Semi-conductor
active or passive elements connected as an electronic circuit using a crystalline subtance, eg. silicon or germanium.
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Semiconductor Test Software
Easily create and run robust test programs in semiconductor automated test systems with ActivATE™ test management software. Designed by test engineers for test engineers, ActivATE™ tames automated test complexities with elegant simplicity.
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Automated Discrete Semiconductor Tester (ATE)
5300HX
The Model 5300HX Automated Discrete Semiconductor Tester (ATE) is designed for fast, reliable testing of a wide range of discrete devices. Using an on-board Intel SBC, can provide stand alone testing capability or connected to a PC for intuitive test development and data capture.
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RF/MW Generators
Daihen Advanced Component, Inc.
Technical innovations such as miniaturization and three-dimensional applications are continuously happening in the field of semiconductors for making them more compact and packing more functionalities in them. “AVANCER” is a highly reliable (RF)power generator(s) brand equipped with various functions required by the next generation of semiconductor manufacturing processes, such as pulsed RF output and power saving. With proven technology and reliability, it contributes to the future of the ever evolving semiconductor industry.
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PXI 8x SPST High Voltage Reed Relays
40-310-001
The 40-310/320 range of high voltage switching modules will hot switch up to 750V peak and cold switch up to 1000V peak in either general purpose relay (40-310) or multiplexer (40-320) configurations. These modules contain high-quality reed relays with switching ratings comfortably higher than the 40-310/320 specification. Applications include; circuit board isolation testing, relay testing, semiconductor breakdown monitoring and cable harness insulation testing.
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Edge Grinding Machines
The requirement for the wafer quality is getting higher and the condition of wafer edge is getting more important. The edge grinders “W-GM series” process edge grinding of various kind of materials such as Silicon, sapphire and SiC.As a solution for that, Our W-GM series are highly rated among manufactures of silicon, compound materials and other wafer shaped materials. Wafer edge grinding machine also draws the attention as a solution for the yield loss due to the knife edge of device wafer in the back end process. In the semiconductor manufacturing process, from the wafer manufacturing to the device manufacturing, the quality improvement of wafer edge is necessary in recent years.We make proposals that achieve the improvement of quality, CoO and yield with our machine.
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Compact Fan Type Ionizers
ER-Q Series
Panasonic Industrial Devices Sales Company of America
With Panasonic’s high-frequency AC method and “Sirocco Fan”, the ER-Q Compact Fan Type Ionizer can remove electrostatic charge even at slow fan speeds.ER-Q Ionizers are extremely compact and well suited for removing localized electrostatic charge on manufacturing equipment for electronics or in Semiconductor processes. The ER-Q Ionizers require no compressed air which eliminates air lines and reduces additional maintenance.
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PXI Switched Guard Reed Relay Module, 26x SPST
40-121-001
The 40-121-001 provides 26x SPST switches in a single slot PXI module and designed to provide an isolation resistance in excess of 1013Ω. It has been designed to ensure high isolation resistance through the use of switched guards, making it ideal for low level measurements and semiconductor test.
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Electronic Components
We supply a wide range of components and materials to the electronics industry, such as: integrated circuits for personal computers, semiconductor materials for system LSI, optical communication materials for telecommunications, components for display devices seen in smartphones and projectors, and materials used in solar cells and lithium batteries.
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PXI-5670, 2.7 GHz PXI Vector Signal Generator
778768-02
2.7 GHz PXI Vector Signal Generator—The PXI‑5670 has the power and flexibility you need for product development applications from design through manufacturing. It can generate custom and standard modulation formats such as AM, FM, PM, ASK, FSK, PSK, MSK, and QAM. The PXI‑5670 delivers a highly flexible and powerful solution for scientific research, consumer electronics, communications, aerospace/defense, and semiconductor test applications as well as for emerging areas including software defined radio, radio frequency identification (RFID), and wireless sensor networks.
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Non-Contact Chemical Concentration Monitor
CS-900
In order to fulfil the tight chemical concentration control required in semiconductor WET process, HORIBA realizes higher functionality to meet the needs by designing compact equipment while maintaining stable measurement and carrying out operator safety through its original sensor design.
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Sheet Resistance Measurement
The Filmetrics® R54-series and R50-series sheet resistance measurement instruments have been developed based on over 45 years of KLA sheet resistance measurement innovation. The R50 measures metal layer thickness, sheet resistance and sheet conductance. The R54-series adds a light-tight enclosure, along with 300mm support, to provide metal thickness measurement solutions for semiconductor and compound semiconductor manufacturing.
