Sockets
receive conductors.
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Product
Custom Sockets
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Plastronics socket designs range from off-the-shelf sockets ready for immediate delivery, semi-custom sockets that utilize universal components and totally custom one-of-a-kind sockets and fixtures.
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Test Sockets
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Yamaichi Electronics Co., Ltd.
A test socket is the ideal point to test your home’s internal phone wiring for faults. You can also use it to identify any potential faults with the phone line outside. Your test socket is located in your master socket. It is the point between the internal phone wiring in your house and the phone line outside. That means by plugging into your test socket you can bypass all the internal wiring and test your device directly on the phone line.
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LGA Sockets
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We’ve taken our QFN expertise and combined it with the versatility and performance of the H-Pin® to leverage an LGA socket platform that serves the demanding requirements of today’s market. Plastronics LGA sockets using the H-Pin provide a high-performance socket that is affordable for all burn-in operations. These LGA sockets meet the power, temperature and signal performance needs of the higher density, larger package outline, and sometimes mix-pitch LGA designs. The LGA platform serves package sizes from as small as 2.0mm X 2.0mm to the industry’s largest standard socket for 60.0mm X 60.0mm packages.
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Silver Ball Matrix Sockets
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SM Contact is a unique contact that has precise silver balls held together by a proprietary conductive formulation. These conductive columns (diameter optimized for 50 ohm impedance) are suspended in a non-conductive flexible elastomer substrate with a patented solid core for enhanced durability and reliable performance over time, temperature and cycles. This flexible substrate is very compliant and resilient and enables the conductive columns to revert back to original shape when the force is removed. Solutions are available for 0.25mm to 1.27mm LGA, BGA, QFN, CSP, POP, WLP and other packages. The silver ball matrix contact technology is also available with a protective plunger matrix (a gold plated copper cylinder) that sits on top of the conductive columns. This plunger matrix protects the conductive column from contamination from various solder ball interfaces. A quickly replaceable plunger matrix enables minimal downtime during final production test. The product family code for this line of sockets is SMP.
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Qualification Hardware & Sockets
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Reltech Limited holds over 35 years’ experience in the design and manufacture of all types of qualification test hardware. Our advanced technology products include: HTOL Boards (Mother and Daughter cards) Burn-In Boards HAST Boards THB (humidity) Boards Burn-In Modules and frames Dynamic Driver cards (Digital, Analogue and Mixed signal) Back Planes Voltage regulator cards Custom electro-mechanical assemblies DUT Cassettes and test Fixtures
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High Performance Chipscale Test Sockets
SC
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Ardent Concepts Test Sockets for ATE test deploy patented SC Contact Sets. This technology is capable of over 2 Million mechanical insertions in production environments and uses easy to replace pins with no complicated assembly procedure. It is designed to be drop-in compatible with 1mm offset and straight through footprints to ease implementation, and RC SC’s simple and robust design is extremely cost effective when compared with existing “roll” type test contactors and sockets. Designed specifically for JEDEC QFN and MLF applications, SC High Performance Test Sockets are available for most handler set-ups and offer exceptional AC performance.
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Test Sockets
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Smiths Interconnect offers a wide range of spring contacts and design standards for high quality test sockets providing flexibility and fast delivery for optimal cost/performance ratio.
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Test Sockets
MEMS Device
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Patented MEMS Sockets from Ardent Concepts use a unique scrubbing action contact set which is ideal for today’s sensitive MEMS devices, including accelerometers, gyroscopes, MEMS microphones and other specialized devices used in mobile electronics applications
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Burn-In Test Sockets
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The selection of the test socket is critical to the performance of a device during qualification testing where electrical bias and signals are applied. Key factors such as mechanical compatibility, operating temperature, ability to withstand high moisture levels, signal speed and lead inductance/capacitance all need to be taken into account when selecting the best socket for the test application.
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Aspen Sockets
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Ironwood Electronics’ Aspen line of sockets are designed in standardized stepped footprint configurations, incorporating industry standard high performance spring pins. Sockets can be designed to work with any type of IC package; BGA – LGA – QFN – DFN and even leaded devices where you have minimal space to fit a socket in place of your device to allow fast, easy testing and development.
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Product
Test Sockets
BGA/LGA
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There are a lot of options when it comes to bench test sockets. Save yourself and your lab time, money and frustration by working with Ardent for truly customized test socket solutions to meet your needs and do the job with high performance, reliability and quick turnaround that you need and deserve.
