Wafer Inspection
Inspection of integrated circuits in wafer form for contaminants, flatness, size, and roughness.
See Also: Wafer, Wafer Thickness, Wafer Failure Analysis, Wafer Edge, Wafer Resistivity, Wafer Mapping, Wafer Probes, Wafer Probers, Wafer Handlers
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Visual Inspection Software
AdVISE
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R&S®AdVISE visual inspection software automates the process of visually monitoring an equipment under test (EUT) during a test sequence. This eliminates human inattention, ensures reproducible results and simplifies the test documentation. A typical application is EMS testing with R&S®EMC32 and R&S®ELEKTRA test software.
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Automated Wafer Prober for Magnetic Devices and Sensors
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Hprobe design and fabricate turnkey automated testing equipment (ATE) for electrical characterization and testing of integrated circuits under magnetic field such as MRAM (Magnetic Random Access Memory) and sensors. In each phase of the technology and product development as well as during mass manufacturing, a dedicated magnetic tester is available.
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Dual Projection 3D In-Line Solder Inspection System
KY8030-2
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The new KY8030-2 delivers 2x fasterinspection without compromising performanceand accuracy.Using patented dual projection, the systemeliminates the critical Shadow problem thatall 3D SPI systems can be vulnerable to.Easy UI and SPC Plus are included in the systempackage in order to help users achieve faster& easier printer process optimization
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First Article Inspection Services
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API’s, on-site, first article measurement services provide inspection data on parts and assemblies with direct comparison against CAD models or drawings. Generated 3D measurement data from our portable metrology equipment and 3D scanners offers a comprehensive analysis of the physical part under measurement. Inspection reports can include 3D color maps or generated 3D models for detailed computer analysis.
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3D Solder Paste Inspection (SPI)
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Systems designed for solder paste inspection (SPI) quickly and reliably check the solder paste deposits on the circuit board.
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Wafer Test
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Automatic KLA wafer probers with tray-to-tray-wafer-handling are operated 24h a day and 7 days a week. Data retention bake/tests are done at wafer level
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Electrical Inspection Adapters & Accessories
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Electrical Inspection Adapters & Accessories by electro-PJP
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Bond Tester for Wafers 2 - 12 inch
Sigma W12
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Bondtester for wafers or at wafer level 2” – 12” (up to 300 mm)Precise testing and Cold Bump Pull (CBP) testingLarge X/Y stages X: 600mm, Y: 370 mmForce range from 1gf – 10 kgfBump pitch down to 20 µm
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Magnetic Particle Inspection
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Is an inspection method used to identify defects on the surface of ferromagnetic materials by running a magnetic current through it.
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Building Inspection System with Moisture Hygrometer & MSX® IR Camera
FLIR MR277
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The MR277 is the first FLIR building inspection system to combine the advantages of Infrared Guided Measurement (IGM) and our patented Multi-Spectral Dynamic Imaging (MSX) with advanced environmental sensors to help you quickly locate, clearly identify, and easily document problems. IGM technology and a laser pointer isolate the area where you can use the integrated pinless moisture sensor for non-invasive readings or external pin probe for invasive measurements. With automatically calculated environmental readings and a field-replaceable humidity/temperature sensor, the MR277 lets you finish the job and minimize downtime. Connect to external devices with METERLiNK® and use FLIR Tools® to enhance troubleshooting and reports.
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Digital Inspection Probes
DI-1000
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The ergonomically designed DI-1000 is Lightel’s all digital video microscope probe. It connects directly to your PC through the computer’s USB2.0 port. Featuring easy single finger focusing, a built-in image freeze/capture button, and detectable resolution to 0.5µm, the DI-1000 package includes our free ConnectorViewTM (standard) software, providing digital zoom, image display, image capture, auto-calibration and basic analysis tools.
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Semi-Automatic Contactless Wafer Detector
NCS-200SA
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Semi-Automatically, non-contact measurement of wafer thickness, TTV ,bow,Point and flatness.Portable and easy to set-up, the Proforma 300/G measures all wafer materials including Silicon, Gallium-Arsenide, Indium-Phosphide and wafers mounted to sapphire or tape.the powerful software can test all the data above within several seconds,all the design according to SEMI standard and the ASTM,make sure the data can be easily unify. the system can used for several sample size,like 75 mm, 100 mm, 125 mm, 150 mm, 200 mm
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Process Control, Measurement and Inspection Workstation
ScanINSPECT VPI
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ScanINSPECT VPI is a fully integrated, stand-alone process control, measurement and inspection and programming workstation for use in setting up processes before the production floor in the PCB or Hybrid Microcircuit assembly industries.
