Deposition
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Product
Matrix Vapor Deposition System
iMLayer
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The iMLayer matrix vapor deposition system is sample pretreatment (application of matrix) in order to perform MALDI-MS imaging using an analysis system such as the iMScope imaging mass microscope or the MALDI-7090. With the iMLayer, the deposition method has been adopted as a pretreatment method to achieve high spatial resolution. By using this method, fine matrix crystal can be produced. Also, thanks to automated control, the coating thickness is reproducibly controlled as users configure.
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Product
Metrology System
Aspect
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Memory density increases with both layer-pair scaling and tier stacking for memory stacks well over 200 pairs. The Aspect metrology system was designed with these future architectures and scaling strategies in mind. Aspect metrology is demonstrating performance superior to X-ray systems across multiple customer devices through a revolutionary infrared optical system providing full profiling capability to enable critical etch and deposition control, with the speed and process coverage that customers require.
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Product
3D Solder Paste Inspection (SPI)
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Systems designed for solder paste inspection (SPI) quickly and reliably check the solder paste deposits on the circuit board.
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Product
High-grade type Gas Monitor for Chamber Cleaning End Point Monitoring
IR-400
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The IR-400 offers real-time monitoring of the chamber cleaning end point during the deposition process. By optimizing the cleaning process, the IR-400 reduces cleaning time and gas usage. This reduction in cleaning gas usage leads to a reduction in chamber damage and increases the life times of all the systems components.
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Product
Chip Manufacturing
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KLA’s advanced process control and process enabling solutions support integrated circuit manufacturing. Using KLA’s comprehensive portfolio of defect inspection, review, metrology, patterning simulation, in situ process monitoring and data analytics systems, IC manufacturers can manage yield and reliability throughout the chip fabrication process - from research and development to final volume production. SPTS provides deposition process solutions for insulating materials and conducting metals that cover a range of chip manufacturing process steps. IC manufacturers use KLA's array of products and solutions to help accelerate their development and production ramp cycles, to achieve higher semiconductor die yield and improved IC quality, and to improve overall profitability in the IC manufacturing process.
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Product
PED Systems
Pulsed Electron Deposition
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Is a process in which a pulsed (80-100 ns) high power electron beam (~1000 A, 15 kV) penetrates approximately 1 μm into the target resulting in a rapid evaporation of target material. The non-equilibrium heating of the target facilitates stoichiometric ablation of the target material. Under optimum conditions, the target stoichiometry is preserved in the deposited films. All solid state materials – metals, semiconductors and insulators, including those transparent to laser wavelengths in PLD – can be deposited as thin films with PED. By combining PLD and PED, the range of complex materials that can be prepared as thin films can be greatly enhanced.
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Product
Clinker Detection System
CDS
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The Clinker Detection (CDS) System is an ITM proprietary technology for measuring both the size and frequency of deposits that impact a utility boiler floor or bed. This technology enables operations personnel to shorten boiler outages, identify fouling problems and optimize soot blower operations.
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Product
Diamond-like Carbon (DLC) Foils
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An intense laser beam is used to evaporate carbon from a graphitic sputter target. In the process, the graphite structure of the source material is converted into nano-particles, which deposit on prepared substrates as diamond-like carbon. The properties of these unique carbon foils make them useful in a variety of applications, in particular beam stripping, as backings for accelerator targets or x-ray attenuators.
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Product
PLD Systems
Pulsed Laser Deposition
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Is a versatile thin film deposition technique. A pulsed laser (~20 ns pulse width) rapidly evaporates a target material forming a thin film that retains target composition. This unique ability of stoichiometeric transfer of target composition into the film was realized first by the research team led by Dr. Venkatesan at Bell Communications Research, NJ, USA, nearly 30 years ago while depositing high temperature superconducting (YBa2Cu3O7) thin films. Since then, PLD has become the preferred deposition technique where ever thin films of complex material compositions are considered. Another unique feature of PLD is its ability for rapid prototyping of materials. The energy source (pulsed laser) being outside the deposition chamber, facilitates a large dynamic range of operating pressures (10-10 Torr to 500 Torr) during material synthesis. By controlling the deposition pressure and substrate temperature and using relatively small target sizes, a variety of atomically controlled nano-structures and interfaces can be prepared with unique functionalities.
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Product
Pure Boron Foils
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MICROMATTER™ boron foils are also produced by laser plasma ablation; however, the deposition process is much more complex and time consuming than that for diamond-like carbon. Accordingly, only thin films, mainly designed for beam stripping of heavy ions in electrostatic accelerators, are available. All films are generally delivered on glass substrates coated with a release agent.
