Wafer Inspection
Inspection of integrated circuits in wafer form for contaminants, flatness, size, and roughness.
See Also: Wafer, Wafer Thickness, Wafer Failure Analysis, Wafer Edge, Wafer Resistivity, Wafer Mapping, Wafer Probes, Wafer Probers, Wafer Handlers
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Pipe & Duct Inspection Cameras
Pipe & Duct Inspection Camera are video inspection cameras with a probe long enough (roughly 70 ft.) to locate and identify an obstruction in a water or sewer line or HVAC duct by taking close-up video clips and photos of it. The P16PIP probe (also available separately) that comes with the DPS16 Pipe & Duct Inspection Camera has better camera lighting and optics and slightly better resistance to water than the P610-20PR probe that attaches to a recording or non-recording wet/dry inspection camera console.
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Inline Wafer Testing
IL-800
Pre-process elimination of low-quality wafers using measured lifetime, trapping, and resistivity. Process control and optimization at dopant diffusion and nitride deposition steps.
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Wafer Flatness Measurement System
FLA-200
*Measures Thickness, TTV, Bow, Warp and site and global Flatness (ASTM compliance)*Measures all materials including Si, GaAs, Ge, InP, SiC*Full 500 micron thickness measurement range without re-*calibration2-D /3-D Mapping software
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Automated Optical Inspection (AOI)
TR7700 SIII 3D
TRI’s ground breaking 3D AOI solution delivers the fastest hybrid PCB inspection combining optical and blue-laser-based true 3D profile measurement for the highest automated defect symptom coverage possible. Integrated state-of-the-art software solution and third generation intelligent hardware platform offer stable and robust 3D solder and component defect inspection and with high inspection coverage and easy programming.
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X-ray Inspection System
JewelBox-90T/100T/110T™
All JewelBoxes deliver precision x-ray images of ultra-high resolution and grey scale accuracy without the aberrations of voltage blooming and image distortion prevalent in other systems.
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Production Wafer Level Burn-in
TV19 VersaTile™ probe cards are designed with Celadon’s patented ceramic technology for superior electrical performance, yet is highly modular due to it’s 28mm x 28mm chassis. Micro-adjustments can be made in seconds with an allen wrench and a microscope. Easily align VersaTile cards for different wafer layouts using a 4.5” compatible 1×3 , 200mm, or 300mm VersAdjust plate.
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Digital Inspection Kits
Ideal for ‘paperless’ quality assurance systems the kits come complete with ElcoMaster® Data Management Software for professional reporting and analysis.
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First Article Inspection Machine
Optima III FAI
Landrex Technologies Co., Ltd.
First Article Inspection Machine
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Thickness and Flaw Inspection
NORTEC 600
Olympus converges its latest advancements in high-performance digital circuitry and eddy current flaw detection into one compact and durable portable unit—the new NORTEC® 600. With its crisp and vivid 5.7 inch VGA display and true full-screen mode, the NORTEC 600 is capable of producing highly visible and contrasting eddy current signals in any lighting condition.
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Non-Destructive Inspection Equipment
Non-destructive inspection means that various materials such as metal are "without damaging the object, knowing the presence or absence of scratches on the surface or inside and the degree of scratches, and passing the object against standards such as standards.
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Solder Paste Inspection System
KY8030-3
The new KY8030-3 delivers 3x fasterinspection without compromisingperformance and accuracy.Using patented dual projection,the system eliminates the criticalShadow problem that all 3D SPI systemscan be vulnerable to.Additionally, the new KY8030-3 has solvedthe PCB Warp problem that seriouslyimpacts inspection accuracyand reliability of result.
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Fiber Optic Inspection Microscope
80761
The Miller 400x Microscope helps inspect fiber optic connectors quickly and easily. Its ergonomic design and built-in features make it ideal for field and lab use. The microscope features a pressure-activated on/off switch, focusing wheel, eyepiece, auxiliary white LED light source rated for 100,000 hours, adapter tip for inserting ferrule and battery compartment. Includes 2.5mm universal adapter cap and zipper case.
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X5 Pack X-Ray Inspection
Designed to be integrated into line with built-in automatic reject and available in 300, 500 and 600 mm belt width models, the X5 Pack is perfect for a variety of unpackaged and packaged products.
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Sensor for Filament Inspection
EyeFI
EVT presents the EyeFI - the sensor for the inspection of filaments. The sensor contains two cameras with an Aptina sensor and S-Mount lenses. The cameras are perpendicular to each other. It is therefore possible to inspect two sides of the filament, which means that the EyeFI can detect if the filament is out-of-roundness. Additionally the errors and defects can be detected. For example the occurring flaws are point-shaped or partly flaked, or point-shaped and transverse, or also looking like a longitudial rib, or only spots in different shapes. The defects can be detected with the EyeFI sensor. The EyeFI contains board cameras with sensors from Aptina, the IoCap and an evaluation processor. The housing is about 14x10x4 cm in size. The IoCap is the image-capture-IO-board, which is designed and developped by EVT.
