3-D Solder Paste Inspection
checks form, height, surface area, bridges, volume, x/y offset and coplanarity of solder.
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Product
Testing And Inspection Devices
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HEIDENHAIN offers testing and inspection devices that deliver all setup, monitoring, and diagnostic data needed for the analysis of its encoders. Grid encoders from HEIDENHAIN are ideal for machine tool inspection and acceptance testing, accurately measuring CNC machine tool movements in both static and dynamic inspection.
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Product
Open eVision 3D Studio
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Ease the configuration and the setup of a laser triangulation scanner using the Coaxlink Quad 3D-LLESimplify the calibration procedureDisplay interactive Depth Maps, 3D Point Clouds and ZmapsFree of charge
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Product
Solder Wettability Tester
5200TN
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Amid the rapid progress in miniaturization of electronic components in high-density mounting, a long-established company that has been manufacturing solder wettability testers for about 40 years has developed a solder wettability tester compatible with the latest micro electronic components. and is the top model in the history of solder checkers with improved operability. * Wetting stress is proportional to the circumference of
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Product
Desktop 3D Scanners
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Automated 3D Scanning for small to medium sized parts. Desktop scanners offer a more compact solution with great accuracy.
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Product
Soldering Test
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The soldering tests are conducted to determine if materials can withstand soldering effects, such as resistance to soldering heat, as well as the solderability of components during the manufacturing process.
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Product
eviXscan 3D Suite 2.0
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eviXscan 3D Suite 2.0 is a comprehensive software platform that delivers the most powerful and user-friendly tools for scanning and mesh processing within straightforward workflow.With eviXscan 3D Suite 2.0 the scanning process is more easy to use and faster than ever before.The clear workflow will guide the user in all scanning steps from basic configuration to the final mesh processing and will enable to achieve significant productivity gain in work with eviXscan 3D products.
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Macro Inspection
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High-throughput automated macro inspectionAny wafer size, in less than one second with ~75 micron resolutionSmall footprint table-top system
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Product
68-Pin Micro-D Male Solder Bucket
40-962A-068-SB-M
SCSI Male Connector
This connector is designed to allow users to directly terminate with soldered connections to the 68-Pin SCSI Style Micro D connector. Pickering Interfaces recommends the use of purchased cable assemblies for applications where most or all of the contacts are in use.
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Product
3D Profile Sensor
Z-Trak2
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Z-Trak™2 is a new family of 3D profile sensors built on Teledyne Imaging’s 3D image sensor technology, ushering in a new era of 5GigE 3D profile sensors for high-speed, in-line 3D applications.
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Baggage and Parcel Inspection
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Inspection of bags and parcels has to be effective, efficient, and meet the toughest regulatory requirements. Rapiscan® Systems products deliver on both levels.
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Product
Wafer & Die Inspection
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SemiProbe wafer inspection system (WIS) examines, locates and identifies defects created during wafer manufacturing, probing, bumping, dicing or general handling. This provides microelectronic device manufacturers with accurate, timely quality assurance and process information. The WIS has single sided and double sided wafer mapping capabilities and can improve efficiency, reduce manufacturing costs, increase yields and shorten time to market.
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Product
Silicon Inspection System
NIR-01
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The NIR-01 imaging system is made of CNC engineered Aluminium alloy. The suruface protection is powder painting and electrolitic oxidation on pure aluminium surfaces. The frame of the system is a high quality industrial design. All components are designed for long term heavy usage with minimal maintenance needs. Electrical components are also selected for stability and durability. The block like electronics gives the advantage of easy and quick repair.
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Product
X-Ray Inspection System
TruView™ Fusion
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The quality of your products is paramount to the success of your business. The TruView™ Fusion X-ray Inspection System allows you to "see inside" your products without destroying them, enabling unprecedented understanding of your manufacturing process. The TruView™ Fusion X-ray is the right solution if you are looking for a radiography system to inspect medical devices, printed circuit boards, electronic components, and mechanical parts.
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Product
Academic Suite of 3D Measurement Solutions
Creaform ACADEMIA™
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Provides a complete and collaborative skill-nurturing academic solution. The suite let’s you choose from our full line of 3D scanners and portable CMM, free application software, complimentary add-ons as well as useful tools tailored to get you started with industrial 3D measurement solutions.
