Sockets
receive conductors.
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Product
Aspen Sockets
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Ironwood Electronics’ Aspen line of sockets are designed in standardized stepped footprint configurations, incorporating industry standard high performance spring pins. Sockets can be designed to work with any type of IC package; BGA – LGA – QFN – DFN and even leaded devices where you have minimal space to fit a socket in place of your device to allow fast, easy testing and development.
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Product
Test Sockets & Interposers
Silmat
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Innovative technology platforms and multiple product families for BGA, LGA, QFN and CSP packages down to 0.3mm pitch. High frequency bandwidth > 40 GHz..
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Product
Evaluation Modules And Sockets
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Figaro USA offers a wide range of evaluation modules and sockets for test use.
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Product
Module Sockets
Ardent Optical Engine
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The scalability of SP connector technology is enabling the next generation of optical device IC manufactures to allow for solder-less high speed optical Electrical Module replace-ability. These connectors offer high speed input data rates in cost effective and real-estate friendly form factors.
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Product
Custom Sockets
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Plastronics socket designs range from off-the-shelf sockets ready for immediate delivery, semi-custom sockets that utilize universal components and totally custom one-of-a-kind sockets and fixtures.
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Product
Off-Set Kelvin Test Sockets
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This is an innovative and robust contact technology for making Kelvin contact to 0.5mm pitch QFNs. The contact uses a tip that is angled to one side, matched to an orientation that's flat on the tip. Two such contacts placed in opposition will touch the pad within 0.125mm. And because the tip is offset, the probe diameter is a robust 0.39mm and the load board pad pitch remains 0.5mm.
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Product
Test Sockets
QFN/QFP
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For today’s chipscale packages, finding the right socket solution can be challenging. With SC™ sockets from Ardent, you can count on the right design, the best performance, and quick turns for even the most challenging custom designs
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Product
Test Sockets
MEMS Device
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Patented MEMS Sockets from Ardent Concepts use a unique scrubbing action contact set which is ideal for today’s sensitive MEMS devices, including accelerometers, gyroscopes, MEMS microphones and other specialized devices used in mobile electronics applications
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Product
Relay Sockets & Accessories For Power Relays
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Suitable for 35mm rail (DIN), wall or PCB mounting, timer modules, key receptables and retaining clips. See below for all models/series.
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Product
Test Sockets
BGA/LGA
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There are a lot of options when it comes to bench test sockets. Save yourself and your lab time, money and frustration by working with Ardent for truly customized test socket solutions to meet your needs and do the job with high performance, reliability and quick turnaround that you need and deserve.
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Product
Test Sockets
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Yamaichi Electronics Co., Ltd.
A test socket is the ideal point to test your home’s internal phone wiring for faults. You can also use it to identify any potential faults with the phone line outside. Your test socket is located in your master socket. It is the point between the internal phone wiring in your house and the phone line outside. That means by plugging into your test socket you can bypass all the internal wiring and test your device directly on the phone line.
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Product
Test Sockets
Non Standard
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Chances are good Ardent can help you with that. We can adapt our technology to just about any package, device or module. Small volumes of custom sockets for higher bandwidth applications are a niche all in their own, and our engineering team has many years of experience designing custom sockets for all kinds of applications.
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Product
Test Sockets
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Smiths Interconnect offers a wide range of spring contacts and design standards for high quality test sockets providing flexibility and fast delivery for optimal cost/performance ratio.
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Product
QFN Sockets
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With the largest QFN catalog in the world, Plastronics has taken a leadership role in designing and developing socket solutions for the newest QFN packages. These sockets offer a modular design in a small outline with very low inductance. The Open Top QFN socket allows for more convenient package loading and unloading in most of the same lead count options as the lidded version.
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Product
Qualification Hardware & Sockets
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Reltech Limited holds over 35 years’ experience in the design and manufacture of all types of qualification test hardware. Our advanced technology products include: HTOL Boards (Mother and Daughter cards) Burn-In Boards HAST Boards THB (humidity) Boards Burn-In Modules and frames Dynamic Driver cards (Digital, Analogue and Mixed signal) Back Planes Voltage regulator cards Custom electro-mechanical assemblies DUT Cassettes and test Fixtures
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Product
Burn-In Test Sockets
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The selection of the test socket is critical to the performance of a device during qualification testing where electrical bias and signals are applied. Key factors such as mechanical compatibility, operating temperature, ability to withstand high moisture levels, signal speed and lead inductance/capacitance all need to be taken into account when selecting the best socket for the test application.