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Wafer Sorter and Inspection
SolarWIS Platform
Eliminating the opportunity for problematic wafers to enter cell manufacturing lines greatly improves output and yield. ASM AE’s wafer sorter features 3D area inspection capability to inspect wafer thickness, total thickness variation (TTV), saw marks, as well as wafer bow and warpage. SolarWIS also includes modules that can inspect for stain, geometry, micro-cracks, edge chips, resistivity, P or N conductivity and lifetime.
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Dimensional Inspection (3D Inspection)
The 3D measurement data from our scanners and PCMMs offers a comprehensive definition of a physical object that is used for measurement, inspection, comparison and reporting. When a part is defined by millions of points, you can see subtle deviations, slight variations and fine details, which gives you the confidence that a part (or mold) meets your specifications. To deliver the best of both worlds, we combine 3D scanning with our contact, touch-probe measurement tools to deliver precise dimensions on geometric shapes.
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Automatic Flight Inspection System
AT-930DG
Fully Automatic OperationAll-Weather CapabilityDifferential GPS Position ReferenceHigh Accuracy and Maximum ReliabilityWindows User Interface SoftwareEasy to Operate and Easy to LearnMinimum Maintenance RequirementsModular System ArchitectureLong-Term Supportability
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Deep Packet Inspection
FlowPro
FlowPro is inserted into areas of the network when visibility is needed. It uses a deep packet inspection (DPI) to compile a flow cache, and exports traffic and threat details reflecting 100% of all communications that pass by. FlowPro is a great complement to the Scrutinizer Incident Response System and ensures the security team has insight where they need it.
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Specialist Inline Inspection
NDT Global treats each pipeline individually from the offset. Before a project even begins, a feasibility study of the pipeline detail is conducted by NDT Global, to determine the appropriate tool and required modifications to complete the inspection. NDT Global has an extensive engineering capability in this regard and has a proven track record in providing tailored solutions to deal with a wide variety of pipeline characteristics.
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Entry-level X-ray Inspection System
X-eye 5100 Series
100kV ~ 130kV Micro-focus Closed tube and high-definition Flat Panel Detector are installed and high-resolution image can be gained.Customer convenience is primarily considered in operation and maintenance of the product.Customization is available because it is specially designed to be add up any necessary functions depends on customer needs with reasonable prices.
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Over-Line Vision Inspection System
Over-Line vision inspection systems utilize a compact sensor head mounted directly over an existing production line to scan every object that passes underneath, in any orientation and at any belt speed, in order to generate a continuous stream of critical QA data, such as size, shape and color attributes, and production metrics such as throughput, uptime and capacity.
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Inspection of Glue Dot Assembly
ScanINSPECT's ADI
ScanINSPECT provides a simple and user-friendly alternative to inaccurate and time-consuming manual inspection methods or expensive, high-end AOI systems. ScanINSPECT uses a simple Windows user interface integrated with an automatic table and image-processing unit. This combination allows 100% inspection of adhesive placement on PCBs after dispensing.
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Chip Inspection System
GEN3000T
GEN3000T is an inspection system that performs automatic inspection of individual semiconductor chips.This revolutionary chip surface inspection system was achieved by combining the chip handling technology cultivated by Toray with the inspection algorithm used in the "INSPECTRA®" wafer defect inspection system.
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Automatic Flight Inspection Systems
AT-940
The AT-940 is a mobile and deployable flight inspection system providing high performance in the smallest possible package.
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Substrate Inspection Apparatus
The test system of the printed circuit board (mounting board) called the flying probe tester developed ahead of the world received high evaluation at the electronics manufacturing factory around the world, securing the top share of the industry and "Takaya of the board tester" We have established a firm position that.
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X-ray Inspection System
NEO-690Z / NEO-890Z
Off-line Microfocus X-ray Inspection System equipped with PONY ORIGINAL Direct Conversion X-ray Camera; SID-A50. Suitable for inspection of BGA, CSP, and LGA on PCB.
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For Real-Time X-ray Inspection Systems
Image Processors
A number of image processing software packages are available. Features include frame averaging, measurement, text, label, marking, 3-D rendering, video recording and image storage. Additionally, BGA analysis and void measurement software can be added as well as other options. See our image processors for x-ray inspection machines below.
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Terahertz Imager for Material Inspection
T-SENSE FMI
This highly efficient technology is based on the most recent research results. Production can be monitored and controlled at various levels. T-SENSE FMI uses millimeter waves in the lower terahertz range with no health risks involved. This means that the equipment can be used anywhere and for several purposes without the need for radiation protection.
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Wafer Prober
Precio octo
200mm wafer prober. The system adapts ultra-high speed indexing and high-speed wafer exchange functions to reduce test cost and improve overall equipment effectiveness (OEE) markedly enhancing productivity.
