Deposition
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Matrix Vapor Deposition System
iMLayer
The iMLayer matrix vapor deposition system is sample pretreatment (application of matrix) in order to perform MALDI-MS imaging using an analysis system such as the iMScope imaging mass microscope or the MALDI-7090. With the iMLayer, the deposition method has been adopted as a pretreatment method to achieve high spatial resolution. By using this method, fine matrix crystal can be produced. Also, thanks to automated control, the coating thickness is reproducibly controlled as users configure.
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Parylene Deposition Equipment
SCS offers Parylene deposition systems that range from a portable laboratory unit to production models for high-volume manufacturing applications. SCS Parylene deposition systems are designed for accurate and repeatable operation, featuring closed-loop monomer pressure control, which ensures deposition of the polymer film at a precise rate. Whether researching new coating applications or developing structures out of Parylene in the laboratory, or coating components in a production environment, SCS leads the industry with its state-of-the-art Parylene deposition systems.
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Atomic Layer Deposition Systems
Atomic Layer Deposition (ALD) is a powerful way to build ultra-thin, super-precise coatings, one atomic layer at a time. It’s especially useful and efficient when working with tiny, complex 3D structures, making it a go-to technique in advanced semiconductor manufacturing.
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Thin-film deposition
Plasma Source
SPECS Surface Nano Analysis GmbH
Thin-film deposition covers any technique for depositing material onto a bulk or thin film substrate. Elemental alloy or compound films are produced by non-reactive or reactive (co-)deposition. Often functionalization or tailoring of device interfaces by predeposition or deposition assisting surface treatment with atoms or ions is necessary.
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Physical Vapor Deposition Systems
Physical Vapor Deposition (PVD) systems use physical processes, like sputtering and evaporation, to deposit thin films with exceptional purity and control. These techniques are widely used in semiconductor manufacturing, optical coatings and protective applications.
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Multichamber PECVD/Etch System
IsoLok 5000
Load locked cluster toolCassette to cassette processingUp to 4 coatings can be deposited without breaking vacuumSubstrate sizes: 125 x 125mm,156 x 156mm and200mm dia. (smaller sizes can be processedusing a carrier)Typical coatings: SiOx & SiNx - doped & undoped & a- SiR&D, Pilot production and production capabilitiesRIE chambers availableFull computer controlProcess chamber is modular and interfaced with 200mm slot valve
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Ion Beam System
Veeco's unmatched Ion Beam know-how delivers proven etch and deposition performance enabling the data storage and MEMS markets for decades.
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Diamond-like Carbon (DLC) Foils
An intense laser beam is used to evaporate carbon from a graphitic sputter target. In the process, the graphite structure of the source material is converted into nano-particles, which deposit on prepared substrates as diamond-like carbon. The properties of these unique carbon foils make them useful in a variety of applications, in particular beam stripping, as backings for accelerator targets or x-ray attenuators.
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ALD Materials
Chemists have synthesized many exciting new precursors for ALD and have created a large number of atomic layer deposition materials, such as coatings with improved properties for metals, semiconductors, insulators, oxides, nitrides, dielectrics, magnetic, and refractive coatings.
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ALD Advantages
Atomic Layer Deposition (ALD) stands out for one reason: control. The most significant advantages of thin film deposition via Atomic Later Deposition over other methods, are manifest in four distinct areas – film conformality, low temperature processing, stoichiometric control, and inherent film quality associated with the self-limiting, and self-assembled nature of the ALD mechanism ALD is exceptionally effective at coating surfaces that exhibit ultra high aspect ratio topographies, as well as surfaces requiring multilayer films with good quality interfaces technology. This thin-film process builds materials one atomic layer at a time, delivering unmatched uniformity and sub-nanometer precision, even on complex 3D structures. That level of accuracy makes ALD a critical technology for advanced semiconductor manufacturing, flexible electronics, and materials research.
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Panel Light-I-V Teste
ASIV-11
Greensolar Equipment Manufacturing Ltd.
The Panel Light-I-V Tester (ASIV) is used to test photovoltaic panels or modules during their production. A flashlight illuminates the work piece with similar light spectrum to that of the Sun, while the electric performance of the unfinished panel or the finished module is accurately measured. With the help of the tester the user can filter out reject panels. Testing the final performance reveals changes made by alternations in the deposition recipe.