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Product
3.5" Embedded SBC With Intel® Pentium® Processor N4200 & Celeron® Processor N3350, VGA/LVDS, Dual LANs And Audio
CAPA318
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The CAPA318 features the Intel® Pentium® processor N4200 or Celeron® processor N3350 (codename: Apollo Lake) with low power consumption. The integrated 3.5-inch embedded board is highly expandable and customizable. It comes with RS-232 ports, USB 3.0 ports, USB 2.0 ports, IN/OUT digital I/O ports, VGA port, LVDS port, and Gigabit Ethernet ports with Intel® i211AT Ethernet controller. For storage needs, the CAPA318 provides one SATA-600 socket and one mSATA interface. Additionally, Its compact and fanless design makes it perfect for use in space constricting environments. Additionally, the 3.5” single board computer can handle a wide operating temperature range from -20°C to +70°C (-4°F to +158°F) and requires +12V DC power input to ensure operational stability in a variety of harsh environments. This cost-effective 3.5” embedded motherboard is suitable for IoT/M2M related applications, industrial control, self-service terminals, digital signage, POS/kiosk displays, just name a few.
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Product
RC BGA Interposer, LPDDR4 200-ball, Rigid, Connects Using 2x U4207A
W6602A
Interposer
The W6602A LPDDR4 rigid RC BGA interposer for LPDDR4 200-ball DRAM enables capture of simultaneous read and write traffic at data rates and has been tested to 3200 MT/s. Two U4207A zero Ω, 34-channel, soft touch pro, single-ended, 4 x 160-pin direct connect probes are required to connect the W6602A LPDDR4 BGA interposer into two U4164A logic analyzer modules. The W6602A LPDDR4 rigid RC BGA interposer allows signal access to the LPDDR4 signals critical to your debug and validation effort through a U4164A logic analyzer system. The probe works in existing designs and eliminates the need for up-front planning or redesign. The probe connects directly to the balls of the DRAM using a LPDDR4 200-ball riser (included) or an optional 3rd party socket (not provided), enabling operation and acquisition of LPDDR4 signals.
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Product
Fanless Embedded System With Intel® Celeron® Processor N3160, VGA, HDMI, 4 COM, 2 GbE LAN, 4 USB, 2 PCI Express Mini Card Slots And 9 To 36 VDC
eBOX626-853-FL
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The eBOX626-853-FL is a slim-type fanless embedded system with wide range temperature and wide range DC input support. The cost effective compact embedded box PC is designed to support the Intel® Celeron® processor quad-core N3160 (codename: Braswell) integrated with Intel® Gen 8 graphics and DirectX 11.1. One DDR3L 1333/1600 SO-DIMM socket supports up to 8 GB memory. The IP40-rated industrial computer eBOX626-853-FL combines low power consumption with high performance graphics and computing for smart automation, transportation, industrial gateway, multiple media kiosk and other IoT&M2M applications.
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Product
PXI/PXIe Power Relay Module,5 Amp, 50-Pin SGMC Connectors
40-158-001-HI
Relay
The 40/42-158-001-HI is a PXI/PXIe high density power relay module with 32xSPDT switches rated at 5A and includes the hardware interlock option. User connection is via 2x50-pin SGMC male connectors, hardware interlock is via a 4-pin 00 series socket (mating plug is supplied). The 40/42-158 range is available in 8, 16, 24 or 32 SPST configurations with or without hardware interlock.
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Product
3U CompactPCI Mini PCI, Mini PCIe Carrier Board
cPCI-3W10
Carrier Board
- Supports 32bit, 33/66MHz CompactPCI® bus- One SIM card socket- One Mini PCI and one Mini PCIe socket- PICMG® 2.0 R3.0 compliant
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Product
ATX Motherboard With LGA1150 Socket 4th Gen Intel® Core™ Processor, Intel® Q87, USB 3.0, SATA 3.0, Dual LANs, DisplayPort, VGA, HDMI And MSATA
IMB211
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The IMB211 is industrial-grade ATX motherboard with a full-range of integrated peripherals for general industrial and embedded applications. The IMB211 is based on 4th Generation Intel® Core™ i7/i5/i3/ Celeron® processors in LGA1150 socket with Intel® Q87 Express chipset. Four 204-pin DDR3-1333/1600 slots provide a maximum memory capacity of 32 GB to improve overall system performance. This industrial-grade high performance motherboard also supports Intel® Active Management Technology 9.0 (iAMT 9.0), SATA RAID, and triple-display capability through DisplayPort, HDMI and DVI-I interface. The board helps users to deploy more responsive, high-performance, graphic performance systems for advanced communication, gaming, industrial and automation applications.