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Custom Test Sockets
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RTI specializes in producing custom test sockets We work with your engineering team from prototype to production, ensuring your product meets your test requirements. Contact us for a free quote.
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Sockets
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Ironwood Electronics Sockets – Embedded gold plated wire elastomer (SG) – Stamped & Etched spring pins (SBT) – Embedded silver ball elastomer matrix (SM/SMP)– Compressible silver button in polyimide (GT/GTP)– Surface mount adapters for sockets (SF)
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Module Sockets
Ardent Optical Engine
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The scalability of SP connector technology is enabling the next generation of optical device IC manufactures to allow for solder-less high speed optical Electrical Module replace-ability. These connectors offer high speed input data rates in cost effective and real-estate friendly form factors.
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MultiSite Test sockets and Wafer Level
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multi-site sockets include anything from strip test sockets to test sockets for wafer test to multi-position, singulated devices. The advantages of these sockets can be enormous as test time can be decreased by a factor of ten over conventional one up testing. In most cases, the throughput is only limited by tester capabilities and/or handling capacity.
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Open Top BGA Sockets
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Ironwood has the most comprehensive collection of open top BGA and QFN sockets that can be used for qualification application, silicon FIB testing, system development, thermal characterization, burn-in application, etc. IC socket can be defined as an electromechanical device, which provides removable interface between IC package and system circuit board with minimal effect on signal integrity. Typical packages include BGA, LGA, QFN, QFP, WLCSP, etc. Open top allows access to the top side of IC. Below is an example BGA socket that uses low cost elastomer contact technology.
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Off-Set Kelvin Test Sockets
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This is an innovative and robust contact technology for making Kelvin contact to 0.5mm pitch QFNs. The contact uses a tip that is angled to one side, matched to an orientation that's flat on the tip. Two such contacts placed in opposition will touch the pad within 0.125mm. And because the tip is offset, the probe diameter is a robust 0.39mm and the load board pad pitch remains 0.5mm.
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4G Concurrent Device Programmer for PC /USB (4 sockets)
ProMax 4G
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ProMax is the most innovative and cost effective 4- or 8-gang programming solution on the market. ProMax supports a wide variety of programmable devices. Its state-of-the-art technology and high-speed programming algorithms optimize throughput, reliability and yields.
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Fanless Embedded System With LGA1151 Socket 7th/6th Gen Intel® Core™ I7/i5/i3 & Celeron® Processor, Intel® Q170, HDMI, DVI-D, VGA, 8-CH PoE, 6 USB And 24 VDC
eBOX671-517-FL
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The eBOX671-517-FL supports 8-port Gigabit PoE and able to work under harsh temperatures. Its eight Gigabit PoE ports allow multiple cabling to cameras and any PoE power device; and, the eBOX671-517-FL is specifically designed for security surveillance, optical inspection, and edge computing applications. This rugged NVR embedded box PC is powered by the 7th/6th generation Intel® Core™ (Kaby Lake/Skylake) or Intel® Celeron® processors with a 35W/65W TDP and comes with Intel® Q170 chipset. The eBOX671-517-FL comes in great expansion possibilities, including a flexible I/O module slot with a wide selection of PCIe Mini modules and four PCI Express Mini Card slots. It also has two front-accessible SIM slots and four SMA-type antenna connectors. For storage, this high performance fanless embedded system has two SATA HDD drive bays with a height of up to 15 mm and one optional mSATA for RAID 0 and 1. Moreover, the embedded device supports two non-ECC 260-pin DDR4 SO-DIMM slots for up to 32GB of system memory.
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CDNs
AF Series
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The AF series CDNs are for unshielded cables with two, four and eight conductors carrying low current. AF series CDNs are supplied 2 mm shrouded banana sockets
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COM Express Type 6 Compact Module With Intel® Atom™ Processor E3845
CEM843
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The CEM843 Intel® Bay Trail SoC system-on-modules come with 6 PCI Express lanes, eight USB signals, double deck DDR3L SO-DIMM sockets supporting up to 8 GB of system memory, and two SATA-300. The CEM843 utilizes quad cores Intel® Atom™ processor E3845, featuring a wide operating temperature range from -40°C to 85°C. The power-efficient compact module is designed with all necessary components and offers the most updated bus interfaces targeting at POS and kiosk systems, gaming, medical PCs, human machine interface, IoT & M2M-related and industrial automation controllers.