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Process Sense™ NDIR End Point Detector For Chamber Clean
The Process Sense endpoint sensor is a small, low-cost SiF4 sensor specifically designed for Remote Plasma Chamber Clean Endpoint detection for silicon-based CVD deposition chambers. Process Sense is based on infrared absorption, the only technique applicable to all plasma cleaning processes (in-situ and remote). It gets mounted onto a bypass on the rough line, ensuring no effect on deposition hardware. The signal level reported by the Process Sense, which is proportional to SiF4 concentration, can be used to determine the completion of the chamber clean process.
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Remote Plasma Sources For Process Applications
MKS remote plasma sources deliver high density reactive radicals improving on-wafer cleaning and deposition throughput. Solutions consist of a fully integrated, self-contained unit designed for quick on-chamber installation providing fast, reliable plasma ignition of O2, Hydrogen and Nitrogen gases in a customer configurable package. All solutions are equipped with intelligent power control and EtherCAT® diagnostics supporting Industry 4.0.
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Ozone Generators & Systems
MKS offers a wide range of ozone generators and modular delivery systems which produce ultra-pure, reliable ozone gas. In the clean semiconductor environment, Ozone reacts with a wide range of precursor gases resulting in the creation of Al2O3, ZrO2, HfO2, and La2O3 metal oxides to enable thin film deposition processes like Atomic Layer Deposition (ALD) and Etch (ALE). MKS’ generator uses Grade 6 gas, enabling the creation of higher film density improving product yield. Photovoltaic and Display manufacturing leverage semiconductor best practices and utilize ozone to create enhanced thin film barriers, improving product performance and reliability.
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Reticle Manufacturing
An error-free reticle (also known as a photomask or mask) represents a critical element in achieving high semiconductor device yields, since reticle defects or pattern placement errors can be replicated in many die on production wafers. Reticles are built upon blanks: substrates of quartz deposited with absorber films. KLA’s portfolio of reticle inspection, metrology and data analytics systems help blank, reticle and IC manufacturers identify reticle defects and pattern placement errors, thereby reducing yield risk.
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Remote Plasma Sources
Semiconductor and Electronic Thin Film applications use plasma sources to generate low-energy ions and radicals to react with material surfaces and chamber walls to remove contaminants and act as a precursor to aid in material deposition. MKS provides multiple options for radical generation including Toroidal and Microwave based Remote Plasma Sources supporting Fluorine, NF3, oxygen, nitrogen and hydrogen process chemistries.
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AOI & SPI Test Systems
Xceed AOI
Most defects in the circuit-board assembly are due to the solder paste or the process of printing solder paste. Since the transition to lead-free soldering, a whole new spectrum of problems has emerged in older paste printing and its due processes. Incomplete coalescence of ball grid array (BGA) spheres and solder paste deposits are failure modes that have increased in frequency since the transition to lead-free soldering. The Xceed enables true 3D measurement and provides the most accurate and repeatable inspection results with the minimum false calls. It’s designed with Advanced Signal Processing which gives results in noise-less, clear, and accurate 3D images.
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Field Portable NIR Spectrometers For Mineral Identification And Analysis In Mining Exploration
With Spectral Evolution field portable NIR spectrometers and EZ-ID mineral identification software, geologists can measure and identify minerals within seconds and cover more ground than by using traditional methods. They can identify different mineral phases, create mineral alteration maps and more accurately identify mineral pathfinders for vectoring to ore deposits. Spectral Evolution's field portable, battery-operated oreXpress, oreXplorer and oreXpert ultra-high resolution NIR spectrometers are designed for mineral identification in mining exploration. The oreXpress, oreXplorer and oreXpert provide quick payback with faster, more accurate mineral identification in exploration for gold, silver, diamonds, iron, nickel, copper, uranium, aluminum - in the field, core shack, or in the lab, and provide:
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PLD Systems
Pulsed Laser Deposition
Is a versatile thin film deposition technique. A pulsed laser (~20 ns pulse width) rapidly evaporates a target material forming a thin film that retains target composition. This unique ability of stoichiometeric transfer of target composition into the film was realized first by the research team led by Dr. Venkatesan at Bell Communications Research, NJ, USA, nearly 30 years ago while depositing high temperature superconducting (YBa2Cu3O7) thin films. Since then, PLD has become the preferred deposition technique where ever thin films of complex material compositions are considered. Another unique feature of PLD is its ability for rapid prototyping of materials. The energy source (pulsed laser) being outside the deposition chamber, facilitates a large dynamic range of operating pressures (10-10 Torr to 500 Torr) during material synthesis. By controlling the deposition pressure and substrate temperature and using relatively small target sizes, a variety of atomically controlled nano-structures and interfaces can be prepared with unique functionalities.