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Product
Custom Aluminum Nitride Ceramic Substrate
CAN1
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CAN1 Custom Aluminum Nitride Ceramic Substrate is a custom aluminum nitride ceramic substrate for sensor platforms, MEMS devices, thermal management studies, thin-film deposition, and electronic materials research. The substrate can be supplied for prototype development, coating trials, and small-batch R&D projects where stable ceramic material and custom dimensions are required.
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Product
kSA BandiT
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The kSA BandiT is a non-contact, non-invasive, real-time, absolute wafer and thin-film temperature monitor used during thin-film deposition and thermal processing.
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Product
Gas and Vapor Delivery Systems
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In thin film deposition, high-quality results start with how process gases are delivered, as they help create the stable environment needed for consistency by controlling flow, pressure and composition to support processes like ALD, CVD, and PVD. Advanced semiconductor devices developed for the most advanced computing processes, such as AI and edge computing, need the ultra-high-purity environments of our gas and vapor deposition delivery systems.
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Product
High Temperature Absolute Pressure Transducers
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Our high temperature Baratron® capacitance manometers are controlled to temperatures of 150°C or higher for use use in demanding semiconductor manufacturing vacuum processes such as metal etching and nitride film chemical vapor deposition (CVD).
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Product
ALD
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Atomic Layer Deposition (ALD) offers precise control down to the atomic scale.Atomic layer deposition holds tremendous promise across a wide array of industries, including energy, optical, electronics, nanostructures, biomedical, and more. Please check out our Applications section for more details in any and all of these areas.
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Product
Custom Sensing And Imaging Solutions
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Micro Magnetics has a proven track record of excellence in designing and developing new products and solutions based on our knowledge of magnetic devices and materials. We offer specialized solutions to meet our customers? unique needs. These solutions include single magnetic sensors, sensor arrays, custom electronics and packaging solutions, sensor processing (polishing, dicing, and lapping), and custom film and device deposition.
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Product
Field Portable NIR Spectrometers For Mineral Identification And Analysis In Mining Exploration
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With Spectral Evolution field portable NIR spectrometers and EZ-ID mineral identification software, geologists can measure and identify minerals within seconds and cover more ground than by using traditional methods. They can identify different mineral phases, create mineral alteration maps and more accurately identify mineral pathfinders for vectoring to ore deposits. Spectral Evolution's field portable, battery-operated oreXpress, oreXplorer and oreXpert ultra-high resolution NIR spectrometers are designed for mineral identification in mining exploration. The oreXpress, oreXplorer and oreXpert provide quick payback with faster, more accurate mineral identification in exploration for gold, silver, diamonds, iron, nickel, copper, uranium, aluminum - in the field, core shack, or in the lab, and provide:
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Product
ICP Plasma System
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The AXIC IsoLok® Inductively Coupled Plasma (ICP) Load-Locked Processing System from AXIC, Inc. defines a new concept in Deep Reactive Ion Etch (DRIE) and low temperature-low damage Plasma Enhanced Chemical Vapor Deposition (ICP-PECVD) plasma processing. The system is based on a modular design starting with a universal chamber and cabinet unit with ICP etch or deposition bottom electrodes available for easy installation into the chamber unit combined with a load-lock. We are confident you will find the ease of use, variety of plasma processes, serviceability and attractive pricing unsurpassed by any other plasma product in the market.
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Product
Process Sense™ NDIR End Point Detector For Chamber Clean
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The Process Sense endpoint sensor is a small, low-cost SiF4 sensor specifically designed for Remote Plasma Chamber Clean Endpoint detection for silicon-based CVD deposition chambers. Process Sense is based on infrared absorption, the only technique applicable to all plasma cleaning processes (in-situ and remote). It gets mounted onto a bypass on the rough line, ensuring no effect on deposition hardware. The signal level reported by the Process Sense, which is proportional to SiF4 concentration, can be used to determine the completion of the chamber clean process.
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Product
ITO (Indium Tin Oxide) Electrode
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This quite unique material transmits only visible light whereas it does not transmit UV radiation. Our ITO electrodes consist of 100 nm thick of ITO layer deposited on quartz or borosilicate glass substrate (0.5 mm thick).
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Product
Digital Mammography
ITA
Analogic is an established worldwide leader in direct conversion digital detector technology used in digital mammography. We develop and manufacture flat-panel, direct conversion digital detectors used by major medical OEMs in mammography systems. These plates capture image data directly onto a patented detector made with a layer of amorphous selenium deposited onto a thin-film transistor array.
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Product
Multi-Element Standards
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These multi-element standards consist of multi-layer thin film coatings, one on top of the other, upto a maximum of 6 elemental coatings. It is generally recommended to have coating thicknesses < 20 µg/cm2, so as to cause negligible notable matrix effects, in particular absorption of X-rays emitted in lower deposits by those covering them.
