Solderability
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Multicore Universal Solderability Tester
MUST System 3
The MUST System 3 is the latest technological evolution of the original Multicore Universal Solderability Tester (MUST) that grandfathered all modern solderability test standards. It remains the unquestioned industry benchmark for solderability testing.
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Solderability Tester
ZHX-35
Shanghai Dean Electrical Co., Ltd
Executive standard: GB/T4074.4-2008/IEC60851-4; Inspection standard: JB/T4279.14-2008Used to detect the self-solderability of enameled round wires and wire harness;Set variable temperature range and automatically maintain constant temperature;Under mechanical driven, samples would be withdrawn by the action of automatic insertion and lateral movement, free from vibration and noise;
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Solderability Tester
LBT210
Microtronic Microelectronic Vertriebs GmbH
Microtronic's LBT-210 solderability tester has software that offers statistical information such as mean value, standard deviation, etc. A camera option offers video of the test cycle and storage in memory with the appropriate test measurements and data. Additionally, it has the feature to test under nitrogen. This function can be switched on in the software. An enclosure that is flooded with nitrogen lowers and rises with the device under test.
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3D Solder Paste Inspection (SPI)
Systems designed for solder paste inspection (SPI) quickly and reliably check the solder paste deposits on the circuit board.
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4-Pin Power D-Type Female Connector, 40A, Without Backshell
92-960-004-F
This connector is designed to allow users to directly terminate a cable with soldered connections. When the product is used without a backshell users should make their own cable strain relief arrangements and ensure appropriate electrical precautions are observed.
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BGA SMT Adapters
Giga-snaP™
Giga-snaP™ 0.75, 0.8, 1.0, and 1.27mm pitch BGA Surface Mount Feet Adapter line of products provide an inexpensive and reliable method for attaching BGA chips to target board. The product line consists of patented female sockets with machined pins epoxy over-molded into an assembly that matches a particular BGA pattern. The epoxy over-molded female BGA socket is soldered to a PCB using standard soldering methods. A corresponding male pin BGA adapter, to which the user attaches their BGA chip, is plugged into the female socket on the board thus interconnecting the chip and the system is ready to go. The SMT adapters have the same solder ball types as the chips they are emulating. These adapters have less than half of the insertion force of competitive adapters, shorter electrical path for highest speed, and can be solder reflowed numerous times. A complete description and drawings of Giga-snaP™ 0.75, 0.8, 1.0, and 1.27mm pitch BGA Surface Mount Feet Adapters can be found at the tables shown below.
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9-Pin D-Type Connector, Male
40-960-009-M
This connector is designed to allow users to directly terminate cables with soldered connections.
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Male/Female DIP Jumpers
Series 200 thru 216
Male/Femaie DIP Jumpers. Reliable, electronically tested solder connections. Protective covers are ultrasonically welded on and provide strain relief for cables. 10-color cable allows for easy identification and tracing.
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50-Pin D-Type Male Solder without Backshell
92-960-050-M
This connector is designed to allow users to directly terminate cables with soldered connections. 50-Pin Female connectors can be directly mated to a corresponding Pickering Switching Module.
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SparkFun Qwiic Twist
RGB Rotary Encoder Breakout
The SparkFun Qwiic Twist is a digital RGB rotary encoder breakout that is also able to connect to our Qwiic Connect System. The Twist takes care of all the various interrupts, switches, PWM'ing of LEDs, and presents all those features over an easy-to-use I2C interface. The Qwiic Twist was designed to get rid of the large mass of wires that are needed to implement an RGB encoder in a breadboard enabling you to stop messing around with interrupt debugging and get back to your project! Utilizing our handy Qwiic system, no soldering is required to connect it to the rest of your system. However, we still have broken out 0.1"-spaced pins in case you prefer to use a breadboard.
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Microwave Probes
S-Probe
S-Probe series of single-ended probes can perform up to 20 GHz are designed for RF, power integrity, and signal integrity testing. Its strong beryllium copper (BeCu) tips is perfect for direct probing of uneven surfaces, such as solder pads and circuit components. This is a big improvement over the fragile microprobes.
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IBM AT/ISA, Vectorbord Plugbord
4617-1
VECTOR Electronics and Technology, Inc.
