Deposition
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Reticle Manufacturing
An error-free reticle (also known as a photomask or mask) represents a critical element in achieving high semiconductor device yields, since reticle defects or pattern placement errors can be replicated in many die on production wafers. Reticles are built upon blanks: substrates of quartz deposited with absorber films. KLA’s portfolio of reticle inspection, metrology and data analytics systems help blank, reticle and IC manufacturers identify reticle defects and pattern placement errors, thereby reducing yield risk.
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Dynamic Ultra Micro Hardness Tester
DUH-210/DUH-210S
A new evaluation system for measuring the material strength of micro regions, such as semiconductors, LSI, ceramics, hard disks, vapor deposited films, and thin coating layers, not addressed by previous hardness testers. It can also be used to evaluate the hardness of plastics and rubbers. This instrument uniquely measures dynamic indentation depth, not the indentation after the test. This in turn permits measurement of very thin films and surface (treatment) layers that are impossible to measure with conventional methods. Additionally, this same method supplies the data needed to calculate elastic modulus on the test specimens.
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Physical Vapor Deposition Systems
Physical Vapor Deposition (PVD) systems use physical processes, like sputtering and evaporation, to deposit thin films with exceptional purity and control. These techniques are widely used in semiconductor manufacturing, optical coatings and protective applications.
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Copper Pillar Bump
Like in conventional fabrication, integrated circuits are created on the wafer but near the end of the manufacturing process, the attachment pads are metalized on the surface of the chips to make them more receptive to solder. Then solder dots are deposited on each of the pads, and chips are cut, flipped, and positioned so that the solder balls are facing the connectors on the external circuitry.
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Optical Fiber Type Hot Phosphoric Acid Concentration Monitor
CS-620F
In 3D NAND manufacturing process, dozens of layers of SiO2 and SiN are deposited, and the SiN layer is selectively removed using hot phos.In this process, the desired etching rate can be achieved by controlling the concentration and temperature of the chemical solution.Previous products have difficulty to measure high temperature chemicals, but the CS-620F is able to measure at high temperatures up to 170 C degrees.
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Long Term Test Kit
When long term electro-chemical tests (>1000 hours) are run to monitor the cell degradation at the cathode for example, it is important to avoid any contaminant in the gas flow rate.Inconel 601 flange equipped with alumina housing and alumina tube to feed the gas to the electrode during long term test (>1000 h)Typical poisoning is coming from the chromium contained in the steel tubing. The volatile chromium species (Cr6+) will flow into the cathode (with the air) and thanks to the intake of electrons at the electrode, the chromium ion will transform to chromium oxide and be deposited at the cathode triple point. In such a case, the long term test kit is used. The Inconel 601 flange is equipped with an alumina housing (>96 % Al2O3) and the air (or other gas) is led through an alumina tube. The long term test kit is fully compatible with other functionalities proposed with the Open Flanges™ test Set-Up as the integrated steamer or the small pellet test kit. The long term test kit can be implemented on the fuel, on the air or on both sides.