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Product
Embedded Transceivers
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Embedded transceivers are chip-sized components based on 850 nm VCSELs and offer bandwidth up to 300 Gbps for short reach applications (<300 m). These transceivers can be soldered or socketed to a printed circuit board and are well suited for small, compact systems requiring high I/O density, low power, and small space. Many of these transceivers have been qualified to operate in harsh environments, such as the ones found in space, and aerospace and defense applications.
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Product
Ethernet To Modbus RTU Interfaces
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ICS's Ethernet to Modbus Interfaces provide Modbus TCP/IP to Modbus RTU serial conversion and Raw Socket (Telnet) to control Modbus RTU Slave Devices. Available in small Minibox™ and OEM board formats. OEM board has Ethernet, GPIB and USB interface ports. All Interfaces include the VXI-11 protocol for use with: LINUX, UNIX, SunOS, Apple OS X, HP-UX, IBM-AIX and Windows 2K or later Windows systems.
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Product
3.5” Embedded SBC With AMD® RYZEN™ Embedded V1807B/V1605B APU, DisplayPort, 2 HDMI, LVDS And 4 GbE LAN
CAPA13R
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The CAPA13R is powered by the onboard AMD RYZEN™ Embedded V1807B/V1605B processor with Radeon™ Vega graphics. The 4K embedded board is well-suited for graphics-intensive applications such as medical imaging, video surveillance, 3D simulators, optical quality control, digital signage, kiosks/POI, thin clients, and more. The integrated AMD RadeonTM RX Vega graphics with support of DirectX 12 and OpenGL 4.5 marks the cutting edge of embedded graphics. The CAPA13R can deliver truly impressive user experiences and outstanding 3D graphics quality through two HDMI, one DisplayPort and one LVDS interfaces. Its onboard CPU is attached on the rear side of the board, which can aid with heat dissipation and offers flexibility for easy system integration and minimum maintenance. Moreover, the CAPA13R offers multiple expansion interfaces with one M.2 Key E slot for wireless modules and one M.2 key B slot for storage cards. One 260-pin SO-DIMM socket on the CAPA13R supports up to 16GB of DDR4-2400 (V1605B) and DDR4-3200 (V1807B) memory. The system has a +12V DC power input.
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Product
PLCC-to-DIP Adaptor
Series 352000/353000
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PLCC to DIP Adapter. Converts PLCC packaged ICs to DIP footprints. Available with PLCC sockets or PLCC pads on top side. Consult factory for panelized form or for mounting of consigned ICs.
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Product
Universal SOIC ZIF (Zero-Insertion-Force) Test Socket
Series 547
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Universal SOIC Zero Insertion Force Test Socket. Devices with up to 44 pins can be inserted without bending or otherwise damaging the legs, since no force is required to either insert or remove the component from the socket. Accepts SOIC gull-wing and J-lead devices, up to 44 pins on .050 [1.27] lead pitch, body widths from .150 to .600 [3.81 to 15.24].
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Product
H009 Module
M4KH009
Module
H009 modules can operate as a Central Computer Complex (CCC) and/or up to 16 Peripheral Units (PUs) simultaneously, or as a Bus Monitor. In addition, a Concurrent Bus Monitor enables concurrent monitoring of the bus during CCC and PU simulation. The module also supports error injection and detection, and all control parameters and data may be updated in real time. Note: The M4KH009 Module is a "double size" module, and occupies two vertically adjacent sockets in the EXC-4000 carrier Board.
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Product
Open Pluggable Specification (OPS) Digital Signage Player With Intel® Core™ I7/i5/i3 Processor
OPS875
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*Open Pluggable Specification (OPS) compliance*Socket G2 (rPGA988B) 3rd gen Intel® Core™ i7/i5/i3 processor*Intel® HM76 chipset*DDR3-1600 SO-DIMM, up to 8GB*2 USB 3.0 ports and 1 PCIe Mini Card slot*Pluggable HDD for easy maintenance*Easy to change DRAM*HDMI for 2nd display