98 contacts (49 each side) on 0.100" centers.Voltage and ground buses around board perimeter on both sides. Bus surfaces solder coated.I/O mounting area for 37-pin D-sub and ribbon cable connectors. Mounting bracket and hardware kit included (P/N HD36B).
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Mini Coax, Contact, ITA, Solder Sleeve, RG316 & RG178
610103140
Mini Coax, Contact, ITA, Solder Sleeve, RG316 & RG178.Mechanical SpecificationsDurability 20,000 cyclesContact Material Shield – BrassCenter Conductor – BeCuContact Plating Shield – 50µ" Au over 100µ" NiCenter Conductor – 60µ" Au over 100µ" NiContact Termination Solder SleeveInsulator PTFEMating Force 1.5 lbs max [0.68 kg]Electrical SpecificationsCharacteristic Impedance 50 ΩFrequency Range DC to 2 GHzVSWR ≤ 1.2 @ 2 GhzInsertion Loss ≤ 0.05 dB @ 500 Mhz≥ -0.3 dB @ 2 GhzDWV 1500 VDC Min.Contact Resistance < 5 mΩ @ 0.5 Amp & always < 10 mΩCable Specifications RG316 & RG178Environmental SpecificationsOperating Temperature -50°C to +105°CInsulation Resistance 1000 MΩ min.
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GPIB to Relay Minibox™
Model 4864
* Model 4864-11 provides 16 low-level form A contacts (SPST).* Provides 8 isolated inputs for CMOS, TTL and 32 Vdc signals.* Multiple relay programming modes switch individual relays or san with single or multi-pole contacts.* Fully IEEE-488.2 and SCPI compliant.* Optional 1 'U' high Rack Mounting Kits hold one or two 4864s.* Includes 50-pin mating connector for solder connections.* Optional 1 'U' high Rack Mounting Kits hold one or two 4864s.* Optional terminal board and terminal strip for easy connections without soldering. See the GPIB Accessory page. * Model 4864-12 provides 16 heavy duty form A contacts (SPST).* All other specifications are the same as listed for the 4864-11. * Model 4864-14 provides 16 Relay driver outputs that sink 300 mA.* All other specifications are the same as listed for the 4864-11.
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Plugbord
3682-4
VECTOR Electronics and Technology, Inc.
44 Gold plated edge contacts (22 each side) on 0.156"(3.96mm) centers. Interleaved buses pattern on wiring side, solder coated for user convenience. Overall ground plane with clearance around each hole on component side. Mounts DIPs with 0.3”, 0.4” & 0.9” lead spacing. Unclad test point area at top of board. Row and column legends provided.
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DIP-ER™ Logic Jumper
Series 115, 116, & 117
DIP-ER Logic Jumper. Reliable, electronically tested solder connections. Protective covers are ultrasonically welded on and provide strain relief for cables. DIP-ER Logic jumper wiring is point to point. Consult factory for other wiring needs.
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Automated Optical Inspection (AOI)
TR7700 SIII 3D
TRI’s ground breaking 3D AOI solution delivers the fastest hybrid PCB inspection combining optical and blue-laser-based true 3D profile measurement for the highest automated defect symptom coverage possible. Integrated state-of-the-art software solution and third generation intelligent hardware platform offer stable and robust 3D solder and component defect inspection and with high inspection coverage and easy programming.
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9-Pin D-type Female, Solder Bucket, HV
92-960-009-F-HV
9-Pin Female D-type Connector, High Voltage, Solder Bucket - Without Backshell
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Spring loaded type sample mounting board
SPCB
Mount samples on SPCB board without bonding wires.Spring loaded clamps helps to move probe pin easily x, y, z direction.Gold plated Non-magnetic phosphor-bronze constructionContacts on sample’s four point corner by soldering materials, such as InSn may still be required for good ohmic contact.