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Product
Optical Fiber Type Hot Phosphoric Acid Concentration Monitor
CS-620F
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In 3D NAND manufacturing process, dozens of layers of SiO2 and SiN are deposited, and the SiN layer is selectively removed using hot phos.In this process, the desired etching rate can be achieved by controlling the concentration and temperature of the chemical solution.Previous products have difficulty to measure high temperature chemicals, but the CS-620F is able to measure at high temperatures up to 170 C degrees.
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Product
Long Term Test Kit
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When long term electro-chemical tests (>1000 hours) are run to monitor the cell degradation at the cathode for example, it is important to avoid any contaminant in the gas flow rate.Inconel 601 flange equipped with alumina housing and alumina tube to feed the gas to the electrode during long term test (>1000 h)Typical poisoning is coming from the chromium contained in the steel tubing. The volatile chromium species (Cr6+) will flow into the cathode (with the air) and thanks to the intake of electrons at the electrode, the chromium ion will transform to chromium oxide and be deposited at the cathode triple point. In such a case, the long term test kit is used. The Inconel 601 flange is equipped with an alumina housing (>96 % Al2O3) and the air (or other gas) is led through an alumina tube. The long term test kit is fully compatible with other functionalities proposed with the Open Flanges™ test Set-Up as the integrated steamer or the small pellet test kit. The long term test kit can be implemented on the fuel, on the air or on both sides.
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Product
MOCVD Systems
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For growing high-quality compound semiconductor films, few techniques match the precision of Metal-Organic Chemical Vapor Deposition (MOCVD). They give engineers tight control over film composition and thickness, making them essential for optoelectronics and advanced power transistors.
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Product
Automated Stand for Magnetic Luminescent Control of Railway Wheels
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The amount of information processed and time constraints required the creation of a multi-level distributed image processing system based on National Instruments Compact Vision System controllers, industrial computers and workstations. During the control process, the wheel is watered with a magnetic-luminescent emulsion, magnetized and exposed to ultraviolet radiation. As a result, the emulsion deposited on the defects glows in the visible range (yellow-green light). Eleven FireWire (IEEE 1394) color cameras with a resolution of 1280 x 1024 are used to scan the wheel surface. In one iteration, they completely cover a 20-degree sector of the wheel.
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Product
Digital mammography system
AMULET
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The new format FPD has a proprietary panel structure with a double layer of amorphous selenium that has high X-ray absorption properties, and was developed by combining Fujifilm''s "Device Development Technology" and "Vacuum Deposition Technology." The first layer efficiently converts X-rays into electrical signals, while the second layer employs the unique "Direct Optical Switching Technology," that captures higher resolution and lower noise image electrical signals rather than using electrical switches such as conventional TFTs. By achieving both "50µm fine pixel size (higher resolution) and low noise," the AMULET system can show microcalcifications and tumors in greater detail, both significant indicators for early diagnosis of breast cancer.
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Ozone Generators & Systems
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MKS offers a wide range of ozone generators and modular delivery systems which produce ultra-pure, reliable ozone gas. In the clean semiconductor environment, Ozone reacts with a wide range of precursor gases resulting in the creation of Al2O3, ZrO2, HfO2, and La2O3 metal oxides to enable thin film deposition processes like Atomic Layer Deposition (ALD) and Etch (ALE). MKS’ generator uses Grade 6 gas, enabling the creation of higher film density improving product yield. Photovoltaic and Display manufacturing leverage semiconductor best practices and utilize ozone to create enhanced thin film barriers, improving product performance and reliability.
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Product
ALD Advantages
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Atomic Layer Deposition (ALD) stands out for one reason: control. The most significant advantages of thin film deposition via Atomic Later Deposition over other methods, are manifest in four distinct areas – film conformality, low temperature processing, stoichiometric control, and inherent film quality associated with the self-limiting, and self-assembled nature of the ALD mechanism ALD is exceptionally effective at coating surfaces that exhibit ultra high aspect ratio topographies, as well as surfaces requiring multilayer films with good quality interfaces technology. This thin-film process builds materials one atomic layer at a time, delivering unmatched uniformity and sub-nanometer precision, even on complex 3D structures. That level of accuracy makes ALD a critical technology for advanced semiconductor manufacturing, flexible electronics, and materials research.
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Product
Copper Pillar Bump
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Like in conventional fabrication, integrated circuits are created on the wafer but near the end of the manufacturing process, the attachment pads are metalized on the surface of the chips to make them more receptive to solder. Then solder dots are deposited on each of the pads, and chips are cut, flipped, and positioned so that the solder balls are facing the connectors on the external circuitry.
