Deposition
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Product
In-Situ Spectroscopic Ellipsometer for Real-Time Thin Film Monitoring
UVISEL Plus In-Situ
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The UVISEL Plus in-situ spectroscopic ellipsometer can be easily mounted on process chambers (PECVD, MOCVD, sputter, evaporation, ALD, MBE) for the real-time control of thin film deposition or etch processes.The UVISEL Plus in-situ provides the unique combinations of very high speed, sensitivity, dynamic range and accuracy making the instrument able to control deposition / etch at the atomic layer thickness level, even for rapid processes.
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Product
ALD Knowledge Center
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As one of the first companies to market with a flexible commercially available atomic layer deposition system (ALD), we have a tremendous ALD Knowledge Center for researchers to draw upon. We have gathered together a wide range of information about ALD applications and thin films technology. This includes images and explanations of the exciting uses for ALD. We also gather and provide access to theses on the subject and a searchable database of scientific abstracts.
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Product
Air Quality Measurement
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Air pollution measurement is the process of collecting and measuring the components of air pollution, notably gases and particulates. The earliest devices used to measure pollution include rain gauges, Ringelmann charts for measuring smoke, and simple soot and dust collectors known as deposit gauges.
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Product
Microelectronics And Packaging AOI
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Machine Vision Products, Inc. has extensive experience in a wide range of Microelectronics and Packaging applications. MVP works with the world’s leading manufacturers on a global basis. From multiple die and wire technologies to leadframe, ball grid array and surface inspection applications, MVP has the widest applications toolbox of any AOI provider. MVP takes pride in the fact that they supply many complex inspection solutions to diverse industries such as Automotive, Telecoms, Medical Devices, Military, and Space. MVP’s 900 Series is the base platform upon which all Microelectronics and Packaging inspection solutions are based. The 900 series 2D capabilities provide metrology and defect detection using a propriety Quad-Color lighting, Telecentric optics and resolutions down to 1um. 3D height measurement capabilities allow for in-line high speed inspection of Dies, paste deposition, positional accuracy, volume and height with a resolution down to 1.13um.
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Particle Deposition Systems
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MSP’s 2300G3 Particle Deposition System sets the standards for wafer inspection and metrology equipment. This advanced tool is vital for increasing the yield of future leading-edge devices, while meeting the measurement needs of today.
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Product
Packaging Manufacturing
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KLA’s extensive portfolio of packaging solutions accelerates the manufacturing process for outsourced semiconductor assembly and test (OSAT) providers, device manufacturers and foundries for a wide range of packaging applications. Innovations in advanced packaging, such as 2.5D/3D IC integration using through silicon vias (TSVs), wafer-level chip scale packaging (WLCSP), fan-out wafer-level packaging (FOWLP) and heterogeneous integration as well as a wide range of IC substrates create new and evolving process requirements. KLA offers systems for packaging inspection, metrology, die sorting and data analytics focused on meeting quality standards and increasing yield before and after singulation. SPTS provides a broad range of etch and deposition process solutions for advanced packaging applications. Orbotech offers a portfolio of technologies that includes automated optical inspection (AOI), automated optical shaping (AOS), direct imaging (DI), UV laser drilling, inkjet/additive printing and software solutions to ensure manufacture of the highest quality of IC substrates.
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Product
Trace Moisture Analyzer
Model 8800P
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Teledyne Analytical Instruments
The 8800 series uses field proven aluminum oxide (Al2O3) sensing technology to accurately detect trace moisture on either a continuous or spot checking basis. All Al2O3 sensors share the same basic operating principle: the capacitance measured between the sensor’s aluminum core and gold film deposited on the oxide layer varies with the water content. The 8800 series moisture sensor employs unique Hyper Thin Film (HTF) technology, which offers three major structural improvements in Al2O3 sensor design. These structural changes, noted below, provide the user with increased sensitivity, greater stability and a quicker response time when compared to other conventional aluminum oxide sensors on the market today.
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Product
Ozone Generators & Systems
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MKS offers a wide range of ozone generators and modular delivery systems which produce ultra-pure, reliable ozone gas. In the clean semiconductor environment, Ozone reacts with a wide range of precursor gases resulting in the creation of Al2O3, ZrO2, HfO2, and La2O3 metal oxides to enable thin film deposition processes like Atomic Layer Deposition (ALD) and Etch (ALE). MKS’ generator uses Grade 6 gas, enabling the creation of higher film density improving product yield. Photovoltaic and Display manufacturing leverage semiconductor best practices and utilize ozone to create enhanced thin film barriers, improving product performance and reliability.
