 dB, non-directional coupler models are available (consult factory).
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Wafer Analyzer
RAMANdrive
RAMANdrive is the specialized Raman microscope for wafer analysis equipped with our dedicated 300 mm stage. RAMANdrive gives you an ultra-fast, highest resolution analysis of the whole wafer with unique stability and accuracy
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Wafer Inspection System
AutoWafer Pro™
AutoWafer pro is our most advanced ultrasonic equipment for detecting defects in bonded wafers in a production environment, providing fast, high-resolution scanning of 200mm and 300mm bonded wafers.
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Dicing Machines
Dicing machine cut wafers into individual semiconductor chips with blades. ACCRETECH Laser dicing machines use lasers instead of blades to dicewafers at high speed in a completely dry process.
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Solar Wafer Transfer Tool
Dou Yee Enterprises (S) Pte Ltd
Dou Yee Enterprises Solar Wafer Transfer Tool
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Wafer/Dicing Frame Prober
WDF 12DP+
The WDF 12DP is a prober/handler capable of transporting and testing standard 300-mm wafers and dicing frames without need of a changeover kit. To support multiple tests after dicing, it has a special positioning function that differs from former types, as well as image-processing functions such as wafer level packaging.
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Semiconductor & Flat Panel Display Inspection Microscopes
MX63 / MX63L
The MX63 and MX63L microscope systems are optimized for high-quality inspections of wafers as large as 300 mm, flat panel displays, circuit boards, and other large samples. Their modular design enables you to choose the components you need to tailor the system to your application. These ergonomic and user-friendly microscopes help increase throughput while keeping inspectors comfortable while they do their work. Combined with OLYMPUS Stream image analysis software, your entire workflow, from observation to report creation, can be simplified.
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Silicon Heavy-doped Pen Tester
HS-MPRT
Heavy doped testing, especially good for purchase the material.■ Not only sound alarm, but also Led light alarm , to guarantee sorting work accurately.■ adaptable for sorting little granular material, little broken IC Wafer and other little silicon material.■ Can set alarm ranges from 0.0 to 1.0Ω﹡㎝.