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5.0 MP Camera For Rockchip RK3399
E-CAM50_CU96
e-CAM50_CU96 is a 5MP Fixed focus MIPI camera for 96Boards compliant Rock960 developer kit featuring Rockchip RK3399 processor. This 4-lane MIPI Camera for Rock960 board is based on our popular low-light camera module, e-CAM55_CUMI0521_MOD which has 1/2.5" AR0521 CMOS Image sensor from ON Semiconductor® and a built-in Image Signal Processor (ISP). It has S-mount (M12) lens holder which allows customers to choose and use the lens according to their requirement.
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Dissolved Ozone Analyzer
Model 470
Teledyne Advanced Pollution Instrumentation
The Model 470 is a state-of-the-art Dissolved Ozone Sensor designed for semiconductor Wet Bench tools and many other industrial processes. It provides continuous measurement of dissolved ozone in deionized water or sulfuric baths with concentrations up to 150 mg/L. The Model 470 is “clean-ready” for high purity semiconductor processes, and is designed to be simply spliced in-line in the recirculation loop of any wet bench tool with flow rates up to 150 SLPM.
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Semiconductors
Multiphysics Analysis Solutions for Chips and 3D IC Systems. Ansys cloud-native solutions provide unparalleled capacity to speed up completion times for even the largest finFET integrated circuits (IC) and 3D/2.5D multi-die systems. These powerful multiphysics analysis and verification tools reduce power consumption, improve performance and reliability, and lower project risk with foundry-certified golden signoff verification.
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Customized Semiconductor Wafer Inspection, Sorting & Metrology Equipment | Systems
Customized Solutions
Unique Needs? Need better wafer inspection throughput, accuracy, versatility? Need a wafer defect inspection expert who’s not a sales person? We’ve been providing complete semiconductor wafer inspection, sorter, and microscopes solutions to semiconductor wafer manufacturers since 1994.
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Analysis
External appearance due to non-destructive semiconductor · X-ray fluoroscopic observation, SAT observation, electrical operation confirmation, ESD fracture analysis, plastic opening observation of Chip, search for abnormal portions by EMS / OBIRCH, package (PKG) analysis, Please do not hesitate to contact us anything related to semiconductor analysis, such as observation by polishing / parallel polishing (ball and bump observation etc.), peeling observation of defective part, analysis of foreign matter by EDX · FT - IR etc.
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ANSI X3.28 to Modbus RTU Converter
Model 2399
* Converts ANSI X3.28 commandslinto Modbus RTU packets.* New 32 Address Mode supports multi-channel Modbus Controllers like the Watlow MLS300.* Control Modbus RTU devices from any ASCII serial source.* Serial ports support RS-232 and 2-wire/4-wire RS-485 signals.* Includes serial baud rate conversion.* Internal logic is IEEE-488.2 compatible and uses SCPI commands for configurtion setup.* 2399 mounts on a DIN rail or on any flat panel.* Inexpensive way to maintain manufacturing equipment such as semiconductor fusion chambers, etc as the ANSI Controllers become obsolete.* Application Note AB23-3 describes how to use the 2399 to replace obsolete Watlow Controllers in the Axcelis/Fusion Gemini Asher.* 2399 Serial Keyboard Program lets you control and setup the 2399 and test the ANSI modes.* 239x Table Loader Program uploads ANSI Command Table entries from an Excel csv file.
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Baratron® Isolation Systems
These Isolation Systems are designed to automatically maintain a heated Baratron® capacitance manometer at vacuum throughout a process cycle. Maintaining a heated Baratron® capacitance manometer at vacuum is one of the most important ways to optimize its accuracy and repeatability in production systems, making this product especially well-suited for fast-cycling industrial and semiconductor manufacturing processes.
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Wide Temperature Range HDR USB3.1 Gen1 Camera Board (Color)
See3CAM_CU20
See3CAM_CU20 is a 2.0 MP HDR USB camera board with ultra-Lowlight performance. It has an ability to stream seamlessly at wide temperature range (-40°C to 85°C). This Full HD USB3.1 Gen1(5Gb/Sec.) camera is based on 1/2.7" AR0230AT CMOS digital image sensor with a pixel size of 3.0 μm x 3.0 μm from ON Semiconductor™. It has S-mount (M12) lens holder which allows customers to choose and use the lens according to their requirement. It is a Plug-and-Play camera (UVC compliant) for Windows, Linux. This HDR camera is also backward compatible with USB 2.0 host ports.