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Product
Physical Vapor Deposition Systems
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Physical Vapor Deposition (PVD) systems use physical processes, like sputtering and evaporation, to deposit thin films with exceptional purity and control. These techniques are widely used in semiconductor manufacturing, optical coatings and protective applications.
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Product
Pure Boron Foils
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MICROMATTER™ boron foils are also produced by laser plasma ablation; however, the deposition process is much more complex and time consuming than that for diamond-like carbon. Accordingly, only thin films, mainly designed for beam stripping of heavy ions in electrostatic accelerators, are available. All films are generally delivered on glass substrates coated with a release agent.
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Product
ALD Applications
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Atomic Layer Deposition (ALD) has the potential to optimize product design across a wide array of applications from making silicon chips run faster, to increasing the efficiency of solar panels, to improving the safety of medical implants.
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Product
ALD Periodic Table
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The ALD Periodic Table is a visual guide to the elemental building blocks of atomic layer deposition. Organized by both chemistry and purpose, it helps engineers quickly find materials that meet their priorities, whether that’s conductivity, durability, clarity or thermal stability.
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Product
ALD
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Atomic Layer Deposition (ALD) offers precise control down to the atomic scale.Atomic layer deposition holds tremendous promise across a wide array of industries, including energy, optical, electronics, nanostructures, biomedical, and more. Please check out our Applications section for more details in any and all of these areas.
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ALD Advantages
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Atomic Layer Deposition (ALD) stands out for one reason: control. The most significant advantages of thin film deposition via Atomic Later Deposition over other methods, are manifest in four distinct areas – film conformality, low temperature processing, stoichiometric control, and inherent film quality associated with the self-limiting, and self-assembled nature of the ALD mechanism ALD is exceptionally effective at coating surfaces that exhibit ultra high aspect ratio topographies, as well as surfaces requiring multilayer films with good quality interfaces technology. This thin-film process builds materials one atomic layer at a time, delivering unmatched uniformity and sub-nanometer precision, even on complex 3D structures. That level of accuracy makes ALD a critical technology for advanced semiconductor manufacturing, flexible electronics, and materials research.
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Product
Plasma Emission Controller
RU-1000
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The optical technology developed by HORIBA and the gas control technology offered by HORIBA STEC have been combined to make further advances in plasma control technology. The plasma emission controller RU-100 offers; faster deposition by controlling the transition region, optimized distribution in a large-area, high-capacity chamber, plasma stabilization in a long sputtering process (stable deposition), and mixture optimization of compounds for reactive sputtering.
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Product
Multi-Element Standards
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These multi-element standards consist of multi-layer thin film coatings, one on top of the other, upto a maximum of 6 elemental coatings. It is generally recommended to have coating thicknesses < 20 µg/cm2, so as to cause negligible notable matrix effects, in particular absorption of X-rays emitted in lower deposits by those covering them.
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Product
EpiStride SiC CVD System
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Veeco’s latest technology for the compound semiconductor market enables high-performance chemical vapor deposition of Silicon Carbide for both 6 and 8-inch wafer production. The platform enables a return to production in under 5 hours after routine cleaning maintenance. The EpiStride system’s high uptimes, short cycle times and overall stable performance lead to the lowest cost of ownership per wafer compared to competitive systems.
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Product
Sputtering Systems
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Known for precision and cleanliness, Veeco Ion Beam Sputtering (IBS) systems are ideal when engineers need tight control over film thickness, composition, and optical performance. Using a focused ion beam, IBS dislodges atoms from a target, depositing them onto a surface in smooth, ultra-uniform layers.
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Product
Spectrometer
AirSPEC
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Baltic Scientific Instruments, Ltd
Scintillation gamma-ray spectrometer AirSPEC is intended for measuring scintillation spectra and alsofor determination of activities and specific activities of radionuclides in samples and in conditions of natural occurrence in geometries 2 and 4.Spectrometercan be usedfor various tasksradiation monitoring, including the definition ofspecific effective activity of naturally occurring radionuclides (NORM) in building materials (granite,crushed stone, gravel, etc.), raw materials, products, waste industrial productionand rockswithoutsampling; measurements surface activity of the radionuclide 137Cs (and other); mass fraction of NORM in rocks andoresin the conditions oftheirnatural occurrence on a surface, inboreholes and in warehouses andtransportcontainers, and also in study ofsurface contaminationof soil,as well asprospecting and exploration ofmineral deposits resources.The spectrometercan be used forworkin the laboratoryand in the field conditions.
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Product
kSA Emissometer
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The kSA Emissometer is designed to quickly and easily generate high-resolution diffuse and specular reflectance and total emissivity maps of MOCVD carriers. Carrier emissivity variation means temperature non-uniformity, which can lead to reduced device yield and possibly complete growth run failure. With the kSA Emissometer, emissivity changes can be tracked to determine carrier end-of-life, without wasting growth runs. The kSA Emissometer also detects unwanted residual deposits after baking, and easily identifies carrier surface defects, scratches, microcracks and pits that are not visible to the eye.