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Micro Coax, Contact, ITA, 50 GHz
610141108
Primary mating contact 610140108. (May mate with other Receiver contacts, as well.) *This contact sold as a patchcord only.Mechanical SpecificationsDurability 10,000 cyclesContact Material Center Conductor – BeCuShield – BrassContact Plating 30µ" Au over 100µ" NiContact Termination Solder Nut ClampInsulator PTFEMating Force 1.5 lbs max [0.68 kg]Electrical SpecificationsCharacteristic Impedance 50 ΩFrequency Range DC-50GHzVSWR 1.06+0.004 f(GHz)Insertion Loss - .095 x √f(GHz) dBDWV 700 V RMSContact Resistance 6 mOhms center/4 mOhms outer Cable Specifications Flex 405Environmental SpecificationsOperating Temperature -65°C to +125°CVibration MIL-STD 202, Method 204, Test Condition DShock MIL-STD 202, Method 213, Test Condition IInsulation Resistance 2000 MOhms Min.
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Solder Wettability Tester
5200ZC
The current machine (5200TN) was developed as a comprehensive machine that covers solderability test standards around the world, but we have added a high cost performance machine to the lineup that has realized the request of "single function + low price", which many people who are using the successive machines of SAT2000-5000-5100 type.
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8 Pin Power D-Type Female Connector, 40A, Without Backshell
92-960-008-F
This connector is designed to allow users to directly terminate a cable with soldered connections.
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Wall Mount Power Supplies
AC-DC Dual Tracking Outputs
Although small in size, these mini-modules offer high performance at modest prices. They provide the voltages commonly required for driving op amps and other balanced loads and may be mounted in an area only 3.5" x 2.5". Terminal strip input/output connections eliminate all need for sockets or soldering. Short circuit protection, encapsulated construction, and conservative design assure long term reliability.
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Surface Mount Reed Relays from Pickering Electronics
Pickering Electronics Surface Mount Reed Relays contain the highest quality instrumentation grade reed switches making them suitable for the most demanding applications and are suitable for infra-red or vapor phase reflow soldering.
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70 GHz Double Row Test Assembly
BE70A
The BE70A Series uses a single block design for ganged cabling and compression mount to the PCB, making it easier to install and eliminates soldering. The block consists of two rows, with up to 16 contacts, and is available for both microstrip and stripline transmission types. This proprietary cable design offers superior grounding (360-degree grounding with stripline) around a spring-loaded signal contact and provides a 1.85 mm connectors for RF device interfacing.
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Solder Paste Inspection System
KY8030-3
The new KY8030-3 delivers 3x fasterinspection without compromisingperformance and accuracy.Using patented dual projection,the system eliminates the criticalShadow problem that all 3D SPI systemscan be vulnerable to.Additionally, the new KY8030-3 has solvedthe PCB Warp problem that seriouslyimpacts inspection accuracyand reliability of result.
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Plugbord
4112
VECTOR Electronics and Technology, Inc.
44 Gold plated edge contacts (22 each side) on 0.156"(3.96mm) centers. 3-hole solder pads (0.28” x 0.080”) for interconnecting multiple component leads. Zig-Zag Bus Pattern on wiring side. Zig-Zag Bus Pattern provides access to voltage or ground at alternating hole positions. Continuous ground plane on component side with 0.085” etched clearance area around each hole Row and column legends provided
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Mems-Based Probe Cards
MEMSFlex
Nidec SV Probe proprietary MEMSFlex™ Probes are a perfect complement to our probe card technologies, ideal for many advanced testing applications including Flip Chip, WLCSP, Solder Bump, CuPillar and Pad. Featuring a fine 3D MEMS coil spring and electro-formed Ni-pipe, these probes are manufactured using a continuous, automated, manufacturing process, we can support a wide array of custom pin pitches within a short cycle. Other features include:
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Probe Card PCB's
DTS offers both generic and custom PCBs blanks for probe cards. Probe card PCBs are available for all tester platforms and can be configured for any vertical technology, epoxy cantilever and legacy blade cards. DTS probe card blanks are made to precise specifications required for all probing technologies and are available in high speed and high temperature materials. All probe card PCBs employ a balanced layering construction to maintain tight flatness specifications and minimize warping, allowing good probe planarity. Gold plating on all surface metals facilitates easy soldering and minimizes probe resistance. DTS is continually adding new probe card blanks to its library!
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Solder Paste Analyser
SPA 1000
The SPA 1000 also introduces new process control capability by accurately measuring the suitability of the solder paste prior to its implementation on the production line. It achieves this by determining the "Open-Time" for the paste. It also performs the Slump Test and both of these methods provide a "Go/No Go" answer in less than 30 minutes to ensure minimum delay for the production line.