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Product
3.5 Digit LED Voltmeter (BLUE)
SP 300-BLUE
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The SP 300 is a 3 digit LED voltmeter with 9mm (0.36") digit height. It features 200mV d.c. full scale reading, auto-zero and auto-polarity. The meter plugs directly into an 8-way SIL socket and can be fitted into a panel via the fixing clip. Splashproof protection to IP65 is achieved by fitting the seal supplied
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4-slot Fanless Industrial System With 4th Gen Intel® Core™ I7/i5/i3 & Celeron® Processor (up To 3.3 GHz), Intel® Q87 Chipset, And Front-access I/O And PCIe/PCI Slots
IPC934-230-FL
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To provide excellent computing capability, the high performance IPC934-230-FL industrial PC is equipped with the newest 4th generation Intel® Core™ i7/i5/i3 or Celeron® processor in 22nm process and Intel® Q87 Express chipset. Total four PCI/PCIe expansion slots allow installation of a variety of off-the-shelf PCI/PCIe cards for configurable applications. The rugged Intel® Hasewell fanless industrial computer is an ideal fit for automatic optical inspection, digital signage appliance, POS/kiosk, embedded controller, factory automation and many more applications.The 4-slot industrial PC is guaranteed to operate reliable in temperature ranging from -10°C to +50°C and is equipped with a 10~30 VDC 150W wide range power supply for mission-critical environments. It supports an easy-to-install fan module to dissipate heat generated within the system when high power consumption PCI/PCIe cards are installed. The all-in-one industrial embedded computer provides rich I/O connectors include two 2.5” SATA HDD, one CFast™ socket, four COM ports (one RS-232/422/485, three RS-232), two USB 3.0 ports, four USB 2.0 ports, dual Gigabit Ethernet, PS/2 ports, one DIO, audio and DVI-I. Moreover, the IPC934-230-FL supports various power protection including OVP (Over voltage protection), OTP (over temperature protection), OPP (over power protection) and SCP (over circuit protection) for more system safety.
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Fanless Embedded System With Intel® Celeron® J1900 2.0 GHz, HDMI, VGA, 2 GbE LAN, 4 USB And 2 COM
eBOX625-842-FL
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The eBOX625-842-FL industrial-grade, extreme slim, fanless embedded system is powered by quad cores Intel® Celeron™ J1900 2.0GHz SoC (system-on-a-chip). Through the use of Intel® Bay Trail-D type quad-core SoC and one 8 GB DDR3L-1066/1333 SO-DIMM socket, the energy-efficient embedded box computer offers outstanding performance, yet remarkably power efficient experience. Dramatically lighter and rugged enclosure enables the compact system to fit into limited space and withstand any harsh industry environment. The eBOX625-842-FL features dual displays and rich connection capability, including VGA, HDMI, 2 LAN ports, 2 COM ports, 4 USB 2.0 and 8-channel DI/DO, providing an ideal solution for variety applications from digital signage, transportation, kiosk, industrial control automation, medical equipment and IoT & M2M applications.
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Product
Fuse Buddy
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Designed specifically for circuit testing, Fuse Buddy plugs right into fuse socket - easy connection for circuit current testing.
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Product
International Power Source
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The Interpower® International Power Source (IPS) provides a low-cost, convenient source of AC power at various operating voltages and frequencies found around the world (typically 110-240VAC/50-60Hz) which is important for testing any products that are exported. Output power is delivered through one of two ranges: Low range (10-138VAC) through a standard NEMA 5-20 socket and High range (10-276VAC) through any of the six standard international sockets so that products can be conveniently powered during development or just prior to shipment.
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Tester, US Mains Socket
72-6861
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The 72-6861 is a Receptacle Tester with 3-indicator light. 2nd-Amber indication for ground contact (Open ground) and 3rd-amber indication for neutral contact (Open neutral) not connected, for hot and ground contacts interchanged indication by red and amber. If 2-amber indication occurred, receptacle is wired correctly.
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QFN Sockets
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With the largest QFN catalog in the world, Plastronics has taken a leadership role in designing and developing socket solutions for the newest QFN packages. These sockets offer a modular design in a small outline with very low inductance. The Open Top QFN socket allows for more convenient package loading and unloading in most of the same lead count options as the lidded version.