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Product
Excitation Sources
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SPECS Surface Nano Analysis GmbH
o our customers in research and industry we offer a variety of sources for deposition, excitation and charge neutralization as well as analyzers and monochromators. Most of our sources originate from product lines which we have taken over from Leybold AG, Cologne, and from VSI GmbH. The X-ray monochromator Focus 500 and the UV monochromator TMM 302 are original developments by SPECS.
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Product
Optical Fiber Type Hot Phosphoric Acid Concentration Monitor
CS-620F
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In 3D NAND manufacturing process, dozens of layers of SiO2 and SiN are deposited, and the SiN layer is selectively removed using hot phos.In this process, the desired etching rate can be achieved by controlling the concentration and temperature of the chemical solution.Previous products have difficulty to measure high temperature chemicals, but the CS-620F is able to measure at high temperatures up to 170 C degrees.
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Product
PED Systems
Pulsed Electron Deposition
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Is a process in which a pulsed (80-100 ns) high power electron beam (~1000 A, 15 kV) penetrates approximately 1 μm into the target resulting in a rapid evaporation of target material. The non-equilibrium heating of the target facilitates stoichiometric ablation of the target material. Under optimum conditions, the target stoichiometry is preserved in the deposited films. All solid state materials – metals, semiconductors and insulators, including those transparent to laser wavelengths in PLD – can be deposited as thin films with PED. By combining PLD and PED, the range of complex materials that can be prepared as thin films can be greatly enhanced.
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Product
In-Situ Metrology Etch
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In-situ metrology systems are attached to deposition systems on one or several viewports for monitoring the progression of the etch dept during the process in real time. No matter if the required stop depth lies within a layer or at an interface.
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Product
ICP Plasma System
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The AXIC IsoLok® Inductively Coupled Plasma (ICP) Load-Locked Processing System from AXIC, Inc. defines a new concept in Deep Reactive Ion Etch (DRIE) and low temperature-low damage Plasma Enhanced Chemical Vapor Deposition (ICP-PECVD) plasma processing. The system is based on a modular design starting with a universal chamber and cabinet unit with ICP etch or deposition bottom electrodes available for easy installation into the chamber unit combined with a load-lock. We are confident you will find the ease of use, variety of plasma processes, serviceability and attractive pricing unsurpassed by any other plasma product in the market.
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Product
Dynamic Scale Deposition Loop System
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Dynamic Scale Deposition Loop fully automated systems includes hardware and software to measure and evaluate the performance of scale inhibitors under high pressure and high temperature conditions.
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Product
High Temperature Absolute Pressure Transducers
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Our high temperature Baratron® capacitance manometers are controlled to temperatures of 150°C or higher for use use in demanding semiconductor manufacturing vacuum processes such as metal etching and nitride film chemical vapor deposition (CVD).
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Product
Panel Light-I-V Teste
ASIV-11
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Greensolar Equipment Manufacturing Ltd.
The Panel Light-I-V Tester (ASIV) is used to test photovoltaic panels or modules during their production. A flashlight illuminates the work piece with similar light spectrum to that of the Sun, while the electric performance of the unfinished panel or the finished module is accurately measured. With the help of the tester the user can filter out reject panels. Testing the final performance reveals changes made by alternations in the deposition recipe.
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Product
Digital mammography system
AMULET
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The new format FPD has a proprietary panel structure with a double layer of amorphous selenium that has high X-ray absorption properties, and was developed by combining Fujifilm''s "Device Development Technology" and "Vacuum Deposition Technology." The first layer efficiently converts X-rays into electrical signals, while the second layer employs the unique "Direct Optical Switching Technology," that captures higher resolution and lower noise image electrical signals rather than using electrical switches such as conventional TFTs. By achieving both "50µm fine pixel size (higher resolution) and low noise," the AMULET system can show microcalcifications and tumors in greater detail, both significant indicators for early diagnosis of breast cancer.
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Remote Plasma Sources For Process Applications
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MKS remote plasma sources deliver high density reactive radicals improving on-wafer cleaning and deposition throughput. Solutions consist of a fully integrated, self-contained unit designed for quick on-chamber installation providing fast, reliable plasma ignition of O2, Hydrogen and Nitrogen gases in a customer configurable package. All solutions are equipped with intelligent power control and EtherCAT® diagnostics supporting Industry 4.0.





