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Sound Level Meter for Automotive – Car Noise Emission Inspection
HD2010MCTC
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The level of noise produced by vehicles shall comply with standards prescribed by international regulations. During car inspections, horns and exhaust devices must be in good condition and comply with the requirements.
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Backplane Profiling & Inspection System
603d
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A major problem in the backplane industry is detecting bent connector pin defects. The most difficult being when the pin bends underneath the shroud rather than going into the hole. Many times this defect cannot be detected electrically as the connector pin is touching the conductive annular ring of the hole, allowing electrical test to pass. Unfortunately, it is an intermittent connection and will fail later on as there is not an actual mechanical connection.
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Wafer Level Multi-Die Test System
ITC55WLMD
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The ITC55WLMD series of test systems has been developed by ITC to be stand-alone UIL test systems configured specifically to test on wafer. The systems include an ITC55series UIL tester and inductor box, a current limiter module and a system controller
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Automated Inspection Systems
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Our systems utilize phased array and eddy current array to inspect the full volume and surface of various products and profiles in many manufacturing industries, such as metal, aerospace, transportation, power generation, and oil & gas.
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In-Line X-ray Inspection System for Secondary battery
X-eye 9000 Series
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X-ray Tube100 kV / 200 µAMin. Resolution5 µmInspection Ability120ppm , 150ppm, 180ppmSystemConveyor / Index / Pick&Place 방식 LoadingDimension1,800(W) x 1,560(D) x 2,070(H)mm / 5,000kg
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Wafer Probe Test System
STI3000
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The STI3000 is a wafer-level MEMS and mixed signal ASIC probe test system that combines several functional STI test equipment blocks for testing gyros, accelerometers, pressure sensors, microphones, resonators, and mixed signal ASICs.
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Automated CMM Calibrated for High-Production Shop Floor Inspection
CMM Master
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The CMM Master provides process control by delivering optimal price and performance to your application. The system brings highly repeatable, thermally insensitive, versatile, and programmable inspection to the shop floor.
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X-Ray Inspection System
MXI Quadra 5
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Quadra™ 5 is the X-ray inspection system of choice for sub micron applications such as PCB and semiconductor package inspection, counterfeit component screening and finished goods quality control.
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Step & Repeat Non-Contact Inspection System for FPC and PCB
OHT-Ⅴ
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*Space-saving design and highly efficient and high-speed inspection, with top and bottom slider structure*Roller head enables to handle the reverse imposition.*Easy operation by new alignment mechanism*The machine handlingPCB is called "WSR"
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Conformal Coating Inspection (CI AOI)
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They cover the components, the area around the components and identify most coating issues including cracks, bubbles, insufficient / excess coating, loss of adhesion and other common contaminations. Full coverage inspection for conformal coating.
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X-ray and CT Inspection Systems
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YXLON X-ray and CT systems come in many different configurations. We've developed a Product Finder to help narrow your search for the system that best meets your needs. Can't find what you're looking for? Our specialists will customize a system to your exact specifications. Contact us today for more information.
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Magnetic Particle Inspection(MPI)
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Magnetic particle inspection is an inspection method used to identify defects on the surface of ferromagnetic materials by running a magnetic current through it.
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X-ray Inspection System
RTX-113HV
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Precision X-ray Inspection for BGAs, QFNs, LEDs, sensors, medical devices, and other packaged devices.
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NUV-PL SiC Defect Inspection System
VS6845E
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Industrial Vision Technology Pte Ltd.
Comply with IEC63068-3 Standard: Test method for defects using photoluminescence, Model VS-6845 SiC Wafer defect inspection system has capability on Non-destructive recognition criteria of defects in silicon carbide homoepitaxial wafer for power devices.
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Pulsed DC Holiday Detector Inspection Kit
280
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The Elcometer 280 Pulsed DC Holiday Detector is a ‘stick type’ holiday detector that has been designed to make pulsed DC high voltage holiday detection safer, easier and more reliable than ever before.
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The Complete Solution for Optical Surface Quality Inspection
OptiLux SD (Scratch-Dig)
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RedLux’s OptiLux SD system provides the complete solution for control of optical surface quality (scratch-dig) by offering a breakthrough in measurement performance along with conformity to industry standards. Designed with flexibility in mind and further enhanced by a range of customer inspired features, the OptiLux SD can support the most demanding of optical surface quality inspection processes, from highly customized optical components in low volume, to standard components in high volume.
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Wafer Level Test
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Double sided wafer inspection system is an automatic inspection system for afterdicing wafer chip. It can do double side inspection simultaneously. The appearance defects of wafer chip are clearly conspicuous by using advanced illumination technology. Illumination and camera acquisition mode can be adjusted for various wafer process, like vertical chip or flip chip.