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Product
Inspection Microscope
Z-NIR
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The McBain Z-NIR Near Infrared Inspection System is best-in-class for wafer-to-wafer and die-to-die alignment measurement and verification. This unique tool has been sold into many industries with various applications including sub-surface wafer and die inspection for cracks and bond integrity, MEMS, wafer bonding, 3-D chip stacking, failure analysis, process development, tool verification, part characterization, environmental testing and more.
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High-Resolution 3D Seismic Solution
PIKSEL
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PIKSEL is an integrated and compact solution that enables high-resolution seismic data acquisition in targeted areas for offshore construction and field development.
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Inspection & Metrology Platform
Neon
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Neon is Cohu’s next generation inspection platform optimized for small, fragile semiconductors used in automotive, consumer, industrial and medical, and mobility applications.
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Product
Concrete Inspection System
StructureScan Pro
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Geophysical Survey Systems, Inc.
StructureScan Pro is a versatile concrete inspection system offering a wide variety of antenna options for concrete and other applications. Based on the SIR 4000 controller, the StructureScan Pro provides the GPR professional with solutions to any scanning situation.
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X-ray Inspection System
NEO-690Z / NEO-890Z
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Off-line Microfocus X-ray Inspection System equipped with PONY ORIGINAL Direct Conversion X-ray Camera; SID-A50. Suitable for inspection of BGA, CSP, and LGA on PCB.
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3D Optical Profiler
7503
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Chroma 7503 uses the technology of white light interfaces to measure and analyze the surface profile of micro-nano structures with sophisticated scanning system and innovative algorithms.
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Product
37-Pin D-Type Female Solder Bucket
92-960-037-F
D-Sub Female Connector
Accessory allows a user to create their own PCB based termination solution mounted directly on the front of the product or on the end of a cable. Interfacing PCBs should be designed with suitable clearances for the voltage the application requires. 37-Pin Female connectors can be directly mated to a corresponding Pickering Switching Module while Male versions can be used to interface to a Female cable assembly termination.
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Product
Conformal Coating Inspection System
TROI 8800 CI
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The PEMTRON CI Series addresses the limitations of the area of theinspection due to the diversity of wavelengths of the existing UV,and performs a clearly separated area of coating onvarious wavelengths.
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GPR System for Concrete Inspection
StructureScan™ Mini
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Geophysical Survey Systems, Inc.
The StructureScan Mini safely locates metallic and non-metallic targets within concrete structures up to a depth of 20 inches. The system incorporates an auto target feature that marks the detection of features of interest. This function also estimates the depth of targets and automatically adjusts the depth scale.
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Product
3D Sound Intensity Analysis Software
DS-0225A
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Finding out the position where the noise is occurring, and grasping the state of acoustic propagation are important ways to find effective noise countermeasure or improvement of acoustic environment.
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Product
Wafer Sorter and Inspection
SolarWIS Platform
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Eliminating the opportunity for problematic wafers to enter cell manufacturing lines greatly improves output and yield. ASM AE’s wafer sorter features 3D area inspection capability to inspect wafer thickness, total thickness variation (TTV), saw marks, as well as wafer bow and warpage. SolarWIS also includes modules that can inspect for stain, geometry, micro-cracks, edge chips, resistivity, P or N conductivity and lifetime.
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Wafer Internal Inspection System
INSPECTRA® IR Series
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An infrared internal defect inspection system has been added to the INSPECTRA® series.It is now possible to inspection with both infrared and visual light in one system.
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Product
3D Helmet Coil
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With the 3D Helmholtz coil system, 3-dimensional magnetic field vectors can be generated. By superimposition, it is possible to create a field-free space or an artificial earth magnetic field vector inside the coil arrangement. The coil arrangement was developed for the calibration of magnetic field sensors.
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Product
25-Pin D-Type Female Solder Bucket
92-960-025-F
D-Sub Female Connector
This accessory is designed to allow users to directly terminate a cable with soldered connections to the connector. When the product is used without a backshell users should make their own cable strain relief arrangements and ensure appropriate electrical precautions are observed.
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Product
9-Pin D-Type Male, Solder Bucket, HV
40-960-009-M-HV
D-Sub Male Connector
9-Pin Male D-Type Connector, High Voltage, Solder Bucket - With Backshell