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Distributed-Feedback Laser
DFB pro
Distributed feedback (DFB) lasers unite wide tunability and high output power. The frequency-selective element a Bragg grating is integrated into the active section of the semiconductor and ensures continuous single-frequency operation. Due to the absence of alignment-sensitive components, DFB lasers exhibit an exceptional stability and reliability. The lasers work under the most adverse environmental conditions even in the Arctic or in airborne experiments.
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Biased and Unbiased HAST Testing
Considered within the semiconductor industry as the fast and effective alternative to Temperature Humidity Bias testing (THB), Highly-Accelerated Temperature and Humidity Stress Test (HAST) is a critical part of the device package Qualification process and is used to evaluate the reliability of non-hermetic packaged devices in humid environments.
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High Flexibility VNA Cables
Our lines of high frequency VNA test cables display excellent electrical properties such as wonderful phase stability of +/- 6° at 50 GHz and +/- 8° at 67 GHz as well as VSWR of 1.3:1 at 50 GHz and 1.4:1 at 67 GHz. The 50 GHz assemblies are terminated with 2.4mm connectors while the 67 GHz versions utilize 1.85mm connectors. The braided stainless steel armoring surrounding the coax provides a rugged, but flexible cable with a flex life exceeding 100,000 cycles, making these test cables ideal for use in semiconductor probe testing, precise bench top testing as well as lab/production testing where the need for a highly flexible, yet durable cable solution is required. The VNA test cables are also equipped with rugged stainless steel connectors that provide up to 5,000 mating cycles when attached with proper care. Additionally, the flexibility of these cables makes it easier and safer to test a Device Under Test (DUT). A swept right angle 2.4mm and 1.855mm connector option allows these cables to fit in tight spaces and can reduce the length of cable required in many applications.
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UV Meters
OAI’s UV Measurement Instrumentation are the standard for Semiconductor Lithography, MEMS, Sensors, Microfluidics, UV Curing, 3-D Printing, Sterilization, Water Purification and Solar/PVC industries. For over 45 years our meters have earned a reputation for accuracy, repeatability and dependability. We offer full calibration and support services worldwide.
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Wafer Chucks
ARC, in addition to fabricating Wafer Chucks from aluminum, is also known for its ability to work in hard to machine materials such as hardened (50-62 Rockwell) metal alloys, fired ceramics, e.g. SiC and glasses. These materials are often ideal for semiconductor equipment applications due to their ability to hold critical dimensions and tolerances. ARC specializes in surface grinding and lapping these materials to precision flatness and parallelism specifications needed for semiconductor wafer chuck requirements.
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Silicon & Compound Wafers
Compound semiconductors are undergoing a major expansion addressing many new applications and using various materials such as SiC, GaN, GaAs and others, to improve the performance of new devices in several segments such as Power and Face Recognition.
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Semiconductor Manufacturing Optics
No lithography without optics. No semiconductors without lithography. Without semiconductors there would be no microchips, without microchips no computers – no high-tech products. As an OEM (Original Equipment Manufacturer) supplier, ZEISS enables the semiconductor industry worldwide with optics and other optical modules.
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Test System
ITC57300
The ITC57300 Dynamic Parametric Test System mainframe accepts Test Heads that perform nondestructive transient measurements on semiconductor devices such as Insulated Gate Bipolar Transistors (IGBT), power MOSFETs, diodes, and other bipolar devices(requires additional optional bias power supplies and custom personality boards). Included in the mainframe are all test equipment and software necessary to analyze and perform resistive and inductive switching time, switching losses, gate charge, Trr/Qrr, and other transient tests.
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Wafer Tester
Tokyo Electronics Trading Co., Ltd.
A vital step in the Semiconductor Value Stream, focusing on electrical screening and consumption of Known Good Die (KGD).
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Semiconductor Solutions
Bruker's suite of technologies for semiconductor manufacturing address critical metrology and process needs across the broadest range of applications from R&D to process improvement. 75% of the world's top 25 semiconductor manufacturers rely on Bruker metrology tools for front-end and back-end applications, including development of their next-generation products.
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Probe Card
Japan Electronic Materials Corp.
The probe card is a tool for testing semiconductors used at "Wafer Test" to check quality of IC or LSI in the first process of semiconductor manufacturing. The probe card is expendable.