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Optical Fiber Type Hot Phosphoric Acid Concentration Monitor
CS-620F
In 3D NAND manufacturing process, dozens of layers of SiO2 and SiN are deposited, and the SiN layer is selectively removed using hot phos.In this process, the desired etching rate can be achieved by controlling the concentration and temperature of the chemical solution.Previous products have difficulty to measure high temperature chemicals, but the CS-620F is able to measure at high temperatures up to 170 C degrees.
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Dimensional Metrology
Stand-Alone Metrology Family
Nova’s stand-alone metrology platforms are utilized to characterize critical dimensions such as width, shape and profile with high precision and accuracy and are used in multiple areas of the fab such as photolithography, etch, CMP and deposition in the most advanced technology nodes, across all semiconductor leading customers.
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ITO (Indium Tin Oxide) Electrode
This quite unique material transmits only visible light whereas it does not transmit UV radiation. Our ITO electrodes consist of 100 nm thick of ITO layer deposited on quartz or borosilicate glass substrate (0.5 mm thick).
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Handheld Ultrafine Particle Size Distribution Measurement.
partector 2 Pro
Naneos Particle Solutions gmbh
The naneos partector 2 Pro version is a further development of the well-established Partector 2. The Pro version of the partector 2 can additionally switch through different deposition voltage levels and therefore scan an 8-channel size distribution of an aerosol of interest.
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ALD For Manufacturing And Production
Uniformity over large substrates, reproducibility, and low temperature deposition make ALD an ideal candidate for the next generation of large-scale manufacturing thin film technology.
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Vapor Concentration Monitor
IR-300 Series
Metal-Organic Chemical Vapor Deposition (MOCVD) is widely used in the manufacture of LEDs, optical devices and other components. Liquid and solid precursors are delivered to the reaction chamber by controlling the temperature, pressure and the carrier gas flow rate (bubbling method). Process results can be affected by changes especially in temperature and liquid level. The in-line IR-300 Series measures and reports the precursor concentration in real time.
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Conductivity Electrode
As current-carrying and potential difference measuring electrodes, platinum was deposited on a quartz glass substrate. Voltage terminal distance can be varied by changing the connection pin. In-situ measurement of the metal transition produced in a conductive polymer insulator doping, 4 terminal electrode is used, where for insulator layer with low doping side 2 terminal method and for metal layer with high doping side 4 terminal method is used for the measurement. With this electrode, become possible to have measurement in 15 distances by combining the connection terminal.
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ALD For Research & Development
Veeco’s atomic layer deposition research systems are designed by ALD scientists and built for maximum experimental flexibility and value. With universal precursor delivery systems, you can use solid, liquid or gas chemistries in any precursor port. There are many options to choose from including ozone generators, in-situ monitoring and various configurations. As always, our team of ALD scientists are ready to answer your recipe development and film characterization questions. Over 2500 published academic papers feature research performed on our Savannah® thermal ALD system and Fiji® plasma ALD system.
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Microelectronics And Packaging AOI
Machine Vision Products, Inc. has extensive experience in a wide range of Microelectronics and Packaging applications. MVP works with the world’s leading manufacturers on a global basis. From multiple die and wire technologies to leadframe, ball grid array and surface inspection applications, MVP has the widest applications toolbox of any AOI provider. MVP takes pride in the fact that they supply many complex inspection solutions to diverse industries such as Automotive, Telecoms, Medical Devices, Military, and Space. MVP’s 900 Series is the base platform upon which all Microelectronics and Packaging inspection solutions are based. The 900 series 2D capabilities provide metrology and defect detection using a propriety Quad-Color lighting, Telecentric optics and resolutions down to 1um. 3D height measurement capabilities allow for in-line high speed inspection of Dies, paste deposition, positional accuracy, volume and height with a resolution down to 1.13um.
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High Power Microwave Plasma Source
The High Power Microwave Plasma Source can be combined with a 6kW microwave generator for a high concentration of radicals providing a high productivity manufacturing solution. The High Power Microwave Plasma source is capable of igniting in multiple process gases, over a wide operating range with performance benefits in current and emerging applications such as, high throughput photoresist removal, advanced surface cleaning and conditioning, as well as, advanced deposition applications at the atomic level.
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Multi-Element Standards
These multi-element standards consist of multi-layer thin film coatings, one on top of the other, upto a maximum of 6 elemental coatings. It is generally recommended to have coating thicknesses < 20 µg/cm2, so as to cause negligible notable matrix effects, in particular absorption of X-rays emitted in lower deposits by those covering them.
